B24B21/00

POWERED TOOL SHARPENER WITH VARIABLE MATERIAL TAKE OFF (MTO) RATE
20180056469 · 2018-03-01 ·

A tool sharpener has a guide assembly to support a cutting tool adjacent an abrasive medium. A drive assembly advances the abrasive medium with respect to the guide assembly. A control mechanism provides a first control input value to move the medium and achieve a first material take off (MTO) rate during a coarse sharpening operation upon the tool. A second control input value from the control circuit moves the medium to achieve a lower, second MTO rate during a fine sharpening operation. The control mechanism transitions the medium from the first MTO rate to the second MTO rate responsive to a timer mechanism indicating a conclusion of a predetermined elapsed time interval.

Rotatable Edge Guide to Support a Cutting Tool During a Sharpening Operation
20180056468 · 2018-03-01 · ·

Apparatus for sharpening a cutting tool. In some embodiments, a tool sharpener includes an abrasive medium having an abrasive surface. A stationary tool support guide provides a guide surface that supports a side of the tool during presentation of a cutting edge of the tool against the abrasive surface. A rotatable edge guide has a roller member with a curvilinearly extending outer surface. The roller member is rotatable about an edge guide roller axis to engage, via rolling contact, the cutting edge during the presentation of the cutting edge against the abrasive surface.

DIAMOND SURFACE POLISHING METHOD AND APPARATUS FOR IMPLEMENTING SAME

The diamond surface polishing method according to the present invention involves polishing a polished object, the surface of which is made of diamond, by rubbing a polishing member having an elongated shape such as a linear or belt-like shape and containing at least a metal or a metal oxide against the diamond surface, wherein a pressing force of the polishing member is controlled in accordance with material properties of the polishing member and/or a shape of the polished object and a diamond crystal size in a rubbing section so that contact surface pressure in a machining area becomes uniform.

DIAMOND SURFACE POLISHING METHOD AND APPARATUS FOR IMPLEMENTING SAME

The diamond surface polishing method according to the present invention involves polishing a polished object, the surface of which is made of diamond, by rubbing a polishing member having an elongated shape such as a linear or belt-like shape and containing at least a metal or a metal oxide against the diamond surface, wherein a pressing force of the polishing member is controlled in accordance with material properties of the polishing member and/or a shape of the polished object and a diamond crystal size in a rubbing section so that contact surface pressure in a machining area becomes uniform.

Method for producing grooves on a camshaft
09862069 · 2018-01-09 · ·

In a method for end processing a surface of a shaft-like workpiece, the following steps are performed in the following series, and the workpiece rotates about an axis of rotation: a) finishing the surface with a first finishing tool, b) machining the surface with a scoring tool, whereby the scoring tool produces at least one groove running in a circumferential direction, whereby the at least one groove produces 3 to 12 profiled gorges on a reference segment which reference segment has a length that is predetermined by a measuring method for roughness determination and which is extending on the surface parallel to the axis of rotation, each of said profiled gorges having a depth and width, whereby the ratio of the depth and width of each profiled gorge is greater than 2 and a distance between adjacent profiled gorges is substantially the same,
c) machining the surface with the first finishing tool or a second finishing tool.

POLISHING APPARATUS AND POLISHING METHOD
20240416479 · 2024-12-19 ·

The present invention relates to a polishing apparatus and a polishing method. The polishing apparatus includes a holding stage (4), a polishing head (14), and a control device (1). The control device (1) includes a determination section (1d) that determines a removal of the film (F). The determination unit (1d) determines the removal of the film (F) when a rotational torque value is stabilized at a set torque value.

Skate blade and apparatus for removing material from a skate blade
12168279 · 2024-12-17 · ·

A blade for a skate for skating on ice. The blade includes ice-contacting material with an ice-contacting surface for contacting the ice. The ice-contacting surface has a machined longitudinal profile with a radius of curvature that varies smoothly over a majority of the length of the blade. Such a radius of curvature may, in some cases, be an elliptical arc.

Method for controlling repairing apparatus and repairing apparatus

The present application relates to a method for controlling a repairing apparatus and a repairing apparatus. The method for controlling the repairing apparatus includes: measuring, by a sensor, a height of a target object when a grinding part of the repairing apparatus completes positioning the target object; calculating an idle distance of a grinding belt on the grinding part in a predetermined process according to the height of the target object, in which, the predetermined process is the grinding part descending from the initial position to the highest position of the target object; and driving a motor to rotate back the grinding belt on the grinding part for the idle distance, and repairing the target object through the grinding belt on the grinding part.

Multiple degree of freedom compliant actuator force control systems and methods used in robotic paint repair

A robotic device that can include an end effector configured to manipulate one or more tools that drives one or more consumable abrasive products to abrade a substrate along several different surface dimensions, wherein the end effector comprises: three linear actuators each configured to move orthogonal relative to one another and at least one tool mount coupled to one of the three linear actuators and coupled to the tool.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
20250033164 · 2025-01-30 ·

A substrate processing apparatus includes: a substrate holder (5) having a suction holding surface (5a) configured to hold a first surface (2a) of a substrate (W); a processing head (7) arranged to process an outer circumferential portion of the substrate (W); a hydrostatic plate (9) having a fluid support surface (9a) facing the suction holding surface (5a); and a fluid supply line (10) coupled to the hydrostatic plate (9) and configured to supply fluid to a space between the fluid support surface (9a) and a second surface (2b) of the substrate (W). The second surface (2b) is an opposite side of the substrate (W) from the first surface (2a). The fluid support surface (9a) is larger than the suction holding surface (5a).