The present invention relates to a polishing head for pressing a polishing tape against a substrate, such as a wafer. The present invention further relates to a polishing apparatus for polishing a substrate with such a polishing head. The polishing head (10) includes a pressing mechanism (12) configured to press a polishing tape (2) against a substrate W, and a tape hook (40) configured to restrict movement of an edge of the polishing tape (2) in a direction toward the substrate (W). The tape hook (40) has a tape positioning surface (47) that faces a polishing surface of the edge of the polishing tape (2).

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.

A wafer polishing process includes polishing a central area on the back side of a wafer, polishing a peripheral area on the back side of the wafer, buffing the central area, and buffing the peripheral area. The process can significantly reduce scratch-related wafer breakage, can correct focus spots on wafers, and can replace cleaning processes that use chemical etchants. Polishing and buffing can include polishing and buffing the bevel region. Further improvements include polishing with abrasive pads having a soft backing, polishing or buffing with pads having relatively soft abrasive particles, polishing or buffing with abrasive pads made from abrasive particles that have been sorted and selected for regularity of shape, irrigating the surface being polished or buffed with an aqueous solution that includes a friction-reducing agent, and buffing with abrasive pads having 20k or finer grit or non-abrasive pads.

A device for finish-machining a workpiece in the form of a crankshaft or a camshaft includes a workpiece holder and a rotational drive configured to rotate the workpiece about a workpiece axis. A first finishing tool is configured to machine a main bearing which is concentric with the workpiece axis. A second finishing tool is configured to machine an additional bearing which is radially offset from the workpiece axis. A first tool drive is configured to generate an oscillating movement of the first finishing tool in a direction parallel to the workpiece axis. A second tool drive is configured to generate an oscillating movement of the second finishing tool which is independent of the movement of the first finishing tool in a direction parallel to the workpiece axis.

The present invention relates to a substrate polishing apparatus for polishing a substrate, such as a wafer, and more particularly to a substrate polishing apparatus for polishing a notch of a substrate, a bevel portion of the substrate, a device surface of the substrate, and a back surface of the substrate. The substrate polishing apparatus includes: a first polishing module; a second polishing module; and a third polishing module; wherein the first polishing module, the second polishing module, and the third polishing module are configured to polish different regions of a substrate.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof, wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.

At least one resurfacing system and at least one adjustment guide system for positioning a chuck holding a watch component relative to the resurfacing system. In example embodiments, the adjustment guide system includes one guide rail providing linear offset/distance and angular adjustment and guidance, or two perpendicular guide rails providing linear offset/distance and lateral position adjustment and guidance. Some embodiments include first and second resurfacing systems and a common rotary drive system that drives both the first and second resurfacing systems. The first resurfacing system can be a linear belt resurfacing system and the second resurfacing system can be a rotary disc resurfacing system. Some embodiments including the rotary disc resurfacing system have a metal rotary mounting disc driven by the drive system and a replaceable magnetic resurfacing disc that magnetically adheres to the rotary disc. Also disclosed is a method of resurfacing watches using these watch resurfacing devices.

An oscillating spindle sander assembly and a method for manufacturing an oscillating spindle sander assembly are provided. The assembly includes an oscillating spindle sander. The oscillating spindle sander includes an oscillation generator, a drive shaft extending from the oscillation generator, and a table disposed above the oscillation generator and having an opening that accommodates the drive shaft. The oscillating spindle sander assembly further includes a rotary compartment drum rotatably mounted under the table and around the oscillation generator. The rotary compartment drum includes a plurality of storage compartments arranged around a circumference of the rotary compartment drum.

An oscillating spindle sander assembly and a method for manufacturing an oscillating spindle sander assembly are provided. The assembly includes an oscillating spindle sander. The oscillating spindle sander includes an oscillation generator, a drive shaft extending from the oscillation generator, and a table disposed above the oscillation generator and having an opening that accommodates the drive shaft. The oscillating spindle sander assembly further includes a rotary compartment drum rotatably mounted under the table and around the oscillation generator. The rotary compartment drum includes a plurality of storage compartments arranged around a circumference of the rotary compartment drum.