Methods for forming and controlling morphology cracks in silicon dioxide (SiO.sub.2) film comprising: preparing SiO.sub.2precursor solution comprising solvent, precursor of SiO.sub.2, precursor of metal oxide nanocrystals, water, and acid; coating the solution onto substrate; drying the solution atop the substrate at a temperature between about 20° C. to 100° C. between 1 minute to 24 hours to form SiO.sub.2 film having uniformly dispersed metal oxide nanocrystals, wherein shorter drying times yield substantially spherical shaped metal oxide nanocrystals and longer drying times yield rod and disc shaped metal oxide nanocrystals; and thermally treating the SiO.sub.2 film between about 60° C. to 500° C. between 1 minute to 24 hours to form cracked mesh SiO.sub.2 film, wherein two cracks initiate from rod shaped metal oxide nanocrystals, three to four cracks initiate from spherical shaped metal oxide nanocrystals, and four or more cracks initiate from disc shaped metal oxide nanocrystals. Other embodiments are described and claimed.

Exemplary methods of semiconductor processing may include forming a layer of carbon-containing material on a substrate disposed within a processing region of a semiconductor processing chamber. The substrate may include an exposed region of a first dielectric material and an exposed region of a metal-containing material. The layer of carbon-containing material may be selectively formed over the exposed region of the metal-containing material. Forming the layer of carbon-containing material may include one or more cycles of providing a first molecular species that selectively couples with the metal-containing material. Forming the layer of carbon-containing material may include providing a second molecular species that selectively couples with the first molecular species. The methods may include selectively depositing a second dielectric material on the exposed region of the first dielectric material.

A process for manufacturing continuous ceramic tape includes steps of heating a ceramic feedstock to a molten state and spraying molten droplets of the feedstock onto a deposition surface. The method further includes forming a ceramic coating on the deposition surface by accumulating the droplets, which solidify and are directly bonded to one another. The deposition surface is non-stick with respect to the ceramic coating such that the coating may be peeled off of the deposition surface as a continuous ceramic tape, without fracture. Additionally, in embodiments, the deposition surface is removed by running the deposition over a bending edge, chemically stripping or dissolving the deposition surface, or burning the deposition surface.

Disclosed are silicon and carbon containing film forming compositions comprising a polycarbosilazane polymer or oligomer formulation that consists of silazane-bridged carbosilane monomers, the carbosilane containing at least two —SiH.sub.2— moieties, either as terminal groups (—SiH.sub.3R) or embedded in a carbosilane cyclic compound, wherein R is H, a C.sub.1-C.sub.6 linear, branched, or cyclic alkyl- group, a C.sub.1-C.sub.6 linear, branched, or cyclic alkenyl- group, or combination thereof. Also disclosed are methods of forming a silicon and carbon containing film comprising forming a solution comprising a polycarbosilazane polymer or oligomer formulation and contacting the solution with the substrate via a spin-on coating, spray coating, dip coating, or slit coating technique to form the silicon and carbon containing film.

A busbar assembly of the present invention includes first and second busbars disposed in parallel in a common plane with a gap therebetween, and an insulating resin layer including a gap filling part and an upper surface laminated part, the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, a part of the upper surface laminated part between the first and second busbar-side upper surface openings forming a partitioning wall.

A substrate includes a metal component on a surface. A polymeric layer is deposited on the surface using molecular layer deposition. The polymeric layer includes a metalcone and has a thickness from 1 nm to 20 nm. The polymeric layer is stable at room temperature, but will undergo a structural change at high temperatures. The polymeric layer can be annealed to cause a structural change, which can occur during soldering.

The present disclosure is directed to processes, compositions and agents for inhibiting corrosion in various substrates, for example metal substrates. The present disclosure is also directed to corrosion inhibitors comprising organometallic polymers such as metal-organic frameworks (MOFs), including compositions and processes comprising MOFs for inhibiting corrosion in metal substrates.

A resin-coated metal sheet for containers, on which wrinkle defects are not generated during a post-process heat treatment in can making of two-piece cans that involves a high degree of processing. The resin-coated metal sheet for containers includes a metal sheet and a resin coating layer disposed on each of surfaces of the metal sheet. The resin coating layer on at least one surface contains a resin material that contains 90 mol % or more of an ethylene terephthalate unit and that has a mobile amorphous content of 80% or more.

Aspects described herein generally relate to a method of coating a metallic surface. The method includes forming a solution including a corrosion inhibitor having one or more thiol moieties and a hydroxide. The metallic surface is coated with the solution to form a treated metallic surface. The treated metallic surface is further coated with an organosilane, an acid, and a metal alkoxide to form a coating system.

A process for manufacturing continuous ceramic tape includes steps of heating a ceramic feedstock to a molten state and spraying molten droplets of the feedstock onto a deposition surface. The method further includes forming a ceramic coating on the deposition surface by accumulating the droplets, which solidify and are directly bonded to one another. The deposition surface is non-stick with respect to the ceramic coating such that the coating may be peeled off of the deposition surface as a continuous ceramic tape, without fracture. Additionally, in embodiments, the deposition surface is removed by running the deposition over a bending edge, chemically stripping or dissolving the deposition surface, or burning the deposition surface.