An ultrasonic welding device for a secondary battery is provided. The ultrasonic welding device is configured to weld an overlapping surface of an electrode tab and an electrode lead in an electrode assembly. The ultrasonic welding device includes an anvil on which the overlapping surface of the electrode tab and the electrode lead are disposed. A horn is configured to apply ultrasonic waves to the overlapping surface of the electrode tab and the electrode lead while pressing the overlapping surface. The overlapping surface is disposed on the anvil. An electrode tab measuring part is configured to measure a thickness of the electrode tab disposed on the overlapping surface. A pressure adjusting device is configured to adjust a pressure applied to the overlapping surface by the anvil and the horn according to the thickness value of the electrode tab. The thickness value is measured by the electrode tab measuring part.

A composite material structure includes a first metal member and a second metal member bonding to the first metal member. A bonding surface is formed therebetween. A first hole is through the first metal member. A circular bonding line is formed at a junction of a wall of the first hole and the bonding surface. A sleeve protrudes from the second metal member into the first hole, and covers the bonding line. A groove indents from the first metal member. The groove has a bottom surface located in the same plane with a top surface of the sleeve. A processing method of the composite material structure is also provided. The sleeve covers the bonding line between the first metal member and the second metal member, which allows the composite material structure to provide an improved sealing performance.

A resonance device that includes a MEMS substrate, a top cover, and a bonding part. The MEMS substrate includes a resonator. The bonding part is electrically conductive and bonds the MEMS substrate and the top cover to each other. The MEMS substrate further includes a wiring line layer and an anti-diffusion layer. The wiring line layer is electrically connected to a Si substrate serving as a lower electrode of the resonator. The anti-diffusion layer electrically connects the wiring line layer and the bonding part to each other.

A method of manufacturing a hollow aerofoil component 100 for a gas turbine engine 10 comprises joining a first panel 200 to a second panel 300 using bonding, and hot forming the panels into shape. The bonding step and the hot forming step are performed in the same rig, thereby optimizing process time and component quality.

A method of manufacturing a heat exchanger is provided. The method includes forming a first substrate by additively manufacturing a body defining a first outer surface and a second outer surface opposite the first outer surface, a first partial fluid flow channel formed within the first outer surface, a second partial fluid flow channel formed within the second outer surface, and at least one internal fluid flow channel completely formed within the body, and coupling the first substrate to a second substrate including a partial fluid flow channel formed within a surface of the second substrate such that the first partial fluid flow channel of the first substrate and the partial fluid flow channel of the second substrate combine to form a combined fluid flow channel.

A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.

Provided is a semiconductor device formed by performing bonding at room temperature with respect to a wafer in which bonded electrodes and insulating layers and are respectively exposed to front surfaces, including a bonding interlayer which independently exhibits non-conductivity and exhibits conductivity by being bonded to the bonded electrodes, between the front surfaces.

A friction stir welding apparatus includes a probe, a shoulder, a recess part, and an annular member. The probe is pressed to a joint part of a plurality of joined members while being rotated. The shoulder is formed so as to surround the probe at an outside in a radial direction with respect to a rotation axis of the probe. The recess part is formed on at least one of an outer circumference of the probe and an inner circumference of the shoulder. The annular member is fitted to the recess part.

A method of manufacturing a mechanical part of the present invention includes a first process of forming, by performing a folding processing to an end portion of the material, a portion to be processed having a structure, in which a plurality of layers respectively having a thickness corresponding to a plate thickness of a material overlap each other, in the material such that a plate thickness direction of the layer is orthogonal to a plate thickness direction of the material; and a second process of changing, by performing a forging processing to the portion to be processed, a shape of the portion to be processed to a target shape while press-welding the layers of the portion to be processed to each other by plastic deformation.

A pellicle support frame is provided with a frame body made of aluminum alloy and has a pellicle film bonded to the upper surface of the frame body and a transparent substrate bonded to the lower surface of the frame body. Within the frame body, a plurality of hollow portions are provided to be lined up in the circumferential direction of the frame body, and a through-hole which leads from the outer peripheral surface to the inner peripheral surface of the frame body is formed between two adjacent hollow portions. This configuration makes it possible to prevent strain from arising in the support frame and the transparent substrate after the support frame is bonded to the transparent substrate.