A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A finishing belt device includes a pressure apparatus having a pressure roller that applies a pressing force to the rear side of a finishing belt that, when viewed in the running direction of the finishing belt, an active side of the finishing belt is pressed against a peripheral surface to be finished of a workpiece in a linear contact region at the level of the pressing force. A pressure roller support is provided with the pressure roller arranged as a first pressure roller and another pressure roller is arranged as a second pressure roller. When viewed in the running direction of the finishing belt, the active side of the finishing belt is pressed against the peripheral surface to be finished of the workpiece in two spaced-apart linear contact regions via the two pressure rollers. The invention also relates to a method for finishing a peripheral surface of a cam surface.

A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate.

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.

A method for shortening one or more rotor blade(s) (2) of a turbomachine (3) by removal of material at the blade tip, and apparatus (1; 19) for carrying out the method: a belt grinding apparatus (1; 19) shortens the rotor blades (2) and a contour of the blade tip is generated by a relative movement of the blade tip along the static belt grinding apparatus.

An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.

The present disclosure provides a belt transmission device and a grinding apparatus. The device comprises: a grinding stand; rotation wheels mounted on the grinding stand, including a driver wheel and driven wheels; a grinding belt supported by rotation wheels; a first sensor fixedly provided on the grinding stand and configured to detect a rotation speed of any one of the driven wheels; and a controller configured to control a rotation speed of the driver wheel and connected with a driving motor of the driver wheel, wherein the controller is further connected with the first sensor, receives rotation speed signals of the one driven wheel detected by the first sensor, calculates difference between the rotation speeds of the driver wheel and the one driven wheel, and compares the difference with a predetermined difference range in the controller; and when the difference is beyond the predetermined difference range, an alarm is provided.

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

A belt-finishing device including a frame. A pressing arm is configured to pivotally mount on the frame. A pressing element, which is used to press a finishing belt against a workpiece surface to be treated, is arranged on the pressing arm. The device is provided with a position detection system for detecting a pressing-arm actual position that deviates from a desired position of the pressing arm. A malfunction or defect of the pressing element is detected by means of the pressing arm actual position that deviates from the desired position of the pressing arm.

A transverse hairline forming apparatus includes a coil supporting unit to which a stainless steel coil is rotatably disposed; a coil winding unit spaced apart from the coil supporting unit, the coil winding unit holding and winding an end of the stainless steel coil; and at least one pair of surface treatment units disposed between the coil supporting unit and the coil winding unit, the at least one pair of surface treatment units configured to form transverse hairlines on a surface of the stainless steel coil perpendicular to a winding direction of the stainless steel coil. While the stainless steel coil is unwound and rewound on the coil winding unit, when the stainless steel coil passes below the at least one pair of surface treatment units, the at least one pair of surface treatment units form the transverse hairlines on the surface of the stainless steel coil.