A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

A bearing including a backing formed of a steel material, a lining formed of aluminum or an aluminum alloy, and a diffusion barrier layer disposed between the backing and the lining is provided. The diffusion barrier layer is formed of nickel or a nickel alloy and has a thickness ranging from 1 micron to 100 microns. The bearing is typically formed by cladding the lining or plating the steel backing with the diffusion barrier layer, bonding the lining and the backing with the diffusion barrier layer between, heating to a temperature of at least 400° C., and forming the bearing into a shape after or before the heating step.

A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.

A machine tool includes a first main shaft, a first drive source for moving the first main shaft, a second main shaft, a second drive source for moving the second main shaft, and a control means for carrying out a control so as to bring the workpiece held by the first main shaft and the workpiece held by the second main shaft into contact with each other while rotating them relative to each other, thereby to carry out the friction-heating, and to stop the relative rotation of the pair of workpieces and move only the second main shaft in the axial direction while holding the first main shaft stationary, thereby to carry out friction-welding of the pair of workpieces. The control means controls the operation of the first drive source upon the friction-welding of the pair of workpieces, so as to maintain the axial position of the first main shaft.

A system for securing first and second metal workpieces to a central metal workpiece located therebetween. The system includes clamps to secure the first and second metal workpieces in coaxial alignment with the central metal workpiece, which is rotatable about its axis. Heating elements heat opposed ends of the first metal workpiece and the central metal workpiece, and opposed ends of the second metal workpiece and the central metal workpiece, to a hot working temperature. While the opposed ends are at the hot working temperature, the heating elements are removed. The opposed end of the first metal workpiece is urged against the end opposed thereto of the rotating central metal workpiece, while the central metal workpiece rotates. At the same time, the rotating central metal workpiece is pulled against the second metal workpiece to engage the opposed ends thereof with each other. The workpieces are then allowed to cool.

Provided is a wire bonding state determination device which determines a bonding state between a pad and a wire after the wire is bonded to the pad. The wire bonding state determination device includes: a waveform detector which makes an incident wave incident to the wire, and detects a transmission waveform of the wire and a reflection waveform from a first bonding surface between the pad and the wire; and a bonding determination unit which determines the bonding state between the pad and the wire based on the transmission waveform and the reflection waveform detected by the waveform detector.

A method of manufacturing a heat exchanger is provided. The method includes forming a first substrate by additively manufacturing a body defining a first outer surface and a second outer surface opposite the first outer surface, a first partial fluid flow channel formed within the first outer surface, a second partial fluid flow channel formed within the second outer surface, and at least one internal fluid flow channel completely formed within the body, and coupling the first substrate to a second substrate including a partial fluid flow channel formed within a surface of the second substrate such that the first partial fluid flow channel of the first substrate and the partial fluid flow channel of the second substrate combine to form a combined fluid flow channel.

A method for bonding a first member having a first bond-target surface made of cycloolefin polymer to a second member having a second bond-target surface made of metal. The method includes a process of exposing the first bond-target surface and the second bond-target surface to at least one of the H.sub.2O plasma and O.sub.2 plasma, as well as a process of combining the first bond-target surface and the second bond-target surface.

Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. A heat sink comprises three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that two of the Cu layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. The heat sink has a low coefficient of thermal expansion and also has high thermal conductivity in the thickness direction because the thickness of each of the Cu layers which are the outermost layers is reduced, as compared with a heat sink of a three-layer clad structure having the same thickness and density.

The substrate joining method is a substrate joining method for joying two substrates, including a hydrophilic treatment step of hydrophilizing at least one of respective joint surfaces of the two substrates that are to be joined to each other and a joining step of joining the two substrates after the hydrophilic treatment step. The hydrophilic treatment step includes a step of performing a N.sub.2 RIE treatment to perform reactive ion etching using N.sub.2 gas on the joint surfaces of the substrates and a step of performing a N.sub.2 radical treatment to irradiate the joint surfaces of the substrates with N.sub.2 radicals after the step of performing the N.sub.2 RIE treatment.