A workpiece has a device area and a peripheral area surrounding the device area on a front surface side thereof. A workpiece grinding method includes a groove forming step of performing grinding feed of a grinding unit while a spindle is rotated, and grinding a predetermined area on a back surface side of the workpiece, the predetermined area corresponding to the device area, in a state in which a chuck table holding the workpiece is not rotated, thereby forming a groove on the back surface side, a groove removing step of starting rotation of the chuck table while the spindle is kept rotating, thereby grinding side walls of the groove and removing the groove, and a recess forming step of performing grinding feed of the grinding unit while the spindle and the chuck table are rotated, thereby grinding the predetermined area and forming a recess and a ring-shaped reinforcement part.

A method for robotic machining is disclosed. The method includes determining a first designed machining path based on a modelled surface for a target surface to be machined. The method also includes causing a robot to machine the target surface based on the first designed machining path in an adaptive manner to obtain an actual machining path, wherein where the modelled surface is different from the target surface, the robot is caused to follow the target surface. The method further includes determining a second designed machining path for the target surface based on the actual machining path and the first designed machining path.

A wafer grinding method includes grinding a central portion of a wafer by using a plurality of abrasive members annularly arranged so as to form a circular ring, thereby forming a circular recess at the central portion of the wafer and simultaneously forming an annular projection around the circular recess, recognizing a height of a grinding unit after grinding the center by using a height recognizing unit and next storing the height recognized above, and grinding an upper surface of the annular projection to a predetermined value for a height of the annular projection previously set by a setting section as a grinding end height where the grinding of the annular projection by the grinding unit is ended.

A wafer grinding method includes grinding a central portion of a wafer by using a plurality of abrasive members annularly arranged so as to form a circular ring, thereby forming a circular recess at the central portion of the wafer and simultaneously forming an annular projection around the circular recess, recognizing a height of a grinding unit after grinding the center by using a height recognizing unit and next storing the height recognized above, and grinding an upper surface of the annular projection to a predetermined value for a height of the annular projection previously set by a setting section as a grinding end height where the grinding of the annular projection by the grinding unit is ended.

A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, and a liquid medium, in which a zeta potential of the abrasive grains is positive, and the hydroxy acid has one carboxyl group and one to three hydroxyl groups.

A grinding apparatus includes a grinding water supply mechanism that includes a plurality of jet nozzles that jet grinding water to outside surfaces of grindstones, communication passages that make each of the jet nozzles and a water supply source communicate with each other, and valves disposed in the communication passages on a jet nozzle basis, in which opening and closing of the valves are controlled according to the position of the chuck table relative to the grindstones such that the grinding water is jetted only to that region of the grindstones that makes contact with a workpiece.

A grinding apparatus includes a grinding water supply mechanism that includes a plurality of jet nozzles that jet grinding water to outside surfaces of grindstones, communication passages that make each of the jet nozzles and a water supply source communicate with each other, and valves disposed in the communication passages on a jet nozzle basis, in which opening and closing of the valves are controlled according to the position of the chuck table relative to the grindstones such that the grinding water is jetted only to that region of the grindstones that makes contact with a workpiece.

A composition comprises, consists of, or consists essentially of a polymer including a derivatized amino acid monomer unit. A chemical mechanical polishing composition includes a water based liquid carrier, abrasive particles dispersed in the liquid carrier, and a cationic polymer having a derivatized amino acid monomer unit. A method of chemical mechanical polishing includes utilizing the chemical mechanical polishing composition to remove at least a portion of a metal or dielectric layer from a substrate and thereby polish the substrate.

A composition comprises, consists of, or consists essentially of a polymer including a derivatized amino acid monomer unit. A chemical mechanical polishing composition includes a water based liquid carrier, abrasive particles dispersed in the liquid carrier, and a cationic polymer having a derivatized amino acid monomer unit. A method of chemical mechanical polishing includes utilizing the chemical mechanical polishing composition to remove at least a portion of a metal or dielectric layer from a substrate and thereby polish the substrate.

Emerald-cut diamond with length/width of 1.35 to 1.40; table of 55 to 60 percent; corner ratio of 13.5 to 14.5 percent; girdle thickness up to 3 percent; crown main angle of 28 to 45 degrees; first crown break angle of 2 to 6 degrees; second crown break angle of 2 to 6 degrees; pavilion main angle of 43 to 48 degrees; first pavilion break angle of 2 to 5 degrees; and second pavilion break angle of 2 to 5 degrees. Diamonds cut in accordance with these parameters may have light performance 0-grade domains on a grade map with wide crown and pavilion mains ranges. A method cuts the diamond according to the parameters, and may include selecting crown and pavilion main angles from the map, and cutting the diamond sufficiently close to the selected cutting parameters to obtain the light performance grade of 0.