There is provided a maintenance device comprising: a case having an opening whose size corresponds to a second gate of a vacuum processing device disposed in a processing chamber having a first gate and the second gate different from the first gate, the first gate and the second gate being used for loading and unloading substrates, the opening being capable of being attached to the second gate in a detachable manner and an airtight manner; a depressurization mechanism configured to reduce a pressure in the case; and a suction mechanism disposed in the case and configured to enter the processing chamber through the opening and conduct suction of deposits on an object in the processing chamber.

A furnace system includes at least one wall that defines a workspace. The workspace includes an aircraft part to be cleaned. One or more vacuum pumps are configured to achieve a predetermined vacuum level in the workspace. A gas purifier is configured to remove impurities in a gas to create a purified gas, the purified gas being directed from the gas purifier into the workspace, the purified gas being of a purity and composition that is effective to disassociate oxides on a surface or in a crack of the aircraft part to be cleaned when the workspace is heated to a predetermined temperature and the predetermined vacuum level is achieved in the workspace.

The present disclosure provides embodiments of a system and method for detecting processing chamber condition. The embodiments include performing a wafer-less processing step in a processing chamber to determine the condition of the chamber walls. Based on an analysis of the residual gas resulting from the wafer-less processing step, an operator or a process controller can determine whether the chamber walls have deteriorated to such an extent as to be cleaned.

A substrate processing apparatus includes a chamber, an upper heater, a substrate supporter, and a lower showerhead. The chamber provides a processing space in which a process for a substrate is performed. The upper heater is provided in an upper region of an interior of the chamber and is configured to supply purge gas and to heat the substrate. The substrate supporter is provided in a lower region of the interior of the chamber and is configured to support the substrate. The lower showerhead is provided in the substrate supporter and is configured to supply cleaning gas or remote plasma.

A furnace system includes at least one wall that defines a workspace. The workspace includes an aircraft part to be cleaned. One or more vacuum pumps are configured to achieve a predetermined vacuum level in the workspace. A gas purifier is configured to remove impurities in a gas to create a purified gas, the purified gas being directed from the gas purifier into the workspace, the purified gas being of a purity and composition that is effective to disassociate oxides on a surface or in a crack of the aircraft part to be cleaned when the workspace is heated to a predetermined temperature and the predetermined vacuum level is achieved in the workspace.

The present disclosure provides embodiments of a system and method for detecting processing chamber condition. The embodiments include performing a wafer-less processing step in a processing chamber to determine the condition of the chamber walls. Based on an analysis of the residual gas resulting from the wafer-less processing step, an operator or a process controller can determine whether the chamber walls have deteriorated to such an extent as to be cleaned.

A cleaning device for a substrate transfer device comprises a traveling unit configured to travel along a rail having first and second areas, a rail unit including the rail and a rail structure disposed on the rail, and a rinsing unit including a suction part disposed on the rail and that rotates about a suction nozzle. When the rinsing unit is placed in contact with the rail structure, the suction part rotates about the suction nozzle.

The present disclosure provides embodiments of a system and method for detecting processing chamber condition. The embodiments include performing a wafer-less processing step in a processing chamber to determine the condition of the chamber walls. Based on an analysis of the residual gas resulting from the wafer-less processing step, an operator or a process controller can determine whether the chamber walls have deteriorated to such an extent as to be cleaned.

A load port cleaner is provided. The load port cleaner comprises a container including a lower plate, an upper plate, and a front plate disposed between the lower plate and the upper plate; first and second lower ports in the lower plate; a first front port in the front plate; a cup installed in the first front port, the cup including an opening exposed to the front, a first connection port, and a second connection port; a first pipe configured to connect the first lower port with the first connection port of the cup; and a second pipe configured to connect the second lower port with the second connection port of the cup.

A method for removing built-up solids from a water heater using a vacuum-based clean-out device is disclosed. The method includes disconnecting power and water, draining the heater, and inserting a vacuum pipe through an access opening. Suction is applied while an articulating joint and pull cord mechanism direct the vacuum pipe to remove sediment. Additional steps include rotating the pipe, adjusting its length, using sensors for positioning, and applying vibration to dislodge deposits. The method supports insertion through a heating element port or drain valve opening and allows flushing with water post-cleaning. Compatible with shop vacuums, wet/dry vacuums, and central vacuums, this method improves cleaning efficiency and heater performance.