A machining machine includes an annular bottom working disk and a top counter bearing element. The bottom working disk and top counter bearing element are driven to rotate relative to each other. A working gap is defined between the bottom working disk and the top counter bearing to machine flat work pieces on at least one side. A means for generating a local deformation of the bottom working disk are also provided.

A machining machine includes an annular bottom working disk and a top counter bearing element. The bottom working disk and top counter bearing element are driven to rotate relative to each other. A working gap is defined between the bottom working disk and the top counter bearing to machine flat work pieces on at least one side. A means for generating a local deformation of the bottom working disk are also provided.

The present invention provides a method for fabricating a super mirror finish stainless steel sheet uses the following steps: 1) rough machining, wherein a 400-450 grit sandpaper or scouring pad is used to remove an oxide layer on a surface of a stainless steel decorative sheet; 2) finish machining, wherein a 240-1,000 grit graphite grinding wheel is used to perform finish grinding; and 3) polishing processing, wherein an abrasive material is used to perform polishing. For the finish grinding and the polishing that are performed by using the grinding wheel and the abrasive material respectively, a multi-shaft polishing system is used to drive a grinding wheel, and a cylinder is controlled to adjust a force of each polishing shaft, which enables a stainless steel decorative sheet to have a surface finish under 0.01 μm and a reflectivity above 69%.

The present invention provides a method for fabricating a super mirror finish stainless steel sheet uses the following steps: 1) rough machining, wherein a 400-450 grit sandpaper or scouring pad is used to remove an oxide layer on a surface of a stainless steel decorative sheet; 2) finish machining, wherein a 240-1,000 grit graphite grinding wheel is used to perform finish grinding; and 3) polishing processing, wherein an abrasive material is used to perform polishing. For the finish grinding and the polishing that are performed by using the grinding wheel and the abrasive material respectively, a multi-shaft polishing system is used to drive a grinding wheel, and a cylinder is controlled to adjust a force of each polishing shaft, which enables a stainless steel decorative sheet to have a surface finish under 0.01 μm and a reflectivity above 69%.

A grinding apparatus for grinding a floor, the apparatus comprising a body having a travelling mechanism which enables the body to travel across a floor while the apparatus is grinding; a first grinding head incorporating at least one grinding tool and having an operable configuration in which the first grinding head is able to grind a first floor portion; and a second grinding head incorporating at least one grinding tool and having an operable configuration in which the second grinding head is able to grind a second floor portion; wherein the first and second grinding heads are mountable to the body whereby their positions relative to the body are able to be varied.

Embodiments of apparatus and method for chemical mechanical polishing (CMP) are disclosed. In an example, an apparatus for CMP includes a platen, a slurry supply, and at least one scraping fixture. The platen is configured to rotate a pad thereon about a central axis of the pad. The slurry supply is configured to supply a slurry onto the pad while the pad rotates. The at least one scraping fixture is configured to scrape the slurry off the pad when the slurry travels a distance between the slurry supply and the at least one scraping fixture in a circumferential direction of the pad as the pad rotates.

A substrate-cleaning apparatus may include a tilting arm to which a roll brush and a motor are coupled, a support arm positioned on the tilting arm, a first spring and a second spring coupling the tilting arm to the support arm, a first air bag and a second air bag mounted between the tilting arm and the support arm, and a controller configured to adjust an internal pressure of each of the first air bag and the second air bag. The controller may adjust a difference in internal pressure between the first air bag and the second air bag to control the inclination of the roll brush, and may adjust the internal pressure of each of the first air bag and the second air bag to move the roll brush vertically.

An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a front surface and the modified region closest to the front surface of the semiconductor substrate. The objective lens positions a virtual focus symmetrical with a focus with respect to the front surface in the inspection region. The light detection part detects light propagating from the back surface side of the semiconductor substrate to the back surface side via the front surface.

A substrate processing apparatus includes a pair of first substrate chucks each configured to hold a substrate from below while allowing a first main surface of the substrate to face upwards; a pair of second substrate chucks each configured to hold the substrate from below while allowing a second main surface of the substrate opposite to the first main surface to face upwards; a rotary table which is configured to be rotated about a rotation axis; a first processing unit equipped with a first processing tool configured to process the first main surface of the substrate held by the first substrate chuck; and a second processing unit equipped with a second processing tool configured to process the second main surface of the substrate held by the second substrate chuck.

An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a front surface and the modified region closest to the front surface of the semiconductor substrate. The objective lens positions a virtual focus symmetrical with a focus with respect to the front surface in the inspection region. The light detection part detects light propagating from the back surface side of the semiconductor substrate to the back surface side via the front surface.