A heat exchanger includes a plurality of members made of aluminum or aluminum alloy, and a bundling component. The bundling component includes a main body portion having an anchoring portion, and a band portion extending from the main body portion and having a section on an opposite side of a main body portion side anchored in the anchoring portion. The bundling component is made of aluminum or aluminum alloy. At least part of the bundling component and at least part of the plurality of members are secured to each other with a brazing material interposed between the parts.

A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.

A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.

Soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, with an entry and an exit for feeding and removing the printed circuit boards, with a process channel including a preheating zone, a soldering zone and/or a cooling zone, and including a main body and at least one cover hood movable between a closed position and an open position, the cover hood enclosing a hood compartment above the process channel in which fan motors are provided. A central suction channel is provided in the hood compartment, in that the first suction elements connected to the suction channel in the hood compartment are provided for the suction of hood compartment air from the hood compartment, in that second suction elements connected to the suction channel in the hood compartment are provided for the suction of process gas from the process channel, and in that a switching device is provided and is configured to switch between an operating mode in which hood compartment air is suctioned via the first suction elements and a cooling mode in which process gas is suctioned via the second suction elements.

A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.

A solder ball bonding tool includes a nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the nozzle to retain a solder ball therein. A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder balls for which the retention structures are positioned to retain. The nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder.

The present disclosure discloses a reflow oven, comprising a heating zone, a cooling zone, a barrier and exhaust zone, a gas exhaust passage, a gas exhaust power device, and a detection device. The heating zone comprises a heating zone inlet and a heating zone outlet. The cooling zone comprises a cooling zone inlet and a cooling zone outlet. The barrier and exhaust zone is located between the heating zone outlet and the cooling zone inlet. An inlet of the gas exhaust passage is communicated with the barrier and exhaust zone. The gas exhaust power device is disposed on the gas exhaust passage. The detection device is disposed on the gas exhaust passage and used for detecting parameters of gas in the gas exhaust passage, wherein the parameters of the gas reflect a blockage condition of the gas exhaust power device.

A butt position detecting method for a weld joint, when an arrangement direction of a first member and a second member is defined as a first direction, and a direction that is perpendicular to the first direction is defined as a second direction, the first member has a corner portion and a chamfer portion, and a two-dimensional displacement sensor is arranged at a position offset from the butt portion toward the first member side in the first direction, and such that an angle s at which the second direction and an optical axis direction of irradiation light of the two-dimensional displacement sensor intersect with each other and an angle a at which the second direction and a formation direction of the chamfer portion of the first member intersect with each other satisfy a condition expression: 0<s<a.

A butt position detecting method for a weld joint, when an arrangement direction of a first member and a second member is defined as a first direction, and a direction that is perpendicular to the first direction is defined as a second direction, the first member has a corner portion and a chamfer portion, and a two-dimensional displacement sensor is arranged at a position offset from the butt portion toward the first member side in the first direction, and such that an angle s at which the second direction and an optical axis direction of irradiation light of the two-dimensional displacement sensor intersect with each other and an angle a at which the second direction and a formation direction of the chamfer portion of the first member intersect with each other satisfy a condition expression: 0<s<a.

The present invention relates to a soldering tip fastening sleeve (3) comprising a soldering device fastening portion (7) and a soldering tip fastening portion (6). The soldering device fastening portion (7) has an internal measurement (15) and an external measurement. Also the soldering tip fastening portion (6) has an internal measurement (16) and an external measurement (14) as well as a collar holder (10). The soldering tip fastening portion (6) and the soldering device fastening portion (7) are associated with different ends of the soldering tip fastening sleeve (3). The soldering tip fastening sleeve (3) according to the present invention is characterized in that the collar holder (10) is provided on a first subsector (17) of a circumference of the soldering tip fastening sleeve (3). The present invention also relates to a soldering tip (2) comprising a soldering portion (4) and a fastening portion (5). The soldering tip (2) is adapted to be fixed to a soldering device (30) through the fastening portion (5), a maximum external measurement (5a) of said fastening portion (5) being equal to or smaller than a maximum external measurement (4a) of the soldering portion (4), or the soldering portion being angled. The soldering tip (2) according to the present invention is characterized in that the fastening portion (5) comprises a collar (9).