Aspects of the invention include receiving a printed circuit board (PCB) having one or more of mounting pads thereon, determining a stencil for applying a solder paste to the one or more mounting pads, the stencil having a smallest aperture for a component requiring a standoff, determining a maximum threshold size for standoff particles based on the smallest aperture, determining a first concentration of the standoff particles based on the smallest aperture, determining a minimum threshold size for standoff particles to create the standoff for the component, determining a second concentration of the standoff particles to create a three-standoff seating plane for the component, introducing the standoff particles to the solder paste, the standoff particles in the solder paste having a concentration between the first concentration and the second concentration, and a size between the maximum threshold size and the minimum threshold size.

A metal particle aggregate includes metal particles and an organic substance. The metal particles include first particles that contain one or both of silver and copper in an amount of 70% by mass or more relative to 100% by mass of all metals and have a particle diameter of 100 nm or more and less than 500 nm at a ratio of 20 to 30% by number, and include second particles that have a particle diameter of 50 nm or more and less than 100 nm, and third particles that have a particle diameter of less than 50 nm at a ratio of 80 to 70% by number in total. Surfaces of the first to third particles are covered with the same protective film.

Disclosed is a braze putty composition including a sacrificial binder, a first nickel alloy and a second nickel alloy, a method of making the putty, and a method for using this putty to repair castings.

A method of creating a clad metal part is provided. The method includes explosion bonding a plate comprised of a base layer and an interlayer. The explosion bonded plate is then cut into bars which are roll bonded with a clad layer. Ultimately a part is fabricated from the roll bonded bar. The solution enables parts to have material combinations and resulting physical properties more optimal for an application than a single bonding process.

Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

A solder composition for use in solder joints of printed circuit boards (PCBs), including a compound layer comprising an alloy of bismuth and tin; and a graphene coating positioned on the compound layer.

A method of making a particulate for an additive manufacturing technique includes receiving particulate at a chemical vapor deposition (CVD) reactor, flowing a hydrocarbon gas into the CVD reactor, decomposing the hydrocarbon gas in the CVD reactor, and depositing a carbonaceous coating on the particulate using a product of the decomposed hydrocarbon gas. The coating deposited over the particulate has a reflectivity that is lower than the reflectivity the underlying particulate body to reduce an energy input requirement for purposes of fusing the particulate into a layer of an article using an additive manufacturing technique. In embodiments, the coated particulate can be received at an additive manufacturing apparatus and fused into a layer of an article as a metallic-carbon composite using a high-density energy source.

A method of making a particulate for an additive manufacturing technique includes receiving particulate at a chemical vapor deposition (CVD) reactor, flowing a hydrocarbon gas into the CVD reactor, decomposing the hydrocarbon gas in the CVD reactor, and depositing a carbonaceous coating on the particulate using a product of the decomposed hydrocarbon gas. The coating deposited over the particulate has a reflectivity that is lower than the reflectivity the underlying particulate body to reduce an energy input requirement for purposes of fusing the particulate into a layer of an article using an additive manufacturing technique. In embodiments, the coated particulate can be received at an additive manufacturing apparatus and fused into a layer of an article as a metallic-carbon composite using a high-density energy source.

A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion includes a heater and a sensor disposed in the tip. The tip portion includes a tip memory device disposed at the handpiece. The tip memory device is configured to store parametric data. The tip memory device is configured to exchange data with the controller.

A car body (1) includes a nut plate (2) predominantly made of hardened steel, wherein the hardened steel of the nut plate (2) is welded directly to the car body (1). A nut plate (2) as for use in direct welding to a car body (1) is also provided. A method for mounting a nut plate (2), which is predominantly made of hardened steel, to a car body (1), wherein the method involves welding the hardened steel of the nut plate (2) to the car body (1).