In order to reduce edge defects efficiently and sufficiently, a method for manufacturing a SiC epitaxial wafer according to the present invention is a method for manufacturing a SiC epitaxial wafer that forms a SiC epitaxial layer on top of a SiC single crystal substrate having an off angle, and includes a rough polishing step for subjecting an outer circumferential edge on a starting side of step-flow growth in the SiC single crystal substrate to rough polishing before forming the SiC epitaxial layer; and a final polishing step for further polishing for finish.

In a machine and in a method for processing lateral edges of glass plates, plates of stone material, and plates of synthetic material, there is a group of gripping members of the plate configured to hold a plate in a horizontal position. The plate is caused to advance in a conveying longitudinal direction, in such a way as to bring a lateral edge of the plate to engage in succession an aligned series of grinding tools forming part of a stationary machining unit. In one example, the group of gripping members of the plate is rotatably carried around a vertical axis by a carriage, which is movable in the conveying longitudinal direction and in a transverse direction orthogonal to the longitudinal direction. The gripping members are carried by the carriage in such a way as to be adjustable in position, by means of electronically-controlled actuator devices, with respect to the carriage and relative to each other.

A silicon carbide single crystal substrate includes a first main surface, a second main surface, and a circumferential edge portion. The second main surface is opposite to the first main surface. The circumferential edge portion connects the first main surface and the second main surface. The circumferential edge portion has a linear orientation flat portion, a first arc portion having a first radius, and a second arc portion connecting the orientation flat portion and the first arc portion and having a second radius smaller than the first radius, when viewed along a direction perpendicular to the first main surface.

An attachment for a drill comprises a shank with a chuck configured to mount the attachment to the drill. A housing on the shank comprises a threaded end and a hollow chamber. A compression bladder having a tubular opening through it is configured to be inserted into the hollow chamber. A tube comprising a sanding or cleaning surface located on the inner surface of the tube is configured to be insertable into the tubular opening of the compression bladder. A threaded lid having a circular opening that is at least the same diameter as the inner diameter of the tube is configured to mount onto the housing at the threaded end and compress the compression bladder thereby reducing the diameter of the tubular opening and compressing the compression bladder against the tube to secure the tube within the housing.

A device for removing burrs from bolt holes of an aluminum alloy wheel is composed of a frame, a support plate, clamping guide rails, clamping motors, clamping sliders, support rods, clamping wheels, racks, gears, a brush disc, a support sleeve, a feed slide, guide pillars, a feed linear motor, a pitch adjustment linear motor, a conical pitch head, horizontal push rods, sliders, springs, burr brush drive motors and burr brushes. The device can meet the requirements of an automatic production line and can be used for automatically removing burrs from the inner walls of bolt hole countersinks. The device has certain flexibility and can adjust pitch diameter, can be used for removing burrs from bolt hole countersinks having different diameters, and is easy to manufacture, economical, practical and convenient to operate.

A synchronous grinding-deburring method and system for a valve spool based on measurement of an overlap value. In the system, a synchronous grinding-deburring machine is configured to complete automatic clamping of the valve spool workpiece and synchronous precise grinding-deburring processing of a working edge; a loading-unloading robot is configured to grab and transport the valve spool workpiece; and a charged-coupled device (CCD)-based industrial visual camera is provided to facilitate an automatic assembly of a slide valve pair; a computer-based pneumatic mate-grinding test bench for an electro-hydraulic servo valve is provided for automatic clamping of the servo valve and automatic detection of the overlap value of a servo valve; and an industrial control console is provided for real-time control of a complete workflow and adaptive control of a processing parameter.

A synchronous grinding-deburring method and system for a valve spool based on measurement of an overlap value. In the system, a synchronous grinding-deburring machine is configured to complete automatic clamping of the valve spool workpiece and synchronous precise grinding-deburring processing of a working edge; a loading-unloading robot is configured to grab and transport the valve spool workpiece; and a charged-coupled device (CCD)-based industrial visual camera is provided to facilitate an automatic assembly of a slide valve pair; a computer-based pneumatic mate-grinding test bench for an electro-hydraulic servo valve is provided for automatic clamping of the servo valve and automatic detection of the overlap value of a servo valve; and an industrial control console is provided for real-time control of a complete workflow and adaptive control of a processing parameter.

A method for manufacturing a wafer product, including the steps of: chamfering a circumferential edge portion of a wafer; lapping or double-side grinding main surfaces thereof; etching; mirror-polishing the main surface; and mirror-polishing the chamfered portion. The chamfered portion has a cross-sectional shape including: a first inclined portion continuous from the first main surface; a first arc portion continuous from the first inclined portion and having a radius of curvature; a second inclined portion continuous from the second main surface; a second arc portion continuous from the second inclined portion and having a radius of curvature; and an end portion connecting the first arc portion to the second arc portion. This provides a method for manufacturing a wafer by which a variation in a chamfered cross-sectional shape in a circumferential direction caused by etching can be suppressed.

A pipe de-burring assembly for de-burring a pipe and a pipe fitting includes a cylinder that has a pair of wells each extending therein to insertably receive a respective one of a pipe and a pipe fitting. A shaft extends lengthwise through the cylinder and the shaft is rotatably coupled to a power tool to rotate the cylinder. A plurality of first bristles is each of the first bristles is coupled to the shaft and each of the first bristles frictionally engages an inside surface of the pipe fitting for de-burring the inside surface of the pipe fitting. A plurality of second bristles is each coupled to the cylinder and each of the second bristles frictionally engages an outside surface of the pipe to de-burr the outside surface of the pipe.

Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, and a difference between D95 and D5 is 3 μm or more.