Exothermic welding molds, weld-metal containing cartridges for such molds, and methods of use are provided. The mold, cartridges, and methods can provide interaction between the cartridge's disk member with the mold, which allows the housing member to be withdrawn from the mold while leaving the disk member and weld-metal in place. The interaction can be a rotational restraint alone, a vertical restraint alone, or combinations thereof. Alternately, the interaction can be an outward pressure on the housing member and/or disk member, a shear force on the housing member and/or disk member, or combinations thereof. The outward pressure on the housing member and/or disk member can alternately be provided without interaction between the disk member and the mold, but rather by the simple application of an internal pressure to the cartridge. The internal pressure can be applied by squeezing the walls of the cartridge and/or by depressing a pusher member.

The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FACW). In one embodiment, a tubular welding wire includes a sheath and a core, and the core comprises a rare earth silicide component (cerium, lanthanum, or a combination thereof). The core may also comprise an organic stabilizer component, a carbon component, and an agglomerate. The organic stabilizer component may comprise an organic molecule or organic polymer bound to one or more Group I or Group II metals. The carbon component may comprise graphite, graphene, carbon black, lamp black, carbon nanotubes, diamond, or a combination thereof. The agglomerate may comprise oxides of one or more Group I or Group II metals, titanium, and manganese.

The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FACW). In one embodiment, a tubular welding wire includes a sheath and a core, and the core comprises a rare earth silicide component (cerium, lanthanum, or a combination thereof). The core may also comprise an organic stabilizer component, a carbon component, and an agglomerate. The organic stabilizer component may comprise an organic molecule or organic polymer bound to one or more Group I or Group II metals. The carbon component may comprise graphite, graphene, carbon black, lamp black, carbon nanotubes, diamond, or a combination thereof. The agglomerate may comprise oxides of one or more Group I or Group II metals, titanium, and manganese.

An interlayered structure for joining of dissimilar materials, includes a first material substrate, a second material substrate having a composition dissimilar from a composition of the first material substrate, and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers' solubility within the composition of the first material substrate. The last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers' solubility within the composition of the second material substrate. At least one of the plurality of interlayers is a sintered powder interlayer.

Described herein are methods for and devices prepared from welding shape memory alloys. The weld produced from the present methods can approach 100% joint strength relative the ultimate tensile strength of the shape memory alloy, and are substantially free of heat affected zones and brittle intermetallics.

A method of manufacturing a plate-shaped solder according to the invention of the present application includes an aggregating step of aggregating a plurality of thread solders and a crimping step of crimping the plurality of aggregated thread solders to one another to form a plate-shaped solder. A manufacturing device of a plate-shaped solder according to the invention of the present application includes an aggregating portion for aggregating a plurality of thread solders and a crimping portion for crimping the plurality of thread solders to one another in the aggregating portion to form a plate-shaped solder.

A welded steel part obtained by welding a first sheet with a second sheet, at least one with a coating of aluminum alloy. The welding uses a welding wire which, after melting and cooling, constitutes a weld bead connecting the first sheet to the second sheet and being part of said welded steel part. The respective peripheral edge of the first and second sheets are in a joggled edge type configuration in which the peripheral edge of the first sheet is arranged above, and on or near the upper face of an end portion of the peripheral edge of the second sheet which is extended by an inclined junction portion, at least one part of the upper face of the inclined junction portion delimits at least laterally with the edge of the peripheral edge of the first sheet a groove receiving the weld bead, the inclined joining portion extending by a welding portion in longitudinal continuity with the peripheral edge of the first sheet.

Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.

Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.

The preparation and use of particulate metallic solder alloy having particles of a single chemical composition is described. The particles of the particulate metallic solder alloy have a bimodal size distribution in which particles in a smaller size range have a largest dimension that is smaller than a smallest dimension of particles in a larger size range of the bimodal distribution. In some examples the particles in the smaller size mode have dimensions in the range of 1 to 100 nm. In some examples, the particles in the larger size mode have dimensions in the range of 2 to 75 microns in dimension. In some examples, a halogen-free flux is used. In some examples, a solvent is used to make a paste.