A method for repairing a crack in a structure includes mounting a manifold to the structure around the crack. The structure has a nonplanar surface contour that surrounds the crack. The manifold has a base portion, a cover portion, and a plug. The base portion has a grip surface configured to conform to the nonplanar surface contour of the structure. The cover portion is connected to the base portion, and has an injection port and a vent port in fluid communication with a channel aligned to the crack. The injection port transfers a bonding material into and out of the channel. The plug closes and opens the vent port. The method includes filling the channel with the bonding material to direct the bonding material into the crack, and draining the bonding material from the manifold.

The steel cord cut end preparation device comprises a set of clamps for clamping a length of steel cord, a rotating driving unit for driving the clamped length of steel cord to be over-twisted and at least one cutter for cutting the steel cord at the over-twisted portion to make a cut end of steel cord, the steel cord cut end preparation device further comprises a heating unit for heating the clamped length of steel cord and a controller for controlling the heating unit and the rotating driving unit, so that the clamped length of steel cord is heated during, before or after it is over-twisted. By using this device, the steel cord welding success ratio is increased.

A method for making a bonded metal piece, including (a) obtaining a first piece of stock metal comprising a first surface and a second piece of the stock metal comprising a second surface; (b) smoothing the first surface so as to form a first contact surface and smoothing the second surface so as to form a second contact surface; (c) cleaning the first contact surface and the second contact surface; (d) loading the first piece and the second piece into a furnace; and (e) bonding the first piece to the second piece so as to form a bonded metal piece comprising the first contact surface diffusion bonded to the second contact surface. The bonding includes (i) heating the first piece and the second piece to a temperature below a superplastic forming temperature of the stock metal; and (ii) applying a pressure comprising pressing the first contact surface and the second contact surface together while the first piece and the second piece are at the temperature. In one or more examples, the bonded metal piece is machined (without forging or working into shape) into an aircraft part.

A method for the magnetic pulse soldering of an item having a stack of sheets consisting of a metal material. At least one hole through a thickness of the stack is formed. The first and second plates, both consisting of a metal material, are arranged on either side of the stack. A covering area covering at least one through-hole is formed. The plates-stack assembly is positioned opposite an active part of a coil such that a working area of the covering area faces the active part of the coil and the working area covering at least one hole. The working area is subjected to a magnetic field until the assembly is joined. While the working area is subjected to the magnetic field, pressure is exerted on the first plate, in the region of at least one hole, pressing the first plate against the second plate.

An ultrasonic welding apparatus joins metal pieces, such as wires, which are placed in a weldment zone where the metal pieces are subjected to pressure through a compressive height anvil and an adjustable width anvil, and intimate contact is made with a sonotrode of an ultrasonic stack. A first electric motor actuates movement of the height anvil to develop a compressive force for ultrasonic welding of the metal pieces. A second electric motor can position the width anvil before and during welding. A sensor, such as a load cell, measures the compressive force developed. The sensor directly can measure the load on the height anvil independent of the ultrasonic stack. A software algorithm can compensate for deflection of the load cell sensor and lost motion in the first electric motor actuating movement.

A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).

Provided is a joining method that can prevent a plastic flowing material from flowing out from a butt section and that can reduce the thickness and weight of metal members. The joining method is for joining a first metal member and a second metal member by using a rotary tool comprising a stirring pin, and is characterized in that: the stirring pin comprises a flat surface perpendicular to the rotation axis of the rotary tool and comprises a protruding section protruding from the flat face; and in a friction stirring step, the flat surface is brought into contact with the first metal member and the second metal member, and a front end face of the protruding section is inserted deeper than an upper overlapping section to join an upper front butt section and the upper overlapping section.

A wire bonding method includes bonding a tip of a wire provided through a clamp and a capillary onto a bonding pad of a chip, moving the capillary to a connection pad of a substrate corresponding to the bonding pad, bonding the wire to the connection pad to form a bonding wire connecting the bonding pad to the connection pad, before the capillary is raised from the connection pad, applying a electrical signal to the wire to detect whether the wire and the connection pad are in contact with each other, changing a state of the clamp to a closed state when the wire is not in contact with the connection pad and maintaining the state of the clamp in an open state when the wire is in contact with the connection pad, and raising the capillary from the connection pad while maintaining the state of the clamp.

Provided is a metal jointed body, joined by solid-phase joining in the atmosphere, in which no protrusion of molten joining material occurs, that improves dimensional stability. A metal jointed body is formed by (A) making Ag films of two metal laminated bodies opposed to each other, the metal jointed body being configured by sequentially laminating a Zn film and an Ag film on an Al substrate serving as a member to be joined, and (B) bringing the Ag films into contact with each other, then (C) heating is performed while pressurizing, and closely adhering and solid-phase joining the Ag films to each other. The completed metal jointed body is a portion where Al—Ag alloy layers are provided on both sides of an Ag—Zn—Al alloy layer to join the Al substrates to each other.

The invention relates to a sonotrode (218) of an ultrasonic welding device with a sonotrode body (224) with sonotrode head (220) with at least one working surface (230) extending in the longitudinal direction of the sonotrode head for welding or welding together and/or deforming and/or cutting at least one item of metallic welding material, wherein the sonotrode head has cross-sections which vary along the working surface in such a way that the cross-section of the sonotrode head in the end region of the working surface extending at the end face is greater than in the middle region of the working surface.