Patent classifications
B24B1/00
Glass article and method for producing the same
A method for producing a glass article is provided. The method for producing a glass article, the method including preparing a glass to be processed, the glass comprising a glass bulk and a low-refractive surface layer disposed on the glass bulk, and etching away the low-refractive surface layer to form an etched glass, wherein the etching away the low-refractive surface layer comprises: cleaning the low-refractive surface layer with an acid solution; and cleaning the low-refractive surface layer with a base solution after the cleaning it with the acid solution.
HARD WAFER GRINDING METHOD
A hard wafer grinding method includes a rough grinding step of forming a section along the diameter of a hard wafer into a centrally recessed shape by roughly grinding the hard wafer such that a central part of the hard wafer is thinner than a peripheral part of the hard wafer, a finish grinding step of expanding a ground area of the hard wafer from the peripheral part in an annular shape to the central part while dressing lower surfaces of finish grinding stones by the peripheral part of the hard wafer of the centrally recessed shape after the rough grinding, then setting the whole of a radius part of the hard wafer as the ground area, and further finish-grinding the hard wafer so as to obtain a predetermined thickness.
HARD WAFER GRINDING METHOD
A hard wafer grinding method includes a rough grinding step of forming a section along the diameter of a hard wafer into a centrally recessed shape by roughly grinding the hard wafer such that a central part of the hard wafer is thinner than a peripheral part of the hard wafer, a finish grinding step of expanding a ground area of the hard wafer from the peripheral part in an annular shape to the central part while dressing lower surfaces of finish grinding stones by the peripheral part of the hard wafer of the centrally recessed shape after the rough grinding, then setting the whole of a radius part of the hard wafer as the ground area, and further finish-grinding the hard wafer so as to obtain a predetermined thickness.
Surface processing method of disk member of sealing apparatus, and sealing apparatus
A sealing apparatus which is capable of preventing static leakage of a target to be sealed without increasing sliding resistance with respect to a shaft, and a surface processing method of a disk member of the sealing apparatus which is capable of processing a surface of the disk member, such as a slinger, provided at the sealing apparatus. A surface processing method of a disk member of a sealing apparatus for forming a plurality of fine spiral grooves on a surface of the disk member provided at the sealing apparatus has a grinding member having a plurality of fine projections that is moved to an outer edge side while the grinding member is pressed against the surface of the disk member which relatively rotates around an axis, and the sealing apparatus includes a slinger at which a plurality of fine spiral grooves are randomly formed on another side surface of a flange portion.
Temperature-based assymetry correction during CMP and nozzle for media dispensing
A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.
MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABLE TREATMENT TOOL
A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variables simultaneously, the controllable variables selected from the group consisting of (i) velocity, (ii) rotation, and (iii) dither of the treatment tool, and (iv) pressure of the treatment tool against the surface. The machine can move the treatment tool with six degrees of freedom.
Method of polishing silicon wafer including notch polishing process and method of producing silicon wafer
Provided are a method of polishing a silicon wafer and a method of producing a silicon wafer which can reduce the formation of step-forming microdefects on a silicon wafer. The method includes: a double-side polishing step of performing polishing on front and back surfaces of a silicon wafer; a notch portion polishing step of performing polishing on a beveled portion of a notch portion of the silicon wafer after the double-side polishing step; a peripheral beveled portion polishing step of performing polishing on the beveled portion on the periphery of the silicon wafer other than the beveled portion of the notch portion after the notch portion polishing step; and a finish polishing step of performing finish polishing on the front surface of the silicon wafer after the peripheral beveled portion polishing step. The notch portion polishing step is performed in a state where the front surface is wet with water.
Oxide chemical mechanical planarization (CMP) polishing compositions
The present invention provides Chemical Mechanical Planarization Polishing (CMP) compositions for Shallow Trench Isolation (STI) applications. The CMP compositions contain ceria coated inorganic metal oxide particles as abrasives, such as ceria-coated silica particles; chemical additive selected from the first group of non-ionic organic molecules multi hydroxyl functional groups in the same molecule; chemical additives selected from the second group of aromatic organic molecules with sulfonic acid group or sulfonate salt functional groups and combinations thereof; water soluble solvent; and optionally biocide and pH adjuster; wherein the composition has a pH of 2 to 12, preferably 3 to 10, and more preferably 4 to 9.
MOBILE CART COMBINING ELECTRICAL POWER GENERATION AND DUST COLLECTION
A combination cart providing independent electrical power generation and dust extraction capabilities finds utility in concrete processing and other operations that create unwanted dust using hand tools for cutting, grinding, polishing, coring, drilling, sanding, and the like. A propane tank powers a propane engine, and the propane engine drives an electrical generator providing power to an electrical outlet panel mounted on the frame. The cart further includes a dust extraction and filtration system driven by an electric motor, also mounted on the frame. The inventive cart facilitates multiple modes of operation, including: (a) dust extraction and filtration only, with the dust extraction system being powered by an available external source of electrical power; (b) electrical power generation only, with the dust extraction and filtration system being turned off; and (c) simultaneous dust extraction/filtration and electrical power generation, with the dust extraction and filtration system being powered by the electrical generator.
MOBILE CART COMBINING ELECTRICAL POWER GENERATION AND DUST COLLECTION
A combination cart providing independent electrical power generation and dust extraction capabilities finds utility in concrete processing and other operations that create unwanted dust using hand tools for cutting, grinding, polishing, coring, drilling, sanding, and the like. A propane tank powers a propane engine, and the propane engine drives an electrical generator providing power to an electrical outlet panel mounted on the frame. The cart further includes a dust extraction and filtration system driven by an electric motor, also mounted on the frame. The inventive cart facilitates multiple modes of operation, including: (a) dust extraction and filtration only, with the dust extraction system being powered by an available external source of electrical power; (b) electrical power generation only, with the dust extraction and filtration system being turned off; and (c) simultaneous dust extraction/filtration and electrical power generation, with the dust extraction and filtration system being powered by the electrical generator.