Systems and methods are disclosed herein relating to eliminating solder bridges between adjacent leads of small-pitch through-hole electrical components soldered to circuit boards using wave-soldering techniques. Several wave solder pallet insert patterns are disclosed. Each wave solder insert may include an insert pattern of peeling members is intended to eliminate solder bridges from various small-pitch component lead layouts.

A flux tool allows the elastic pad to pressurize each flux pin individually in a process of dotting flux, so that even though a wafer or die may be deformed, high-quality flux dotting is achieved. Specifically, the flux tool allows the elastic pad pressurizing the flux pins to be made of rubber, especially silicone, so that primarily, the flux pins are entirely pressurized uniformly by means of the elastic force of the elastic pad, and secondarily, each flux pin is individually pressurized against the underside of the elastic pad, thereby adjusting the heights of the flux pins upon flux dotting according to the flatness or bent shape of the wafer or die to minimize the flux dotting defects.

A soldering apparatus 100 including: a chamber 120 configured to contain solder and include an opening 122 configured to discharge the solder in a bottom surface or a side surface; a pump 140 configured to transport the solder to the chamber 120; and an inner bath 160 configured to communicate with the opening 120 and perform soldering using the solder fed through the opening 120.

A cordless, hand held soldering iron operable with a control station providing wireless temperature control functionality and a charging station.

A heat exchanger includes a plurality of members made of aluminum or aluminum alloy, and a bundling component. The bundling component includes a main body portion having an anchoring portion, and a band portion extending from the main body portion and having a section on an opposite side of a main body portion side anchored in the anchoring portion. The bundling component is made of aluminum or aluminum alloy. At least part of the bundling component and at least part of the plurality of members are secured to each other with a brazing material interposed between the parts.

A heat exchanger includes a plurality of members made of aluminum or aluminum alloy, and a bundling component. The bundling component includes a main body portion having an anchoring portion, and a band portion extending from the main body portion and having a section on an opposite side of a main body portion side anchored in the anchoring portion. The bundling component is made of aluminum or aluminum alloy. At least part of the bundling component and at least part of the plurality of members are secured to each other with a brazing material interposed between the parts.

A flux unit includes a flux supply device configured to eject flux to a storage tray, an ejection port configured to eject the flux, and an ejection port moving device configured to move the ejection port in the radial direction of the storage tray. By this, the flux is ejected in a wide range in the radial direction of the storage tray. Also, the storage tray is rotated by a tray rotation device. Thus, the film thickness of the flux ejected in the wide range of the storage tray is adjusted by a squeegee all at once. Thus, the time required for adjusting the film thickness of the flux can be reduced.

A flux unit includes a flux supply device configured to eject flux to a storage tray, an ejection port configured to eject the flux, and an ejection port moving device configured to move the ejection port in the radial direction of the storage tray. By this, the flux is ejected in a wide range in the radial direction of the storage tray. Also, the storage tray is rotated by a tray rotation device. Thus, the film thickness of the flux ejected in the wide range of the storage tray is adjusted by a squeegee all at once. Thus, the time required for adjusting the film thickness of the flux can be reduced.

The present application discloses a soldering apparatus including a driving portion for moving a soldering iron to perform soldering on a surface of an electronic board including soldering regions. The soldering regions have a base region and at least one replication region existing at a position different from the base region. The replication region has an arrangement pattern that is the same as an arrangement pattern of a soldering position in the base region. The soldering apparatus includes an input portion for receiving input of positional relationship data, which represents a positional relationship between the base region and the at least one replication region, and for receiving base pattern data, which represents the arrangement pattern of the soldering position in the base region. The soldering apparatus includes a controller which causes the driving portion to move the soldering iron based on the base pattern data and the positional relationship data in a soldering operation.

A robotic wire termination system for efficiently and accurately connecting a plurality of wires to an electrical connector having a plurality of connector pins with corresponding wire receptacles. The system generally includes a housing, a removable alignment plate, a robotic positioner, a heating device, a touch responsive display, and a control unit. The alignment plate removably holds a selected electrical connector in a specific position and orientation with the connector pins exposed in the housing and the wire receptacles exposed outside. The display provides a visual representation of the connector pins and selections of the connector pins. The control unit receives inputs indicating the pin selections and controls the robotic positioner to sequentially move the heating device along three orthogonal longitudinal axes to a series of heating positions relative to the selected connector pins to provide heat for melting solder to connect wires to the wire receptacles.