B23K35/00

Filler for vacuum brazing of TU1 oxygen-free copper and application thereof

A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.

MULTI-PROCESS ALLOY CLAD
20220152982 · 2022-05-19 ·

A method of creating a clad metal part is provided. The method includes explosion bonding a plate comprised of a base layer and an interlayer. The explosion bonded plate is then cut into bars which are roll bonded with a clad layer. Ultimately a part is fabricated from the roll bonded bar. The solution enables parts to have material combinations and resulting physical properties more optimal for an application than a single bonding process.

INTERLINER FOR ROLL BONDED BRAZING SHEET
20220152750 · 2022-05-19 ·

An apparatus, material and method for forming a reliably roll-bonded, multi-layer aluminum alloy brazing sheet has a core of 2XXX, 3XXX, 5XXX or 6XXX alloy, a braze liner of 4XXX alloy and an interliner with Mn in the range of 0.2 to 1.0 wt. % and Si in the range of 0.31-1.0 wt. %. Alternatively, Mg in the range of 0.1 to 0.5 wt. % may be present in the interliner. Additional layers such as a second braze liner may be present for providing an inner surface of a heat exchanger. An additional interliner may optionally be used between the core the inner surface layer. The material may be used for highly corrosive environments like an EGR cooler.

SEMICONDUCTOR SUBSTRATE SUPPORT WITH MULTIPLE ELECTRODES AND METHOD FOR MAKING SAME
20220143726 · 2022-05-12 · ·

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

Heat exchanger and method of manufacturing the same

A method for manufacturing a heat exchanger (1) includes joining an inner fin (3) to a hollow structure (20) formed from at least two clad plates (200a, 200b) by heating and brazing a filler metal layer (B). Each clad plate has a core layer (A) composed of an aluminum alloy that contains Mg: 0.40-1.0 mass %. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass %, and further contains Li: 0.0040-0.10 mass %, Be: 0.0040-0.10 mass %, and/or Bi: 0.01-0.30 mass %. The inner fin is composed of an aluminum alloy that contains Si: 0.30-0.70 mass % and Mg: 0.35-0.80 mass %. A flux (F) that contains cesium (Cs) is applied along a contact part (201), and the vicinity thereof, of the at least two clad plates prior to the heating. A heat exchanger (1) may be manufactured according to this method.

MEDICAL DEVICE INCLUDING A SOLDERABLE LINEAR ELASTIC NICKEL-TITANIUM DISTAL END SECTION AND METHODS OF PREPARATION THEREFOR
20230302261 · 2023-09-28 ·

Shapeable guide wire devices and methods for their manufacture. Guide wire devices include an elongate shaft member having a shapeable distal end section that is formed from a linear pseudoelastic nickel-titanium (Ni—Ti) alloy that has linear pseudoelastic behavior without a phase transformation or onset of stress-induced martensite. Linear pseudoelastic Ni—Ti alloy, which is distinct from non-linear pseudoelastic (i.e., superelastic) Ni—Ti alloy, is highly durable, corrosion resistant, and has high stiffness. The shapeable distal end section is shapeable by a user to facilitate guiding the guide wire through tortuous anatomy. In addition, linear pseudoelastic Ni—Ti alloy is more durable tip material than other shapeable tip materials such as stainless steel.

Autonomous robotic thread for repairing structures

Embodiments of the present invention provides an approach for repairing defects in a structure, located in difficult to reach area, by using a self-guiding and self-melting robotic thread. The approach can use an external guidance system to find the target location of the structure and deploy a robotic thread to the defective area. Portion of the robotic thread contains a filler material can have similar materials to the structure. After the system has determined the size, length and volume of the repair, the system calculates the required length of the robotic thread and guides the thread to the defective area. Once the robotic thread is in place, the filler material begins to melt via heat. The filler material, in a melted and pliable state, can flow into the defect area. Once cooled, the filler material can now support the structure.

Aluminum airfoil

An airfoil includes a first airfoil piece and a second airfoil piece that is bonded to the first airfoil piece at a joint. The first airfoil piece and the second airfoil piece are formed of aluminum alloys. At least one of the aluminum alloys is an aluminum alloy composition that has greater than 0.8% by weight of zinc. The joint includes a braze element of magnesium, zinc, or combinations thereof in a higher concentration than in other portions of the first airfoil piece and the second airfoil piece.

Semiconductor substrate support with multiple electrodes and method for making same

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

Flux and solder paste

Provided is a flux that includes a heat-resistant activator having low reactivity with thermosetting resins, and a solder paste in which the flux is used. The flux includes 5 wt % or more and 20 wt % or less of any one of a dimer acid, a trimer acid, a hydrogenated dimer acid obtained by hydrogenating the dimer acid, and a hydrogenated trimer acid obtained by hydrogenating the trimer acid, on in total, of two or more of a dimer acid, a trimer acid, a hydrogenated dimer acid obtained by hydrogenating the dimer acid, and a hydrogenated trimer acid obtained by hydrogenating the trimer acid; 30 wt % or more and 70 wt % or less of a thermosetting resin; and 3 wt % or more and 15 wt % or less of an amine. The solder paste includes solder powder and the flux.