This bonding apparatus is provided with: a bonding mechanism which has a bonding surface that holds a semiconductor die in a detachable manner, with a film being interposed therebetween, and a heater that applies heat to the bonding surface; a film conveyance mechanism which supplies the film to the bonding surface; a remover bar which is able to enter between the film and the bonding surface; and a drive unit which drives the remover bar.

A soldering tip for a soldering iron is presented. In one aspect, the soldering tip is used in a hand-held soldering iron for soldering an electrical connection element on an electrically conductive structure on a substrate. The soldering tip includes a substantially hemispherical end portion. Also presented is a method for producing a pane with an electrical connection element using the soldering tip with a hand-held soldering iron.

A soldering apparatus includes a cooling zone, upper and lower vent holes, an external channel, a blower unit, a heat exchanger, a pair of bypass channels, and a ventilation plate. The vent holes are provided, respectively, above and below a pair of rails configured to transport a board in the cooling zone. The external channel connects the vent holes with each other outside the cooling zone. The blower unit causes gas in the external channel to flow through the upper vent hole, the cooling zone, and the lower vent hole. The heat exchanger is provided in a lower opening linked to the lower vent hole in the cooling zone. The pair of bypass channels deliver gas above the pair of rails to the lower opening while bypassing locations of the pair of rails. The ventilation plate is provided in a space formed between the pair of bypass channels.

Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.

A printing device includes a storage that stores allowable time for which use of solder supplied to a screen mask can be allowed, a timer that measures time for which the solder is supplied to the screen mask, a determination unit that determines whether or not the solder supplied to the screen mask has exceeded the allowable time based on time measured by the timer, and a notifier that notifies a worker in a case where the determination unit determines that the solder supplied to the screen mask has exceeded the allowable time. The timer measures time by weighting a measurement interval of time for which the solder is moved on the screen mask by a squeegee so as to become greater than a measurement interval of time for which the solder does not move on the screen mask.

An apparatus for manufacturing a semiconductor device includes a base portion, a bonding stage arranged on the base portion and having a placement surface for placing a substrate; and one or more connecting members which connect the base portion and the bonding stage, wherein at least one of the one or more connecting members is a connecting plate that deflects following the expansion and contraction of the bonding stage in the plane direction caused by a temperature change.

A smart soldering iron tip of a handheld soldering iron comprises a hollow cylindrical base; a pointed distal end; and a proximal end with an ID feedback device, which when read provides authentication information on the smart soldering iron tip.

A smart soldering iron tip of a handheld soldering iron comprises a hollow cylindrical base; a pointed distal end; and a proximal end with an ID feedback device including a conductive material coating, which when read provides authentication information on the smart soldering iron tip.

A device that is a handheld circular heating element for use in the construction industry is described. Specifically the device is useful for applying heat uniformly to a two-piece membrane for separation of the outer layer to allow the inner layer to be exposed. The device includes a handle, an electrical supply, an on/off switch and a heating element. The device uses electricity to heat the heat-emitting burner of the heating element, which is then placed next to the membrane. As the membrane is warmed, the two layers of the membrane are able to be separated, which exposes the inner membrane.

Provided is an attaching device that can convey a component, such as a nut, to a portion to be welded without using an air cylinder. The present invention provides an attaching device (100) that attaches a nut (240) to a bracket (230). The attaching device (100) has a component feeding part (10) that stores the nut therein, a welding part (40) that welds the nut to the bracket by using electrodes (41, 42), a conveying part (20) that conveys the nut stored in the component feeding part to a position where the nut is to be attached to the bracket, and a feeding head (30) that temporarily positioned between the electrodes (41, 42) and that places the nut conveyed from the conveying part on the lower electrode of the pair of electrodes.