The invention relates to a body (2), at least one mill (3) located on the body (2) so as to rotate about its axis, more than one ball (b) being located in said mill (3), said balls (b) acting on a material to be ground (m) therein by exerting frictional and impact forces on the material to be ground (m) so that the material to be ground (m) is brought to a pulverized form.

The present invention relates to a method of selective extraction of a platinoid, from a ceramic support containing a metal, comprising the following successive steps: a) the support is brought into contact, with an extraction medium consisting of a pressurized dense fluid containing an organic ligand that is selective for the metal and that is capable of forming a complex with the metal in the 0 state; whereby a ceramic support depleted in the metal, or even free of the metal, and, a medium consisting of the fluid containing the complex of the organic ligand with the metal in the 0 state are obtained; b) the fluid is brought back to atmospheric pressure and to ambient temperature, whereby the complex separates from the fluid; c) the ceramic support depleted in the metal, or even free of the metal, and the complex, are recovered.

A conductive composition for bonding includes a mix of copper powder carboxylic acid. The carboxylic acid has a branched carbon chain. The copper powder comprises first and second copper particles. The first copper particles have a volume-based cumulative particle size D.sub.50 of 0.11 ?m or more and less than 1 ?m at a cumulative volume of 50 vol % in a region of particle sizes of less than 1 ?m in a particle size distribution of the copper powder. The second copper particles have a volume-based cumulative particle size D.sub.50 of 1 ?m or more and 10 ?m or less at a cumulative volume of 50 vol % in a region of particle sizes of 1 ?m or more in the particle size distribution of the copper powder. The carboxylic acid is contained in an amount of 6 parts or more and 24 parts or less per 100 parts by mass.

Powder metallurgy, in particular production of tungsten monocarbide spherical powders, which is a major component of metalloceramic hard alloys used for manufacture of tools, drill bits, steel alloying, wear-resistant coating cladding at elements operating in intensive wear conditions. The method includes melting of the starting material, and melt atomization with forming of spherical powder. As starting material a tungsten monocarbide grit is used. Melting and atomization of the material is implemented by continuous filling of grit into a rotating crucible of a centrifugal atomization device under an inert atmosphere and melting it by a plasma arc. After that an annealing of the obtained powder is made at a temperature of 1200-1400 C. during a time necessary for W.sub.2C breakup with subsequent cooling of the powder in a furnace. And, the production of tungsten monocarbide spherical powder with WC content of more than 70%.

There is provided an inexpensive silver particle dispersing solution being usable as a slurry for ink jet, a method for producing the same, and a method for producing a conductive film using the silver particle dispersing solution. In a silver particle dispersing solution containing a silver powder and a solvent, the silver powder has an average primary particle diameter (D.sub.SEM) of 0.15 to 0.5 m, and the ratio (D.sub.50/D.sub.SEM) of a particle diameter (D.sub.50), which corresponds to 50% of accumulation in volume-based cumulative distribution of the silver powder, to the average primary particle diameter (D.sub.SEM) is not less than 1.7, the silver powder having a fatty acid adhered to the surface thereof, and the solvent containing a monohydric higher alcohol having a carbon number of 6 to 12, butyl carbitol or butyl carbitol acetate as the main component thereof.

Precursor metal salts of at least two different metals can be loaded onto a substrate. The substrate can be heated at a heating rate to a first temperature, and then maintained at the first temperature for a first time. The first temperature can be in a range of 1000-3000 K, and the first time can be in a range of 1 ?s-10 s. After the first time, the substrate can be cooled from the first temperature at a cooling rate, such that a metallic glass material is formed on the substrate. The metallic glass material can comprise a homogeneous mixture of the at least two different metals and forming a single amorphous solid.

This metal paste for bonding includes a metal powder, a copper salt, an amine, and an alcohol, in which a ratio A/B of a weight A of Cu in the copper salt to a weight B of the metal powder is set to be in a range of 0.02 or more and 0.25 or less, the metal paste is in a paste form in a temperature range of 15? C. or higher and 35? C. or lower, a liquid phase is generated in a temperature raising process starting from 35? C., the liquid phase dissipates in the temperature raising process at a liquid phase generation temperature or higher, and a metal sintered body is formed at a liquid phase dissipation temperature or higher.

The present invention provides a novel method for producing a structure comprising an assembly of metal-based particles. Provided is a method for producing a layered product, the layered product comprising a substrate having a three-dimensional surface; and a metal-based particle assembly layer arranged on the three-dimensional surface and comprising a plurality of metal-based particles arranged apart from each other, the method comprising the step of forming the metal-based particle assembly layer on the three-dimensional surface by immersing the substrate in a plating solution containing a cation of a metal constituting the metal-based particles to reduce the cation, wherein a V.sub.S/V.sub.L ratio of volume V.sub.S [cm.sup.3] of the substrate to volume V.sub.L [cm.sup.3] of the plating solution is 0.03 or less.

The present invention provides a novel structure that can be used for a sensor element or the like and is useful as an enhancing element to enhance the emission of a luminescent substance. Provided is a composite particle comprising a core particle, and a metal-based particle assembly layer arranged on at least a portion of a surface of the core particle, wherein the metal-based particle assembly layer comprises a plurality of metal-based particles arranged apart from each other.

A non-aqueous silver precursor composition is composed of (a) one or more cellulosic polymers; (b) reducible silver ions that are present at a weight ratio to the one or more cellulosic polymers of 5:1 to 50:1; (c) an organic solvent that has a boiling point at atmospheric pressure of at least 100 C. and up to but less than 500 C.; and (d) a nitrogenous base having a pKa in acetonitrile of at least 15 and up to and including 25 at 25 C. The Hansen parameter (.sub.T.sup.Polymer) of each cellulosic polymer is less than or equal to the Hansen parameter (.sub.T.sup.Solvent) each organic solvent. In addition, the (d) nitrogenous base is present in an equimolar amount or molar excess in relation to the amount of (b) reducible silver ions.