Control Unit Device For A Motor Vehicle And Method For Manufacturing Such A Device

Abstract

A control unit device for a motor vehicle includes a circuit board, on which a plurality of electronic components are disposed. The electronic components are electrically coupled to one another by conductor tracks on the circuit board. A substantially gas-impermeable cover is materially joined or bonded to the circuit board in such a way that the cover, together with the circuit board, forms a closed cavity in which the electronic components and the associated conductor tracks are located. A method for producing the control unit device is also provided.

Claims

1-16. (canceled)

17. A control unit device for a motor vehicle, the control unit device comprising: a circuit board having conductor tracks; a plurality of electronic components disposed on said circuit board, said electronic components being electrically coupled to one another by said conductor tracks of said circuit board; and a substantially gas impermeable cover connected to said circuit board in a materially joined manner, causing said cover and said circuit board to form a closed cavity containing said electronic components and said conductor tracks associated with said electronic components.

18. The control unit device according to claim 17, wherein said materially joined connection between said cover and said circuit board is a welded connection.

19. The control unit device according to claim 17, wherein said circuit board includes a metal layer, and said materially joined connection between said cover and said circuit board is a soldered connection between said metal layer and said cover.

20. The control unit device according to claim 19, wherein said soldered connection is a laser soldered connection.

21. The control unit device according to claim 19, wherein: said metal layer has a region facing away from said cavity; said cover has surroundings outside said cavity; and said metal layer is sealed at least in said region facing away from said cavity, preventing contact of said metal layer with said surroundings of said cover outside said cavity.

22. The control unit device according to claim 17, wherein said cover includes a metal material or a plastic material.

23. The control unit device according to claim 22, wherein said cover has a side facing said circuit board, and a solder able material coats said side of said cover facing said circuit board for producing said materially joined connection.

24. The control unit device according to claim 22, which further comprises a gas impermeable coating on said cover.

25. The control unit device according to claim 17, which further comprises a metallic base carrier on which said circuit board is disposed.

26. The control unit device according to claim 17, which further comprises: a plug connector disposed on said circuit board and electrically coupled to said circuit board; said cover mechanically securing said plug connector to said circuit board outside said cavity by connecting said cover to said circuit board.

27. The control unit device according to claim 25, which further comprises: a plug connector disposed on said base carrier and electrically coupled to said circuit board; said cover mechanically securing said plug connector to said base carrier outside said cavity by connecting said cover to said circuit board.

28. A method for manufacturing a control unit device, the method comprising the following steps: providing a circuit board having conductor tracks; placing electronic components on the circuit board and electrically coupling the electronic components to one another through the conductor tracks of the circuit board; providing a gas impermeable cover; and connecting the cover to the circuit board in a materially joined manner, causing the cover and the circuit board to form a closed cavity containing the electronic components and the conductor tracks associated with the electronic components.

29. The method according to claim 28, which further comprises welding the cover to the circuit board.

30. The method according to claim 28, which further comprises: providing the circuit board with a metal layer; and carrying out the connecting step by soldering or laser soldering the metal layer of the circuit board to the cover.

31. The method according to claim 30, which further comprises: providing the cover with surroundings outside the cavity; and sealing the metal layer before the connecting step to prevent direct contact of the metal layer with the surroundings of the cover outside the cavity.

32. The method according to claim 28, which further comprises, after the connecting step, applying a sealing coating, being disposed outside the cavity and overlapping the circuit board and the cover, to seal the metal layer.

Description

[0027] The exemplary embodiment of the invention will be described below in detail with reference to the figures.

[0028] In the figures:

[0029] FIG. 1 shows a schematic sectional view of a control unit device according to a first exemplary embodiment,

[0030] FIG. 2 shows a schematic sectional view of a control unit device according to a second exemplary embodiment,

[0031] FIG. 3 shows a schematic sectional view of a control unit device according to a third exemplary embodiment, and

[0032] FIG. 4 shows a schematic flowchart of a method for producing a control unit device according to one of the exemplary embodiments.

[0033] FIGS. 1 to 3 show schematic sectional views of a control unit device 1 according to three exemplary embodiments. Firstly, common features of the three exemplary embodiments are described before details are given on the differences.

[0034] In the exemplary embodiments, the control unit device 1 is a control unit device of an automatic transmission of a motor vehicle. The control unit device 1 is configured to evaluate, for example, measured values of sensors such as Hall sensors, and to control a switching operation of the automatic transmission as a function of the measured values. Alternatively, the control unit device 1 can also be provided for other purposes of use.

[0035] Each control unit device 1 has a circuit board 2. A multiplicity of electronic components 3 are arranged on the circuit board 2. Said electronic components 3 comprise, for example, capacitors, coils, at least one microprocessor and/or other elements. The electronic components 3 are electrically coupled to one another, in particular via bonded gold wires and/or conductor tracks of the circuit board 2.

[0036] In order to protect the electronic components 3 and the corresponding conductor tracks, a gas-impermeable cover 4 is soldered to the circuit board 2. The cover 4 has a metal material which can be soldered. The cover 4 is therefore connected in a materially joined fashion to the circuit board 2, wherein said cover 4 bounds a closed cavity 5 with the circuit board 2. A coherent materially joined connecting seam is therefore formed around the electronic components 3, between the cover 4 and the circuit board 2. The cavity 5 is therefore completely sealed and sealed tightly with respect to the surroundings of the cover 4.

[0037] In order to produce the materially joined connection or the soldered connection, a metal layer 6 of the circuit board 2 is soldered to the cover 4. For this purpose, a solder such as tin is applied to the metal layer 6, which solder is melted in order to produce the connection. The metal layer 6 comprises one or more conductor tracks of the circuit board 2. In particular, the metal layer 6 is composed of a copper material. The solder is suitable for high-temperature applications, in particular for temperatures in the region of 200° Celsius.

[0038] The cover 4 is provided for protecting the electronic components 3 and associated conductor tracks of the circuit board 2 against oils, gases and the like as described at the beginning. In particular, the cover 4 prevents sulfur-like compounds from entering the cavity 5 and from being able to come into contact with the electronic components 3 and/or the conductor tracks. In this context, there is no need for positive locking of the cover 4 with the circuit board 2 and no need for seals, which would not ensure any complete impermeability to gas.

[0039] Instead of a metal material, the cover 4 can also have a plastic material. The plastic material is coated with a solderable material on a side facing the circuit board 2, with the result that said plastic material can be soldered to the circuit board 2. Likewise, the cover 4 can have a non-solderable metal material, for example, aluminum, which is then coated with the solderable material at corresponding locations.

[0040] The cover 4 can optionally also have a gas-impermeable additional coating which is preferably applied to an outer side of the cover 4 facing away from the cavity 5. This coating contributes to preventing the ingress of gases or fluids into the cavity 5. In particular, in the case of a plastic cover such an additional coating may be absolutely necessary.

[0041] In order to electrically couple to sensors, in order to control actuators and/or in order to connect electrically to further components such as, for example, a monitoring unit, the control unit device 1 has in each case a plug connector 8. The plug connector 8 is electrically coupled to the circuit board 2, for example by means of press fit contacts or via a soldered connection. The plug connector 8 is arranged outside the cavity 5.

[0042] In the text which follows, the differences of the three exemplary embodiments are explained according to the FIGS. 1 to 3.

[0043] In the exemplary embodiment according to FIG. 1, the plug connector 8 is arranged on the circuit board 2. In the state of the cover 4 in which it is soldered to the circuit board 2, said cover 4 is embodied in such a way that it secures the plug connector 8 in a frictionally locking fashion to the circuit board 2. For this purpose, the cover 4 has a projection 9. The plug connector 8 is clamped at least partially between the projection 9 and the circuit board 2. The control unit device 1 which is shown in FIG. 1 is provided to be mounted within a transmission.

[0044] In the exemplary embodiment according to FIG. 2, the circuit board 2 is secured to a metallic base carrier 7. Via the metallic base carrier 7, the circuit board 2 can be mechanically secured to the cover 4 at a further component, for example at a housing wall of a transmission. For example, the base carrier 7 is welded, screwed or mounted in some other way with the further component.

[0045] Furthermore, the plug connector 8 of the control unit device 1 is not arranged on the circuit board 2 itself or mechanically secured thereto, but instead to the base carrier 7. In this context, the plug connector 8 is secured in a frictionally locking fashion to the base carrier 7 via a projection 9 of the cover 4, analogously to the exemplary embodiment according to FIG. 1. In particular, the plug connector 8 is clamped tight. In addition, optional seals 10 are provided which seals tighten the electrical coupling of the plug connector 8 with respect to the circuit board 2.

[0046] Furthermore, the electronic components 3 are not arranged on the circuit board 2 but rather on an additional circuit board 11. The additional circuit board 11 is an HDI (High Density Interconnect) circuit board which is configured in a very compact fashion. The additional circuit board 11 is arranged on the circuit board 2. In this context, the additional circuit board 11 is laminated onto the circuit board 2. Other connection techniques are conceivable.

[0047] The control unit device 1 which is shown according to FIG. 2 is alternatively additionally encapsulated in a housing.

[0048] The plug connector 8 according to FIGS. 1 and 2 can optionally also be mechanically coupled in each case in a frictionally locking fashion to the cover 4. As a result, the plug connector 8 can be mechanically secured to the circuit board 2, or to the base carrier 7, in an improved way.

[0049] Optionally, the plug connector 8 according to FIGS. 1 and 2 can also be part of the cover 4. Therefore, the plug connector 8 and the cover 4 are embodied in one piece. This provides a saving in terms of manufacturing costs and mounting costs.

[0050] In an exemplary embodiment (not shown), instead of the plug connector 8 shown in FIGS. 1 and 2 a different plastic attachment component is provided which is secured to the circuit board 2 and/or the metallic base carrier 7 by means of the cover 4.

[0051] In the exemplary embodiment according to FIG. 3, the plug connector 8 is not secured mechanically to the circuit board 2 by means of the cover 4. Instead, the plug connector 8 is itself mechanically secured to the circuit board 2, for example soldered thereto, or by means of press fit contact formation. Other connection techniques are also conceivable, for example welding. Alternatively, the circuit board 2 shown in FIG. 3 can, in a way analogous to the exemplary embodiment according to FIG. 2, be applied to a metallic base carrier. In this context, the plug connector 8 can be secured to the base carrier instead of being secured to the circuit board 2. The control unit device 1 shown in FIG. 3 is in turn provided to be mounted within a transmission.

[0052] FIG. 4 is a schematic view of a flowchart of a method for producing the control unit devices 1 described on the basis of FIGS. 1 to 3. In particular, the connection of the cover 4 to the respective control unit device 1 of the three exemplary embodiments is described.

[0053] In a step S1, the circuit board 2 on which the electronic components 3 are arranged is made available.

[0054] Furthermore, the gas-impermeable cover 4 is made available in a step S2.

[0055] In a step S3, the cover 4 is soldered to a metal layer 6 of the circuit board 2, with the result that the closed cavity 5, in which the electronic components 3 are located, is formed.

[0056] In step S3, the cover 4 which is made available and the circuit board 2 which is made available are correspondingly arranged in a soldering oven or conducted through a hot air tunnel. In this context, heat is introduced into this control unit device 1, in particular into the solder, with the result that the latter is melted in order to produce the materially joined connection between the cover 4 and the circuit board 2.

[0057] Alternatively, instead of the soldering in the soldering oven or in the hot air tunnel, laser soldering can also be provided. In this context, thermal energy is introduced by means of a laser in a punctiform fashion into the regions of the control unit device 1 which are to be soldered. The thermal energy is therefore essentially not introduced into other regions of the control unit device 1, for example into the electronic components 3.

[0058] The metal layer 6 can optionally be sealed before the materially joined connecting process, with the result that direct contact of the metal layer 6 with the surroundings of the cover 4 outside the cavity 5 is prevented. For this purpose, the metal layer 6 is provided, for example, with an additional coating and subsequently soldered to the cover 4. The additional coating ensures that the metal layer 6 does not have any direct contact with the surroundings of the cover 4 outside the cavity 5. This prevents the metal layer 6 from being decomposed owing to the oils or gases, as a result of which the cover 4 would become detached from the circuit board 2 and/or the gases or fluids would penetrate the cavity 5.

[0059] The sealing process will optionally take place after step S3, that is to say after the connecting process, wherein a sealing coating is applied outside the cavity 5, which sealing coating overlaps with the circuit board 2 and the cover 4. In this context, the sealing coating overlaps with the abovementioned components in such a way that the metal layer 6 outside the cavity 5 is not exposed and does not have any contact with the surroundings of the cover 4.