LED EMISSION SOURCE FOR SEQUENTIAL DRIVERS

Abstract

An LED emission source is described herein. While the LED emission source can include any suitable component, in some implementations it includes a substrate that includes an insulating heat conducting material. In some cases, the emission source further includes two or more LED crystal groups, multiple electrical contacts for a driver connection, with the electrical contacts being disposed at a front face of the substrate, and a metal heat radiator that includes a plate having a surface that includes a dielectric layer, wherein the dielectric layer is located on a back side of the metal heat radiator and is configured to provide heat exchange with the substrate, and wherein a number of the electrical contacts is one unit more than a number of the LED crystal groups. Other implementations are described.

Claims

1. An LED emission source, comprising: a substrate, comprising an insulating heat conducting material; two or more LED crystal groups; electrical contacts for a driver connection, the electrical contacts being disposed at a front face of the substrate; and a metal heat radiator comprising a plate having a surface that comprises a dielectric layer, wherein the dielectric layer is located on a back side of the metal heat radiator and is configured to provide heat exchange with the substrate, and wherein a number of the electrical contacts is one unit more than a number of the LED crystal groups.

2. The LED emission source according to claim 1, wherein the insulating heat conducting material of the substrate comprises a ceramic having a breakdown voltage that is not less than 4 kW.

3. The LED emission source according to claim 1, wherein the dielectric layer comprises a heat conducting prepreg having a breakdown voltage that is not worse than 4 kW.

4. The LED emission source according to claim 1, wherein a distance from any current-carrying element of the substrate to an edge of the substrate is not less than 3 mm.

5. The LED emission source according to claim 1, wherein a number of sequentially connected LED crystal groups is selected for use on the substrate with a connection to the contacts where general voltage supplied to the substrate is up to 300 V.

6. The LED emission source according to claim 1, wherein the substrate further comprises an insulation collar.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG. 1 shows a plan view of a representative embodiment of the claimed device;

[0017] FIGS. 2-3 each show a side elevation view of a representative embodiment of the claimed device;

[0018] FIG. 4 illustrates a front perspective view of a representative embodiment of the claimed device; and

[0019] FIG. 5 illustrates a back perspective view of a representative embodiment of the claimed device.

DETAILED DESCRIPTION

[0020] In FIGS. 1-5 elements of the claimed device are marked as follows:

[0021] 1. Substrate.

[0022] 2. LED groups field of location.

[0023] 3. Electrical contacts.

[0024] In accordance with at least some embodiments, the described LED emission source for sequential drivers contains a substrate 1 made of an insulating heat conducting material (for example, one or more ceramics), two or more LED crystal groups and electrical contacts 3 for a driver connection (not shown), installed at a front surface of the substrate 1. In accordance with some embodiments, a back side of the substrate does not have elements of construction, impeding creation of a reliable heat contact with a surface of a metal heat radiator dielectric layer.

[0025] In some embodiments, the quantity of sequentially connected LED crystals in groups is selected with a glance to the possibility of connection to the electric contacts of general voltage up to 300 V. The number of electrical contacts 3 is determined (in some embodiments), depending on the number of LED crystal groups. For example, for six LED crystal groups at the surface of substrate 1 seven contacts 3 are located, for eight LED groups-nine contacts, i.e., contacts are more by one unit in comparison to the number of LED crystal groups. In some embodiments, such a proportion allows for a decrease of harmonic distortions, appearing in the electric network during LED groups feeding from sequential drivers.

[0026] In accordance with some embodiments, contacts 3 are located at a distance not less than 3 mm from an edge of substrate 1 to decrease the danger of breakdown at the metal heat radiator (not shown).

[0027] To increase the extent of insulation along the edge of substrate 1, some embodiments include an insulation collar, for example, made of silicon.

[0028] While the described device can be used in any suitable manner, in some embodiments, the described utility model may be realized on the basis of existing materials and assembly techniques of LED illuminating units.