A laser processing device and a laser processing method that are capable of forming a high-quality semiconductor film are provided. An ELA device (excimer laser annealing device) (1) includes a laser oscillator (10) that generates laser light for forming a polysilicon film by irradiating an amorphous silicon film over a substrate to be processed with the laser light, a pulse measuring instrument (100) for detecting first partial light and second partial light contained in the laser light, and a monitoring device (60) for comparing a detection result of the first partial light with a detection result of the second partial light.

In a first aspect, the invention relates to a laser treatment head comprising an input for a laser bundle, and further provided with a lens system for focusing the laser bundle and a scanning system for deflecting the laser bundle according to a one-dimensional or two-dimensional touch pattern. In particular, the laser treatment head further comprises an directional body configurable relative to the casing between at least a first position and a second position, for variably emitting the deflected laser bundle with said touch pattern, in at least a first or a second emission direction. In further aspects, the invention relates to a laser treatment device and a laser treatment process.

A substrate having a first side and a second side opposite to the first side is processed by attaching a protective film to the first side and, after attachment, processing the substrate from the second side of the substrate. After processing from the second side, the second side is inspected for defects on the second side of the substrate. After inspection for defects, a support film is attached to the second side of the substrate. The protective film is removed from the first side of the substrate and, after removing the protective film, the first side of the substrate is inspected for defects on the first side of the substrate.

A laser processing apparatus of the present disclosure controls outputs of a blue laser oscillator and an infrared laser oscillator such that before a surface melting is detected on a workpiece, the workpiece is irradiated with at least blue laser light, and after the surface melting is detected on the workpiece, a power of infrared laser light with which the workpiece is irradiated is increased as compared to before the surface melting is detected.

A method for separating a solid body includes: providing a first solid body having opposite first and second surfaces and a crystal lattice, and that is at least partially transparent to a laser beam emitted by a laser; modifying a portion of the crystal lattice by the laser beam, the laser beam penetrating through the first surface, the modified portion of the crystal lattice extending in a plane parallel to the first surface, as a result of the modification, subcritical cracks are formed arranged in a plane parallel to the first surface, a plurality of the subcritical cracks forming a detachment region in the first solid body, the plurality of the subcritical cracks passing at least in some sections through the modified portion of the crystal lattice; and separating the first solid body along the detachment region to form a wafer and a second solid body.

A method of making a fluid injector for a gas turbine engine includes depositing material onto a piece of tube stock. The method includes machining the deposited material into a fluid injector component. Depositing can include laser cladding the material onto the piece of tube stock. The method can include placing or flowing braze into a braze joint location between the deposited material and another fluid injector component and forming the braze into a braze joint in the braze joint location.

A device for modifying a region of a substrate includes a laser radiation source for pulsed laser radiation. A transmissive medium having a higher intensity-dependent refraction index than air is arranged between a laser machining head and the substrate such that an individual pulse of the pulsed laser radiation from the laser machining head is deflected through the transmissive medium and across a thickness of the substrate from an original focal depth to a focal depth different from the original focal depth to modify the substrate along a beam axis of the laser radiation in a region of a recess or through-opening to be formed in the substrate without removing an amount of the substrate material necessary to form the recess or through-opening. A length between the focal depths is greater than and extends across the thickness of the substrate.

A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (σ.sub.B) for separating the substrate along the separation line is smaller than a first reference stress (σ.sub.R1) of the substrate and such that an edge strength σ.sub.K of the separation edge obtained after separation is greater than a second reference stress (σ.sub.R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

A rechargeable battery pack unit encompassing a rechargeable battery cell, which includes a cell pole, and encompassing a current collector, the cell pole being integrally joined to the current collector in a connecting area, a ratio of a wall thickness of the cell pole and the thickness of the current collector being maximally, and the current collector being made of copper.

A method for hardening a transparent material includes the steps of introducing a material modification to the transparent material using a laser beam of ultrashort laser pulses of an ultrashort pulse laser so as to harden at least a portion of the transparent material.