METHOD FOR PRODUCING A PRIMARY MATERIAL FOR A CUTTING TOOL
20170282266 · 2017-10-05
Assignee
Inventors
Cpc classification
B23K26/0619
PERFORMING OPERATIONS; TRANSPORTING
B23D65/00
PERFORMING OPERATIONS; TRANSPORTING
B23K31/025
PERFORMING OPERATIONS; TRANSPORTING
International classification
B23D65/00
PERFORMING OPERATIONS; TRANSPORTING
B23K26/06
PERFORMING OPERATIONS; TRANSPORTING
B23K31/02
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method for producing a primary material for a cutting tool, for example a primary material for a saw blade or a saw band, in which a band-shaped carrier of a metal carrier material and a wire of high-speed steel are continuously brought together along a lateral edge of the band-shaped carrier and transported into a welding device and the band-shaped carrier is welded to the wire along the lateral edge of the carrier to produce a bimetal band. The band-shaped carrier and the edge wire are welded to one another by at least a first welding device, which is arranged on one side of the band-shaped carrier, and at least a second welding device, which is arranged on the opposite side of the band-shaped carrier.
Claims
1-10. (canceled)
11. A method for producing a primary material for a cutting tool, or a primary material for a saw blade or a saw band, comprising: bringing together continuously a band-shaped carrier of a metal carrier material and an edge wire of a high-speed steel along a lateral edge of the band-shaped carrier; transporting the brought together band-shaped carrier and the edge wire into a welding device; welding the band-shaped carrier to the edge wire along the lateral edge of the carrier to produce a bimetal band, wherein the band-shaped carrier and the edge wire are welded to one another by at least a first laser welding device arranged on one side of the band-shaped carrier, and at least a second laser welding device arranged on the opposite side of the band-shaped carrier.
12. The method as claimed in claim 11, wherein the first welding device and the second welding device are offset with respect to one another in a transporting direction of the band-shaped carrier.
13. The method as claimed in claim 11, wherein power of the welding devices is controllable in an open-loop or closed-loop manner.
14. The method as claimed in claim 13, wherein angular distortion and a weld seam elevation of the welded assembly including the band-shaped carrier and the edge wire are recorded and the power of the first and second welding devices lying opposite one another is configured such that angular distortion and weld seam elevation are minimized.
15. The method as claimed in claim 11, wherein a weld seam created between the carrier and the edge wire is not machined before a possible dressing of the bimetal band.
16. The method as claimed in claim 15, wherein the bimetal band is not dressed.
17. A saw blade or saw band, wherein the saw blade or saw band comprises a primary material produced by a method as claimed in claim 11.
18. The saw blade or saw band as claimed in claim 17, wherein the carrier material has the following composition (figures given in % by weight): TABLE-US-00003 carbon (C) 0.2 to 1.5 silicon (Si) up to 2.0 manganese (Mn) up to 2.0 chromium (Cr) up to 7.0 molybdenum (Mo) up to 3.0 nickel (Ni) up to 1.5 vanadium (V) up to 0.6 tungsten (W) up to 5.0 iron (Fe) and smelting-induced accompanying elements and impurities as the remainder.
19. The saw blade or saw band as claimed in claim 17, wherein the high-speed steel has the following composition (figures given in % by weight): TABLE-US-00004 carbon (C) 0.5 to 2.5 silicon (Si) up to 1.5 manganese (Mn) up to 0.8 chromium (Cr) 2 to 6.0 molybdenum (Mo) up to 11.0 vanadium (V) up to 10.0 tungsten (W) up to 20.0 cobalt (Co) up to 15.0 iron (Fe) and smelting-induced accompanying elements and impurities as the remainder; the proportion of the elements Si+V+Mo+W/2 being >5% by weight.
Description
[0033] The invention is explained in more detail below with reference to an exemplary embodiment that is represented in the accompanying drawing, in which:
[0034]
[0035]
[0036]
[0037] In
[0038] Arranged above the upper side 14 of the band-shaped carrier is a first laser welding device 15 and arranged underneath the underside 16 of the band-shaped carrier is a second laser welding device 17. The sheet-like carrier 10 and the HSS wire 13 are transported through under the laser welding devices 15 and 17 in the direction indicated by the arrow 18. A welded connection 19 is produced between the sheet-like carrier 10 and the HSS wire 13.
[0039]
[0040] By contrast with this, in