Disclosed is an apparatus for the batch polishing of workpieces, the apparatus includes an annular cavity, in which several workpieces are mounted, magnetic abrasives, which are arranged in the annular cavity and used for polishing the workpieces, and multiple magnet sets, which are used for generating a magnetic field for the magnetic abrasives in order to remove a surface material of the workpieces, wherein each of the magnet sets comprises magnets arranged on both inner and outer sides of the annular cavity and configured to rotate about the axis of the annular cavity.

A wafer producing apparatus detects a facet area from an upper surface of an SiC ingot, sets X and Y coordinates of plural points lying on a boundary between the facet area and a nonfacet area in an XY plane, and sets a focal point of a laser beam having a transmission wavelength to SiC inside the SiC ingot at a predetermined depth from the upper surface of the SiC ingot. The predetermined depth corresponds to the thickness of the SiC wafer to be produced. A control unit increases the energy of the laser beam and raises a position of the focal point in applying the laser beam to the facet area as compared with the energy of the laser beam and a position of the focal point in applying the laser beam to the nonfacet area, according to the X and Y coordinates.

A wafer producing apparatus detects a facet area from an upper surface of an SiC ingot, sets X and Y coordinates of plural points lying on a boundary between the facet area and a nonfacet area in an XY plane, and sets a focal point of a laser beam having a transmission wavelength to SiC inside the SiC ingot at a predetermined depth from the upper surface of the SiC ingot. The predetermined depth corresponds to the thickness of the SiC wafer to be produced. A control unit increases the energy of the laser beam and raises a position of the focal point in applying the laser beam to the facet area as compared with the energy of the laser beam and a position of the focal point in applying the laser beam to the nonfacet area, according to the X and Y coordinates.

Methods and devices for treatment of metal surfaces by means of electrically active solid particles that include a step of contact of the solid particles with the electrode of an electric source, a step of shooting the particles towards the metal surface to be treated and a step of transmission of electric charge of the particles on the metal surface to be treated. The transmission of the electricity between the electric source and the metal surface during the step of shooting preferably is by net charge of the particles or by electric conductivity by contact or by electric conductivity by means of voltaic arches. The current applied to the electrode is preferably a DC or a current that contains positive sections and negative sections.

A grinding setting selection system for a robotic grinding system is presented. The system includes an abrasive rotational speed retriever that retrieves a current rotational speed of a grinder in the robotic grinding system. The system also includes an end effector load retriever that receives a current end effector load of an end effector in the robotic grinding system. The system also includes a material removal predictor that, based on the retrieved rotational speed and the end effector road, predicts a material removal rate. The system also includes a setting adjuster that, based on the predicted removal rate, provides a setting adjustment for the robotic grinding system. The setting adjustment alters a mechanical setting of the robotic grinding system. The system also includes a setting communicator that communicates the setting adjustment to the robotic grinding system.

A grinding setting selection system for a robotic grinding system is presented. The system includes an abrasive rotational speed retriever that retrieves a current rotational speed of a grinder in the robotic grinding system. The system also includes an end effector load retriever that receives a current end effector load of an end effector in the robotic grinding system. The system also includes a material removal predictor that, based on the retrieved rotational speed and the end effector road, predicts a material removal rate. The system also includes a setting adjuster that, based on the predicted removal rate, provides a setting adjustment for the robotic grinding system. The setting adjustment alters a mechanical setting of the robotic grinding system. The system also includes a setting communicator that communicates the setting adjustment to the robotic grinding system.

This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion containing a C.sub.4 to C.sub.40 hydrocarbon group; and a hydrophilic portion containing at least one group selected from the group consisting of a sulfinite group, a sulfate group, a sulfonate group, a carboxylate group, a phosphate group, and a phosphonate group; in which the hydrophobic portion and the hydrophilic portion are separated by zero to ten alkylene oxide groups. The polishing composition can have a pH of from about 2 to about 6.5.

This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion containing a C.sub.4 to C.sub.40 hydrocarbon group; and a hydrophilic portion containing at least one group selected from the group consisting of a sulfinite group, a sulfate group, a sulfonate group, a carboxylate group, a phosphate group, and a phosphonate group; in which the hydrophobic portion and the hydrophilic portion are separated by zero to ten alkylene oxide groups. The polishing composition can have a pH of from about 2 to about 6.5.

The invention discloses a manufacturing method for a soup pot with partial concave-convex patterns on an outer surface thereof. The method comprises: preparing a plane blank for forming a pot body; screen-printing a layer of ink with preset patterns on a surface of the blank of the pot body; screen-printing a layer of ink with preset patterns on a bottom surface of the blank of the pot body; etching at positions where no patterns occurs on the surface of the blank of the pot body; stretching the blank of the pot body to form a soup pot, and flashing the edge of the pot body; and spraying a nonstick pan coating on the blank of the pot body, and polishing with abrasive paper at positions where the convex patterns occur and where no pattern occurs.

A sputtering target that is less likely to cause abnormal discharge is manufactured. A method for manufacturing a sputtering target includes performing multi-stage polishing on a sputtering surface of a target material having a Vickers hardness of 100 or less being made of metal by using a plurality of abrasives having different grit numbers in ascending order of grit number from a small grit number to a large grit number.