A wire guide module for an ultrasonic wire bonder, comprising a body made of a thermally stable metallic and/or ceramic material, wherein an elongated wire feed-through channel having a wire inlet opening and having a wire outlet opening is provided on the body, and comprising a guide tube provided in the wire feed-through channel. In addition, the invention relates to a thermosonic wire bonder having a wire guide module.

Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

An ultrasound horn is provided which vibrates a bonding tool, attached at a tip, in a plurality of directions with a simple structure. There is provided an ultrasound horn having: a longitudinal vibration generator; a horn portion; and a torsional vibration generator. The torsional vibration generator includes a body including a polygonal pillar portion, second layered elements in which a plurality of second piezoelectric elements are layered, and which are attached to side surfaces of the polygonal pillar portion, weights, and a pressure application ring which applies a pressure by pressing the second piezoelectric elements against the polygonal pillar portion via the weights.

System and methods for using analytics and algorithms to predict weld quality are provided and include a computer having a processor and memory configured to receive weld parameter data generated during a welding process by a welder to join at least two parts with a weld, input the received weld parameter data to a data analytics model to generate at least one predicted weld quality parameter, compare the predicted weld quality parameter with a weld quality parameter threshold, and generate output indicating at least one of: the at least one predicted weld quality parameter and a result of the comparison between the at least one predicted weld quality parameter and the weld quality parameter threshold

A method of joining a first component to a second component at respective connection surfaces, comprising, in order, applying a local surface treatment to the connection surface of at least one of the first and second components in order to locally alter the microstructure to a depth of between 60 μm and 10 mm below the connection surface; and joining the first component to the second component using a welding process.

A process for joining steel plate includes providing a steel plate and joining the steel plate to another material. The steel plate includes at least one surface having an Al—Si coating. The step of joining the steel plate to another material is performed while the steel plate is in an as- coated condition. Joining is performed using a forging process.

A welding and deburring system is provided for joining first and second work pieces to one another. The system includes a friction stir welding tool for joining the first and second work pieces to one another at a weld. The system further includes a deburring tool attached to the friction stir welding tool and removing a material flash generated at the weld. The system further includes one or more nozzles disposed in a fixed position relative to the friction stir welding tool, with the nozzles directing a cryogenic fluid to at least one of the friction stir welding tool, the deburring tool, the first work piece, the second work piece, and the weld.

A method of assembling together a first part and at least one second part that are made of materials compatible with bonding by molecular adhesion includes a step of pressing a first surface of the first part against a second surface of the second part so as to create molecular bonds at an interface between the parts, and a step of consolidating the interface bonding as created in this way by heat treatment. The consolidation includes a step of emitting a power laser beam towards an impact point forming a portion of the outline of the interface, and a step of moving the impact point along the outline of the interface.

A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.