CMUT devices are used in many applications e.g. for ultrasound imaging and pressure measurement. These devices operate by sensing a change in capacitance caused by deflection of a membrane (32) comprising one of a pair of electrodes in the device by ultrasound exposure of or pressure applied on, the membrane. The CMUT device may be susceptible to the effects of changing temperature.

CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

Systems and methods are provided that relate to vibrational input elements configured to provide inputs to control an application executed by a mobile computing device. The vibrational input elements may produce distinct vibration patterns that are detectable by a sensor of the mobile computing device. The respective vibration patterns may correspond to one or more actions that may be performed in relation to the application.

Systems and methods are provided that relate to vibrational input elements configured to provide inputs to control an application executed by a mobile computing device. The vibrational input elements may produce distinct vibration patterns that are detectable by a sensor of the mobile computing device. The respective vibration patterns may correspond to one or more actions that may be performed in relation to the application.

Mobile decontamination systems and microwave assisted decontamination methods for decontaminating a variety of contaminated surfaces disposed external to the system. The systems and methods include treating the surfaces with benign chemical formulations followed by exposing to microwave irradiation for short periods of time to achieve at least 6-log reduction in biological contaminants including viruses and spores of B. anthracis, B. thuringiensis, and P. roqueforti. The formulations include a percarbonate and surfactant in water.

A cartridge may include: a housing; a reservoir located in the housing and storing an aerosol generating material; an atomizer located in the housing and configured to generate vibration to atomize the aerosol generating material to an aerosol; a liquid delivery element configured to absorb the aerosol generating material stored in the reservoir and deliver the absorbed aerosol generating material to the atomizer; and a resistor located in the housing and configured to eliminate noise of a signal applied to the atomizer.

An assembly including: a printed circuit board (PCB) having a first surface and a second surface; at least one energy transmitter mounted on the first surface; at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.

An assembly including: a printed circuit board (PCB) having a first surface and a second surface; at least one energy transmitter mounted on the first surface; at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.

The presently disclosed subject matter is directed to a device capable of disinfecting and/or sterilizing a door handle. Specifically, the disclosed device fits around commonly used doorknobs or door handles. The device includes an interior compartment that houses one or more solutions capable of killing or neutralizing microbial organisms present on the door handle and surrounding area. Particularly, the solution is sprayed from the interior compartment through one or more outlets positioned adjacent to the door handle. In this way, the door handle remains disinfected and/or sterilized between uses to prevent the spread of harmful viruses, bacteria, and other microbes

A multilayer board includes: a front-side layer; an intermediate layer; a back-side layer; the front-side layer; a first ground terminal and a second ground terminal for connecting ground lines of a plurality of shield lines to be connected to the multilayer board; a plurality of signal line connecting terminal arrays each including a plurality of signal line connecting terminals for connecting respective signal lines of the shield lines; and a wire having a thermal conductivity, the wire extending to the second end on the intermediate layer.