Described is a design and method for producing a sputtering target assembly with low deflection made from target material solder bonded to composite backing plate with coefficient of thermal expansion (CTE) matching the target material. The composite backing plate is composite configuration composed of at least two different materials with different CTE. The composite backing plate, after plastic deformation, if necessary, has a CTE matching the target material and low and desirable deflection in the bonding process, and therefore, resulting in a low deflection and low stress target material bonded to composite backing plate assembly. The method includes manufacturing composite backing plate with a flat bond surface, heat treating of target blank and composite backing plate to achieve desirable shape of bond surfaces, solder bonding target to a backing plate, and slowly cooling the assembly to room temperature. Matching CTE in both target material and backing plate eliminates the problem of CTE mismatch and prevents the assembly from deflection and internal stress.

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.

A mobile waterstop welding apparatus includes a first and second support member for supporting a first and second waterstop section, respectively. The second support member is movable between a loading configuration, a heating configuration, and a welding configuration. In the loading configuration, the first and second support members are spaced apart so that the first and second waterstop sections may be loaded onto the first and second support members. In the heating configuration, the first and second support members are spaced apart so that a heating iron may be placed in-between respective welding ends of the first and second waterstop sections. In the welding configuration, the first and second support members are moved towards each other so as to weld the first and second waterstop sections together at their respective welding ends. During the welding process, a spring assembly may urge the first and second support members towards each other.

A method of constructing a plate fin heat exchanger includes joining a first side bar formed from a nickel-iron alloy to a first end of a fin element formed from a nickel-iron alloy through a first nickel-iron alloy bond, and joining a second side bar formed from a nickel-iron alloy to a second end of the fin element through a second nickel-iron alloy bond to create a first layer of the plate fin heat exchanger. The fin element defines a fluid passage.

The method for manufacturing a heat exchanger plate includes a lid groove closing process to insert a lid plate into a lid groove formed at a periphery of a concave groove opening to a surface of a base member; and a primary joining process to perform friction stirring while relatively moving a primary joining rotary tool equipped with a stirring pin along a butting portion of a side wall of the lid groove and a side surface of the lid plate, and in the primary joining process, the rotating stirring pin is inserted into the butting portion, and the friction stirring is performed in a state of only the stirring pin being in contact with the base member and the lid plate.

A brazing process using Nickel(Ni)-Carbon as graphite(Cg) alloys, Ni-Cg-Molybdenum(Mo) alloys, and Ni-Cobalt(Co)-Cg-Mo alloys for brazing together ceramics, ceramics to metals, metals to metals. Semiconductor processing equipment made with the use of Ni-Cg alloys, such as heaters and chucks. Semiconductor processing equipment components and industrial equipment components using a highly wear resistant surface layer, such as sapphire, joined to a substrate such as a ceramic, with a Ni-Cg alloy braze.

This diamond composite includes a first base substrate which has an oxide layer of element M and contains the element M in the composition and a second base substrate which is bonded to the oxide layer and is composed of diamond, in which the M is one or more selected from a metal element with which an oxide can be formed, Si, Ge, As, Se, Sb, Te, and Bi, and the second base substrate is bonded to the oxide layer of the first base substrate by M-O—C bonding of at least some C atoms on the surface of the diamond constituting the second base substrate.

A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.

A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

An exterior panel is formed of superplastic materials, including an exterior skin of titanium to accommodate high thermal stresses imposed on hypersonic transport vehicles during hypersonic flight. The exterior skin is fixed to an underlying reinforcing skeletal structure consisting of a superplastic formable reinforcement (SFR) layer, for example a titanium, zirconium, and molybdenum (TZM) alloy, which supports the exterior skin whenever the latter may be heated to temperatures exceeding 1200 degrees Fahrenheit. The exterior panel includes a separate interior skin configured for attachment to a frame member such as a rib, stringer, or spar of the hypersonic transport vehicle. A multicellular core is sandwiched between the exterior and interior skins to impart tensile and compressive strength to the exterior panel. In one disclosed method, the core is superplastic formed and diffusion bonded to the exterior and interior skins.