An LED tube lamp with overvoltage protection capability is provided. The LED tube lamp includes a lamp tube, two external connection terminals, a rectifying circuit, a filtering circuit, an LED module, and a protection circuit. The protection circuit is coupled between two input terminals of the LED module and configured to perform overvoltage protection when determining that a voltage level between the two input terminals of the LED module reaches or is higher than a predefined voltage value, wherein the protection circuit includes a diode and the predefined voltage value is in a range of about 40V to about 600V.

A power transmission device and a method of manufacturing the same capable of shortening a shaft length and improving mountability are provided. A power transmission device according to the present disclosure includes a planetary carrier configured to support a pinion shaft pivotally supporting a pinion gear, rotatably support the pinion gear, and cause the pinion gear to revolve by rotation of the planetary carrier and a planetary carrier plate fixed fo face the planetary carrier on a side where the pinion gear is positioned, and including dog teeth integrally formed with the planetary carrier plate.

A heat assisted flip chip bonding apparatus includes a semiconductor assembly having a substrate and a chip, a heating source and a press and cover assembly having a cover element and press elements. The chip is disposed above the substrate and includes conductors which contact with conductive pads on the substrate. The heating source is provided to emit a heated light which illuminates the chip via an opening of the cover element. The press elements are located between the cover element and the semiconductor assembly and each includes an elastic unit and a pressing unit. Both ends of the elastic unit are connected to the cover element and the pressing unit respectively, and the pressing unit is provided to press a back surface of the chip.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end.

Ni—Mn—Si based braze filler alloys or metals which may be nickel-rich, manganese-rich, or silicon-rich braze filler alloys, have unexpectedly narrow melting temperature ranges, low solidus and low liquidus temperatures, as determined by Differential Scanning calorimetry (DSC), while exhibiting good wetting, and spreading, without deleterious significant boride formation into the base metal, and can be brazed at lower temperatures. The nickel rich alloys contain 58 wt % to 70 wt % nickel, the manganese-rich alloys contain 55 wt % to 62 wt % manganese, and the silicon-rich alloys contain 25 wt % to 29 wt % silicon. Copper with or without boron to partly replace nickel may be employed without any substantial increase of the melting point, or to reduce the melting point. The braze filler alloys have sufficient brazability to withstand high temperature conditions for thin-walled aeronautical and other heat exchangers.

An electronic-component carrier board includes carrier plates formed in a stack, and insulating layers each disposed between two adjacent ones of the carrier plates. Multiple conductive pins extend through the insulating layers and the carrier plates. Multiple conductive wires equal in length and width are provided. Each conductive wire is connected to one of the conductive pins, covered by one of the insulating layers, disposed between two adjacent ones of the carrier plates, and extends outwardly from the stack of the carrier plates. A wiring method for the electronic-component carrier board is also disclosed.

The present invention relates to a release system (1, 2, 3, 4, 5), that includes a segmented structural element (10) comprising: a first segment (10a) designed to be coupled to a first structure, a second segment (10b) designed to be coupled to a second structure, and a solder joint (11) joining respective ends of said first (10a) and second (10b) segments, thus holding down the first and second structures with respect to one another; wherein said solder joint (11) is electromagnetically heatable and includes a solder alloy having a predefined melting temperature. The release system (1, 2, 3, 4, 5) is characterized by further including magnetic field generating means (13, PW1, PW2, PW3, PW4, PW5) configured to, upon reception of a release command, generate a time-varying magnetic field through the solder joint (11) such that to cause heating thereof up to the predefined melting temperature of the solder alloy, thereby causing melting of said solder alloy; whereby separation of the first (10a) and second (10b) segments is caused, thus enabling release of the first and second structures from one another.

A method for joining a modular hot gas component by welding and high-temperature soldering. In order to optimally join high-temperature components, a first component is plugged into pins of a second component, a soldering material is placed between the two components, and the pins of the second component are welded to the first component.

An LED tube lamp comprises a glass lamp tube having a main body, two end caps coupled to a respective end of the tube, an LED light strip adhered to inner circumferential surface of the tube by first adhesive, a plurality of LED light sources mounted on a mounting region, a power supply module having a circuit board and a plurality of electronic components mounted on the circuit board, a diffusion layer covering on outer surface or inner surface of the tube, and a protective layer being disposed on surface of the strip and having a plurality of first openings for disposing the plurality of LED light sources. The strip comprises the mounting region and connecting region at an end of the strip. The circuit board is substantially parallel with axial direction of the tube, electrically connects to the connecting region, and stacks with a portion of the connecting region.