Patent classifications
B23B37/00
Tool Holder For Ultrasonic Machining
A tool holder for ultrasonic machining used in a machine which supplies power via a spindle is provided with a connector received in the spindle; a conductive ring disposed on the connector and electrically connected to the spindle so as that power is configured to supply to the tool holder; a tool mounting member including an axial hole for fastening a portion of a tool; and an oscillator for producing ultrasonic vibration disposed in the tool mounting member, the oscillator for producing ultrasonic vibration electrically connected to the conductive ring so that power supplied to the oscillator for producing ultrasonic vibration is configured to produce ultrasonic vibration of high frequency. The produced ultrasonic vibration of high frequency is transmitted to the tool via the axial hole.
Modular Tool Holder For Ultrasonic Machining
A modular tool holder for ultrasonic machining used in a machine which supplies power via a spindle is provided with a connector in the spindle; a conductive ring on the connector and electrically connected to the spindle; a tool mounting member including an axial hole; an oscillator for producing ultrasonic vibration in the tool mounting member and electrically connected to the conductive ring so that power supplied to the oscillator may produce ultrasonic vibration of high frequency; and a chuck releasably secured to an end of the axial hole.
Method and device for measuring a resonance frequency of a tool set in ultrasonic vibration for machining
Methods for measuring a resonance frequency of a tool set in ultrasonic vibration during the machining of a workpiece, involving radiating a working signal with a working frequency into a tool holder comprising a tool by a generator to produce the ultrasonic vibration of the tool; after the start of the machining of the workpiece, radiating a test signal with a test frequency varying by the working frequency and a lower power than the working signal power into the tool holder by the generator; generating a sensor signal from the ultrasonic vibration of the tool by a sensor apparatus arranged in the tool holder; reading out the sensor signal by a read-out apparatus; splitting the sensor signal into a frequency spectrum involving a main frequency and an auxiliary frequency by an analytical apparatus; determining the main frequency from the working frequency and the auxiliary frequency from the resonance frequency.
Method and device for measuring a resonance frequency of a tool set in ultrasonic vibration for machining
Methods for measuring a resonance frequency of a tool set in ultrasonic vibration during the machining of a workpiece, involving radiating a working signal with a working frequency into a tool holder comprising a tool by a generator to produce the ultrasonic vibration of the tool; after the start of the machining of the workpiece, radiating a test signal with a test frequency varying by the working frequency and a lower power than the working signal power into the tool holder by the generator; generating a sensor signal from the ultrasonic vibration of the tool by a sensor apparatus arranged in the tool holder; reading out the sensor signal by a read-out apparatus; splitting the sensor signal into a frequency spectrum involving a main frequency and an auxiliary frequency by an analytical apparatus; determining the main frequency from the working frequency and the auxiliary frequency from the resonance frequency.
Method of transferring thin film
The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.
Elliptical ultrasonic machining device powered by non-contact induction
An elliptical ultrasonic machining device powered by non-contact induction mainly includes an induction power supply device and an elliptical ultrasonic spindle shank, wherein: induction power supply secondary units of the induction power supply device encircle a spindle shank shell of the elliptical ultrasonic spindle shank; induction power supply primary units are arranged at a primary magnetic core seat outside the elliptical ultrasonic spindle shank; the primary magnetic core seat and the elliptical ultrasonic spindle shank have a same circle center, and a small gap exists between the primary magnetic core seat and the elliptical ultrasonic spindle shank; the primary magnetic core seat is fastened on a machine tool spindle seat of a machine tool through a support and keeps still; the elliptical ultrasonic spindle shank is mounted on a machine tool spindle through a taper shank and rotates with the spindle in a high speed.
Elliptical ultrasonic machining device powered by non-contact induction
An elliptical ultrasonic machining device powered by non-contact induction mainly includes an induction power supply device and an elliptical ultrasonic spindle shank, wherein: induction power supply secondary units of the induction power supply device encircle a spindle shank shell of the elliptical ultrasonic spindle shank; induction power supply primary units are arranged at a primary magnetic core seat outside the elliptical ultrasonic spindle shank; the primary magnetic core seat and the elliptical ultrasonic spindle shank have a same circle center, and a small gap exists between the primary magnetic core seat and the elliptical ultrasonic spindle shank; the primary magnetic core seat is fastened on a machine tool spindle seat of a machine tool through a support and keeps still; the elliptical ultrasonic spindle shank is mounted on a machine tool spindle through a taper shank and rotates with the spindle in a high speed.
Method for manufacturing a punched component and punched component produced thereby
The invention relates to a method for manufacturing a punched component comprising the steps: a) laminating a polymer film onto a metal sheet, b) subjecting the metal sheet to a punching process, by means of which the punched component is produced, wherein a polymer film is used which is provided with a cold-flowable pressure-sensitive adhesive.
ULTRASONIC VIBRATION PROCESSING DEVICE
Provided is an ultrasonic vibration processing device which can suppress vibration of components due to an ultrasonic vibrator and can perform processing using ultrasonic vibration in a preferable manner.
The ultrasonic vibration processing device includes: a housing (10); an ultrasonic vibrator (20) including a horn portion (21A) to which a tool holder (70) is detachably attached and a piezoelectric element (23), the ultrasonic vibrator having a rear end located at a node of ultrasonic vibration and being supported inside the housing (10) so as to be rotatable; a connecting portion (30) stored in the housing (10) so as to be rotatable together with the ultrasonic vibrator (20); a motor (40) connected to the connecting portion (30); and a non-contact power supply unit (50) including a primary transformer (51) and a secondary transformer (52), the primary transformer (51) being fixed to the housing (10) and including a primary coil (51B) that receives high frequency power from an external power supply, the secondary transformer (52) being connected to the rear end of the ultrasonic vibrator (20) with a clearance maintained between the secondary transformer (52) and the primary transformer (51) and including a secondary coil (52B) that supplies an induced electromotive force to the piezoelectric element (23).
ULTRASONIC VIBRATION PROCESSING DEVICE
Provided is an ultrasonic vibration processing device which can suppress vibration of components due to an ultrasonic vibrator and can perform processing using ultrasonic vibration in a preferable manner.
The ultrasonic vibration processing device includes: a housing (10); an ultrasonic vibrator (20) including a horn portion (21A) to which a tool holder (70) is detachably attached and a piezoelectric element (23), the ultrasonic vibrator having a rear end located at a node of ultrasonic vibration and being supported inside the housing (10) so as to be rotatable; a connecting portion (30) stored in the housing (10) so as to be rotatable together with the ultrasonic vibrator (20); a motor (40) connected to the connecting portion (30); and a non-contact power supply unit (50) including a primary transformer (51) and a secondary transformer (52), the primary transformer (51) being fixed to the housing (10) and including a primary coil (51B) that receives high frequency power from an external power supply, the secondary transformer (52) being connected to the rear end of the ultrasonic vibrator (20) with a clearance maintained between the secondary transformer (52) and the primary transformer (51) and including a secondary coil (52B) that supplies an induced electromotive force to the piezoelectric element (23).