Method that allows surfaces in interior spaces or technical equipments to be cleaned, characterised in that it comprises at least the following step: —the targeted atomization on the surfaces of a liquid with spores of benign bacteria on all or certain types of surfaces by means of an electrically and/or pneumatically powered atomizer, while the space remains accessible to people and animals, with the purpose of speeding up the cleaning of interior spaces and of technical equipments, lowering the cleaning frequency, and lowering the dust deposit.

An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

A device for a plasma processing chamber includes a base, an upper portion attached to the base and extending transverse to the base, and one or more first through holes defined in the base. The one or more first through holes correspond to one or more openings defined in the plasma processing chamber for attaching the device. The device further includes a second through hole defined in the upper portion, and a gauge located in the second through hole, the gauge configured for recording a position of the plasma processing chamber and a shift in the position of the plasma processing chamber.

A dross abatement system for a printer is disclosed. The dross abatement system includes a print head ejector, a pump in communication with the print head ejector having an inner cavity, a first inlet coupled to the inner cavity, a supply of printing material external to the print head ejector, a heating element configured to heat the printing material in the ejector, and a supply of absorbent material external to the print head ejector. A method of abating dross in a metal jetting printer is also disclosed, which includes pausing an operation of the printer, advancing an absorbent material into a melt pool within a nozzle pump reservoir, wherein the melt pool may include a metal printing material, absorbing dross from the metal printing material, removing the absorbent material including the dross, and resuming operation of the metal jetting printer.

A dross abatement system for a printer is disclosed. The dross abatement system includes a print head ejector, a pump in communication with the print head ejector having an inner cavity, a first inlet coupled to the inner cavity, a supply of printing material external to the print head ejector, a heating element configured to heat the printing material in the ejector, and a supply of absorbent material external to the print head ejector. A method of abating dross in a metal jetting printer is also disclosed, which includes pausing an operation of the printer, advancing an absorbent material into a melt pool within a nozzle pump reservoir, wherein the melt pool may include a metal printing material, absorbing dross from the metal printing material, removing the absorbent material including the dross, and resuming operation of the metal jetting printer.

Implementations disclosed herein generally relate to systems and methods of protecting a substrate support in a process chamber from cleaning fluid during a cleaning process. The method of cleaning the process chamber includes positioning in the process chamber a cover substrate above a substrate support and a process kit that separates a purge volume from a process volume. The method of cleaning includes flowing a purge gas in the purge volume to protect the substrate support and flowing a cleaning fluid to a process volume above the cover substrate, flowing the cleaning fluid in the process volume to an outer flow path, and to an exhaust outlet in the chamber body. The purge volume is maintained at a positive pressure with respect to the process volume to block the cleaning fluid from the purge volume.

A processing chamber may include a gas distribution member, a metal ring member below the gas distribution member, and an isolating assembly coupled with the metal ring member and isolating the metal ring member from the gas distribution member. The isolating assembly may include an outer isolating member coupled with the metal ring member. The outer isolating member may at least in part define a chamber wall. The isolating assembly may further include an inner isolating member coupled with the outer isolating member. The inner isolating member may be disposed radially inward from the metal ring member about an central axis of the processing chamber. The inner isolating member may define a plurality of openings configured to provide fluid access into a radial gap between the metal ring member and the inner isolating member.

A beaker cleaning recovery oven for extracting cannabis oil from a beaker including an oven, a beaker stand placed in the oven, and a beaker placed over the beaker stand. The beaker has a film or residue of cannabis after it being used for cannabis extraction process, rinsed with ethanol and drained for a predetermined time period. The oven heats and brings up the heat inside the beaker. The beaker stand rotates allowing the beaker to heat up evenly. The beaker heats up the film or residue of cannabis to flow down as cannabis oil. The oven positions over a cart allowing it to be transported. The cart includes a base frame with cut-sections for holding the beaker when not in use. The beaker cleaning recovery oven helps to reclaim a substantial amount of the film or residue from the beaker used during an extraction process.

An absorbent is provided, which is produced from component A, a foaming agent, and component B, a resin. Furthermore, a device and a method for producing the absorbent and a method for absorbing a liquid by means of the absorbent are provided.

Provided are a wafer cleaning apparatus based on light irradiation capable of effectively cleaning residue on a wafer without damaging the wafer, and a wafer cleaning system including the cleaning apparatus. The wafer cleaning apparatus is configured to clean residue on the wafer by light irradiation and includes: a light irradiation unit configured to irradiate light onto the wafer during the light irradiation; a wafer processing unit configured accommodate the wafer and to control a position of the wafer such that the light is irradiated onto the wafer during the light irradiation; and a cooling unit configured to cool the wafer after the light irradiation has been completed. The light irradiation unit, the wafer processing unit, and the cooling unit are sequentially arranged in a vertical structure with the light irradiation unit above the wafer processing unit and the wafer processing unit above the cooling unit.