A tool for cleaning, preserving, and applying solution to plant's leaves. The tool includes a pair of tongs accompanied by removable, washable, and durable material cleaning pads along each tong's arm. The pads cover the arms of the tongs while in use and are made of a quick-drying material allowing for the pads to be removed, washed/cleaned as desired, and reused multiple times, making the invention sustainable. The tongs are used to grasp a leaf of a plant and to clean it by running the tongs across the leaf's surface. The tool can be used on a wide variety of leafy plants, cleaning large leaves as well as those as small as 2.5 inches in size. The pad's material is delicate to plant's leaves, and a removable protective spacer placed on the lower inner arm of the tongs prevents the leaves from being damaged or squeezed too hard. The removable pads can be used dry as well as wet, using water or any other desired cleaning and shining solution.

Systems are provided for a base station to house an air wipe device. Certain embodiments of the base station may include a plunger that activates a pneumatic timer when depressed to compress an accompanying spring. The base station may be formed to optimize the process of removing particles from a driveshaft spline.

A method of cleaning a semiconductor wafer includes: loading a semiconductor wafer into a cell having an annular trough; moving a plurality of nozzles into operational orientations for spraying a cleaning solution onto a top surface of the loaded semiconductor wafer; spraying the cleaning solution from each nozzle onto the top surface of the loaded semiconductor wafer in a direction defined by each nozzle's operational orientation such that a patterned flow of cleaning solution is formed on the top surface of the loaded semiconductor wafer; and collecting the cleaning solution in the annular trough of the cell as it flows off the top surface of the loaded semiconductor wafer.

The present invention generally relates to a method of reducing contamination from plastics. The resulting purer plastic can be used in demanding applications.

A cavity cleaning and coating system for safely and efficiently cleaning and coating the interior of a cavity without requiring entry of any workers. The cavity cleaning and coating system generally includes a mount which is coupled with a movable arm of a vehicle. The mount includes an inner plate, which is coupled to the arm, and an outer plate. A shaft is coupled to the outer plate. The mount is adjustable independently of the arm of the vehicle, including outwardly, inwardly, and rotatably. A spray head is connected to the shaft. The spray head is rotatable and includes a dispenser for dispensing fluids. The vehicle is positioned near a cavity to be treated. The mount is adjusted for optimal positioning of the spray head. The spray head is lowered into the cavity to dispense a cleaning fluid and, after the cleaning fluid has dried, a coating fluid.

The invention relates to a non-corrosive process for cleaning a recyclable material comprising the following steps: (a) providing a contaminated recyclable material; (b) treating the contaminated recyclable material at a temperature in the range of from 45-30° C. with a solution that contains one or more polyols to remove contaminants from the contaminated recyclable material, wherein the one or more polyols is (are) present in an amount of at least 15 wt. %, based on the total weight of the solution, thereby forming a liquid 10 mixture which comprises one or more polyols, contaminants removed from the recyclable material, and treated recyclable material; (c) separating at a temperature in the range 10-55° C. at least part of the recyclable material as obtained in step (b) from the liquid mixture as obtained in step (b); (d) allowing at least part of the remaining liquid mixture as obtained in step (c) to phase-1 separate into a polyol phase and a phase which contains contaminants removed from the contaminated recyclable material; (e) recovering the polyol phase as obtained in step (d); (f) recovering the phase which contains contaminants removed from the recyclable material as obtained in step (d); and 20 (g) recovering the separated recyclable material as obtained in step (c).

A method for cleaning semiconductor wafer includes putting at least one wafer on a cassette bracket in a first cleaning tank filled with chemical solution; after said wafers have been processed in the first cleaning tank, transferring the wafers from the first cleaning tank to a second cleaning tank with the wafers immersing in the chemical solution; and after said wafers have been processed in the second cleaning tank, taking the wafers out of the second cleaning tank.

Devices include first and second frame elements having mounting points connectable to opposite ends (e.g., first end, second end) of the touchscreen. First and second rollers are connected, respectively, to the first and second frame elements. A web of transparent material is supported by and between the first and second rollers. Further, an ultraviolet light device is connected to the second frame element and is positioned to expose the web of transparent material to ultraviolet radiation to disinfect the transparent material between users.

A method for producing a tube for a chemical solution pipe composed of a cleaned fluororesin molded article, the method including cleaning a tube-shaped fluororesin molded article with a chemical solution; and cleaning the tube-shaped fluororesin molded article with water. The cleaning with water is performed after the cleaning with a chemical solution, and the chemical solution is an alcohol or an aqueous alcohol solution.

An ultrasonic cleaning apparatus capable of cleaning large-sized objects includes: a casing having a bottom surface that forms a tilted surface to oppose the object to be cleaned and having an ultrasonic transducer provided at an inner lower surface; a cleaning liquid supply device configured to supply cleaning liquid to a casing bottom surface; and a flow-speed accelerator that ejects the cleaning liquid by accelerating the flow speed of the cleaning liquid from the cleaning liquid supply device. The casing is formed by a main body including an upper plate, a projected part attached to a lower part of the upper plate, an outer lateral face extended from the projected part in a downward direction, and the bottom surface connected integrally at a lower end part of the outer lateral face. The bottom surface is formed to be tilted at a prescribed angle with respect to a horizontal plane.