Soldering system includes a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection, and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.

A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

A flux coating device for a solar cell panel, can include a flux bath configured to receive flux and having an inlet and an outlet, in which the inlet and the outlet of the flux bath are configured to pass an interconnector below a surface of the flux, and the interconnector can include a wiring material including: a rounded portion or a circular cross-section, a core layer, and a solder layer formed on a surface of the core layer.

A flux coating device for a solar cell panel, can include a flux bath configured to receive flux and having an inlet and an outlet, in which the inlet and the outlet of the flux bath are configured to pass an interconnector below a surface of the flux, and the interconnector can include a wiring material including: a rounded portion or a circular cross-section, a core layer, and a solder layer formed on a surface of the core layer.

To provide a plate laminate type heat exchanger that is capable to be temporarily fixed easily and surely before brazing assembly and can be fabricated with good accuracy. In a plate laminate type heat exchanger using a cladding material cladded with a brazing material, in each of laminated plates, a round hole penetrating in a laminate direction is formed; a thin and long fixing pin is inserted into the round hole so as to communicate each of plates; the fixing pin is fixed to the round hole by expansion of the outer diameter only at one end part in the longitudinal direction of the fixing pin; and each of plates is temporarily fixed integrally.

To provide a plate laminate type heat exchanger that is capable to be temporarily fixed easily and surely before brazing assembly and can be fabricated with good accuracy. In a plate laminate type heat exchanger using a cladding material cladded with a brazing material, in each of laminated plates, a round hole penetrating in a laminate direction is formed; a thin and long fixing pin is inserted into the round hole so as to communicate each of plates; the fixing pin is fixed to the round hole by expansion of the outer diameter only at one end part in the longitudinal direction of the fixing pin; and each of plates is temporarily fixed integrally.

An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.

A soldering tool, comprising nozzle shaped soldering tip and a hot gas feed channel that runs in the soldering tip, wherein the hot gas feed channel includes openings that provide a hot gas exhaust, and wherein the soldering tip as well as a portion of a soldering environment is heatable by the hot gas, characterized in that the soldering tip includes one or plural contact surfaces that have a surface structure which corresponds to a surface structure of a soldering object so that the soldering object is thermally contactable by the soldering tip with a minimum heat resistance, wherein a hot gas jet that passes through the openings is forced to perform at least one directional reversal or directional deflection by placement of the soldering tip and contacting the soldering object.

The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: applying an insulating layer (20) (S1) onto the printed circuit (10), forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, filling the cavity (22) with a solder paste (3), positioning the SMD over the cavity (22) (S4), and applying a heat treatment (S5) to the printed circuit (10).

The invention relates to an apparatus for metering a medium comprising a base element provided for fastening to a robot, a metering valve movably supported at the base element, and at least one piezo actuator by which the metering valve is movable relative to the base element.