A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

A method of manufacturing a saw blade includes placing at least one tooth in an holder where at least one face of the tooth is covered and at least one face of the tooth is exposed, coating the exposed face, and after the coating, joining the tooth to a blade backer at an uncoated face.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

The present disclosure relates to a brazing structure. The brazing structure may comprise a first portion and a second portion. At least one of the first portion or the second portion may include a connection-reinforcing surface. The connection-reinforcing surface may include a groove region and a filler placement region. The filler placement region may be configured to hold a filler material in solid state before brazing. The groove region may include a plurality of grooves where the filler material flows into after being melted. The first portion and the second portion may be connected by a braze joint formed by the filler material.

A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.

Component mounting machine includes head, a device for moving head, transfer unit, and a mounting controller. Circular plate is an example of a container in which paste is placed. The bottom face of circular plate and the upper surface of the side wall have a predetermined height relationship. Height sensor is disposed on the lower face of head. Height sensor measures the height of the upper surface of the side wall of circular plate, which is a measurement point. The mounting controller recognizes the height of the bottom face of circular plate or the height of the surface of coating film disposed on circular plate from the height of the top surface of the side wall of circular plate measured by height sensor.

Disclosed is a method for forming a hollow pipe-sandwiching metal plate and applications thereof. The hollow pipe-sandwiching metal plate comprises a first panel, a second panel, and multiple hollow pipes between the first panel and the second panel; gaps are arranged among the hollow pipes, and the hollow pipes are connected to the first panel and the second panel by brazing. The present disclosure further includes the applications of the hollow pipe-sandwiching metal plate. The hollow pipe-sandwiching metal plate has advantages, such as light weight, high strength, low stress, high temperature resistance, pressure bearing, thermal insulation and vibration isolation. The metal plate will not deform due to thermal difference, thereby providing permanent service life of the metal plate.

A method for brazing a first ceramic component and a second metal alloy component, to make a structural or external timepiece element, a zirconia-based ceramic is chosen for the first component and a titanium alloy for the second component, a first recess is made inside the first component, set back from a first surface in a junction area with a second surface of the second component, braze material is deposited on this first surface and inside each recess, the second surface is positioned in alignment with the first surface to form an assembly, this assembly is heated in a controlled atmosphere to above the melting temperature of the braze material, in order to form the braze in the junction area.

A method includes positioning a braze material along a defect of a component of a turbine system, positioning a cover over the braze material, and focusing a heat source on the cover to melt the braze material along the defect.

Mg and Bi are contained in each of a first fillet in a first braze joining portion in which a tube and a fin join, a second fillet in a second braze joining portion in which the tube and a header plate join, and a third fillet in a third braze joining portion in which the header plate and a tank body join. A concentration of Mg of each of the first to third fillets is from 0.2% or more to 2.0% or less by mass. When the tube includes a brazing material layer, a concentration of Mg of the tube at its plate thickness center is from 0.1% or more to 1.0% or less by mass. When the fin includes a brazing material layer, a concentration of Mg of the fin at its plate thickness center is from 0.2% or more to 1.0% or less by mass.