Patent classifications
B06B1/00
Cooling of ultrasound energizers mounted on printed circuit boards
An assembly including: a printed circuit board (PCB) having a first surface and a second surface; at least one energy transmitter mounted on the first surface; at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.
Cooling of ultrasound energizers mounted on printed circuit boards
An assembly including: a printed circuit board (PCB) having a first surface and a second surface; at least one energy transmitter mounted on the first surface; at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.
Fibrous structures comprising regions having different solid additive levels
Fibrous structures containing solid additives, and more particularly, fibrous structures containing two or more regions that comprise different average weight % levels of solid additives and methods for making same are provided.
ULTRASOUND DEVICES
An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.
Piezoelectric micromachined ultrasonic transducer sensor apparatuses, systems, and methods
Apparatuses, systems, and methods include a PMUT mechanically coupled to, and electrically isolated from, a receive sensor via a common flexible membrane. The receive sensor may be an optical sensor or a receive only PMUT providing a feedback signal based on a received waveform, V.sub.RO(t), to modify the drive voltage V.sub.d(t) of the PMUT. The feedback signal may be used to modify the drive voltage V.sub.d(t) of the PMUT to shorten the ring-down period and may be based on the received waveform, V.sub.RO(t), and a desired receive waveform, V.sub.ROD(t), which may be selected to optimize one or more of Q, bandwidth, resonant frequency, and spectral content of the drive voltage V.sub.d(t). The drive voltage V.sub.d(t) may be modified to a minimize a difference between V.sub.RO(t), and a desired receive waveform, V.sub.ROD(t), or a closed loop weighted (?, ?) sum of the energy of V.sub.RO (t) and the blind zone duration.
Ultrasonic detection device and ultrasonic diagnostic device
Provided is an ultrasonic detection device including: a capacitive electromechanical transducer including a cell that includes a first electrode and a second electrode disposed so as to oppose with a space; a voltage source for developing a potential difference between the first electrode and the second electrode; and an electric circuit for converting a current, which is caused by a change in electrostatic capacitance between the first electrode and the second electrode due to vibration of the second electrode, into a voltage, in which the capacitive electromechanical transducer provides an output current with a high-pass characteristic having a first cutoff frequency with respect to a frequency, the electric circuit provides an output with a low-pass characteristic having a second cutoff frequency with respect to the frequency, and the second cutoff frequency is smaller than the first cutoff frequency.
Membrane hydrophone for high frequency ultrasound and method of manufacture
A membrane hydrophone for analyzing high frequency ultrasound transducers has a piezoelectric membrane with electrode patterns created on the surface of the membrane. In one embodiment, the electrode patterns are doubled on each side of the membrane except for an active area of the hydrophone. In one embodiment, the electrodes are formed by removing a conductive coating on the membrane with laser pulses. The laser is set to remove the conductive coating from the piezoelectric membrane from the same side of the membrane in order to accurately align the electrodes in the active area. In one embodiment, the active area of the hydrophone has an area in a range of 900-10,000 square microns.
Bias application for capacitive micromachined ultrasonic transducers
In some examples, a capacitive micromachined ultrasonic transducer (CMUT) includes a first electrode and a second electrode. The CMUT may be connectable to a bias voltage supply for supplying a bias voltage, and a transmit and/or receive (TX/RX) circuit. In some cases, a first capacitor having a first electrode may be electrically connected to the first electrode of the CMUT, the first capacitor having a second electrode that may be electrically connected to the TX/RX circuit. Furthermore, a first resistor may include a first electrode electrically connected to the first electrode of the first capacitor and the first electrode of the CMUT. A second electrode of the first resistor may be electrically connected to at least one of: a ground or common return path, or the second electrode of the first capacitor.
Ultrasound devices
An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.
Ultrasound devices
An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.