B22F9/00

Negative electrode active material and method of preparing the same

A negative electrode active material includes a silicon-based alloy represented by Si-M.sub.1-M.sub.2-CB, wherein M.sub.1 and M.sub.2 are different from each other and are each independently selected from magnesium, aluminum, titanium, vanadium, chromium, iron, cobalt, nickel, copper, zinc, gallium, germanium, manganese, yttrium, zirconium, niobium, molybdenum, silver, tin, tantalum, and tungsten. In the silicon-based alloy, Si is in a range of about 50 at % to about 90 at %, M.sub.1 is in a range of about 10 at % to about 50 atom %, and M.sub.2 is in a range of 0 at % to about 10 at %, based on a total number of Si, M.sub.1, and M.sub.2 atoms. C is in a range of about 0.01 to about 30 parts by weight, and B is in a range of 0 to about 5 parts by weight, based on a total of 100 parts by weight of Si, M.sub.1, and M.sub.2.

Method for producing water-atomized metal powder

A method for producing a water-atomized metal powder, comprising applying water to a molten metal stream, dividing the molten metal stream into a metal powder, and cooling the metal powder, wherein the metal powder is further subjected to secondary cooling with cooling capacity having a minimum heat flux point (MHF point) higher than the surface temperature of the metal powder in addition to the cooling and the secondary cooling is performed from a temperature range where the temperature of the metal powder after the cooling is not lower than the cooling start temperature necessary for amorphization nor higher than the minimum heat flux point (MHF point).

INORGANIC PARTICLE DISPERSION

An inorganic particle dispersion having high spinnability is provided. The inorganic particle dispersion according to one embodiment includes an inorganic powder, hydrophilic fumed silica, and a resin having a hydroxyl group.

Dynamically Impacting Method for Simultaneously Peening and Film-forming on Substrate as Bombarded by metallic Glass Particles
20200063226 · 2020-02-27 ·

A dynamically impacting method comprising simultaneously peening a substrate surface and forming a thin film of metallic glass on the substrate surface for increasing the surface hardness, fatigue resistance, anti-fracture toughness and corrosion resistance of the substrate simultaneously.

METHOD FOR PRODUCING SILVER NANOWIRE DISPERSION LIQUID HAVING GOOD SEPARABILITY AMONG WIRES
20200030877 · 2020-01-30 ·

A method for producing a silver nanowire dispersion liquid which exhibits good separability among wires, including: subjecting a liquid having dispersed therein silver nanowires having an average length of 10 m or more, to at least once of filtration including filtration with an organic fiber mesh filter having an aperture of 8 m or more and 120 m or less, so as to provide a filtrate having dispersed therein silver nanowires having an average length of 10 m or more (preliminary filtering step); and subjecting the filtrate obtained in the preliminary filtering step, to at least once of filtration including filtration with an organic fiber mesh filter having an aperture of 12 m or less, so as to provide a filtrate having dispersed therein silver nanowires having an average length of 10 m or more (finish filtering step).

METHOD FOR PRODUCING SILVER NANOWIRE DISPERSION LIQUID HAVING GOOD SEPARABILITY AMONG WIRES
20200030877 · 2020-01-30 ·

A method for producing a silver nanowire dispersion liquid which exhibits good separability among wires, including: subjecting a liquid having dispersed therein silver nanowires having an average length of 10 m or more, to at least once of filtration including filtration with an organic fiber mesh filter having an aperture of 8 m or more and 120 m or less, so as to provide a filtrate having dispersed therein silver nanowires having an average length of 10 m or more (preliminary filtering step); and subjecting the filtrate obtained in the preliminary filtering step, to at least once of filtration including filtration with an organic fiber mesh filter having an aperture of 12 m or less, so as to provide a filtrate having dispersed therein silver nanowires having an average length of 10 m or more (finish filtering step).

Method for fabricating metal nanoparticles

The present specification relates to a method for fabricating metal nanoparticles.

Bonding material and bonding method using same

A bonding material of a silver paste contains: fine silver particles having an average primary particle diameter of 1 to 200 nm, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as sorbic acid; and a solvent mixed with the fine silver particles, wherein a diol, such as an octanediol, is used as the solvent and wherein a triol having a boiling point of 200 to 300 C., a viscosity of 2,000 to 10,000 mPa.Math.s at 20 C. and at least one methyl group, such as 3-methylbutane-1,2,3-triol or 2-methylbutane-1,2,4-triol, is mixed with the solvent as an addition agent.

SOFT MAGNETIC ALLOY POWDER, MAGNETIC CORE, MAGNETIC COMPONENT, AND ELECTRONIC DEVICE

A soft magnetic alloy powder comprises first particles to fifth particles, each having a particle size within a specific range. Among the first particles to the fifth particles, nth particles have an average particle size x.sub.n (?m), an average circularity y.sub.n, and a variance z.sub.n of circularity, where nth is any ordinal number from first to fifth. Points (x.sub.n, y.sub.n) (n=1 to 5) plotted in an xy plane define an approximate straight line having a slope my of ?0.0030 or more. Points (x.sub.n, z.sub.n) (n=1 to 5) plotted in an xz plane define an approximate straight line having a slope mz of 0.00050 or less.

Magnetic powder, magnetic powder molded body, and method for manufacturing magnetic powder
11948712 · 2024-04-02 · ·

A magnetic powder contains a soft magnetic material represented by the following composition formula, in which an average particle size is 2 ?m or more and 10 ?m or less, and at least a surface layer is nanocrystallized,
Fe.sub.aCu.sub.bNb.sub.cSi.sub.dB.sub.e where, a, b, c, d, and e each indicate atomic percentage, 71.0 at %?a?76.0 at %, 0.5 at %?b?1.5 at %, 2.0 at %?c?4.0 at %, 11.0 at %?d?16.0 at %, and 8.0 at %?e?13.0 at %.