An abrading apparatus (1) including a drum (2), a movable abrasive surface (4) about at least part of the circumferential surface of the drum (2) and a plurality of treatment chambers (5) mounted about the drum (2). Each treatment chamber (5) has upstream and downstream faces (53, 54), which describe an open side facing the drum (2), such that the abrasive surface (4) forms a wall of the chamber (5). The downstream face (53) of each chamber (5) is substantially aligned with a radial plane (R) of the drum (2).

A blade for a skate for skating on ice. The blade includes ice-contacting material with an ice-contacting surface for contacting the ice. The ice-contacting surface has a machined longitudinal profile with a radius of curvature that varies smoothly over a majority of the length of the blade. Such a radius of curvature may, in some cases, be an elliptical arc.

The wafer trimming device includes a chuck table configured to hold a target wafer via suction, thereby fixing the target wafer, a notch trimmer configured to trim a notch of the target wafer, and an edge trimmer configured to trim an edge of the target wafer. The notch trimmer includes a notch trimming blade configured to rotate about a rotation axis perpendicular to a circumferential surface of the target wafer. The edge trimmer includes an edge trimming blade configured to rotate about a rotation axis parallel to the circumferential surface of the target wafer.

An apparatus and a method which can perform different processes, such as polishing and cleaning, on a surface of a substrate, such as a wafer, with a single processing head, and can process the surface of the substrate efficiently are disclosed. The apparatus includes: a substrate holder configured to hold a substrate and rotate the substrate; and a processing head configured to bring scrubbing tapes into contact with a first surface of the substrate to process the first surface. The processing head includes: pressing members arranged to press the scrubbing tapes against the first surface of the substrate; position switching devices configured to be able to switch positions of the pressing members between processing positions and retreat positions; tape feeding reels configured to feed the scrubbing tapes, respectively; and tape take-up reels configured to take up the scrubbing tapes, respectively.

Wheel back cavity groove processing equipment is disclosed in the present application, which includes a lower lifting system, a central brush system, groove brush systems, a synchronous clamping and rotating system, a left brush system, a right brush system, an upper lifting system and the like. The wheel back cavity groove processing equipment not only may be used for removing burrs from wheel back cavity grooves, but also may be used for removing burrs from bolt holes, a center hole, spoke edges and transverse corners, and simultaneously has the characteristics of high automation degree, high removal efficiency, advanced process, strong generality, and high safety and stability.

Particular embodiments of the inventive technology relate to apparatus and methods for cutting multi-layered material to reconfigure it so it may be used to construct sub-compartments in a larger storage container. The inventive technology, in particular embodiments may feature one or more of the following: dual blades, “staggered” blades (where one blade is more forward than another), a blade(s) angled upwards and forwards, blades separated in a left-right direction, prong recesses to accept trailing tips of blades, a rearwardly angled handle and/or a removed material ejection ramp, in conjunction perhaps with other features such as, e.g., a guide prong. One or more of such features may appear in the various manifestations of a defluting cutter or through cutting apparatus, whether guided or unguided, and/or manual or powered.

Particular embodiments of the inventive technology relate to apparatus and methods for cutting multi-layered material to reconfigure it so it may be used to construct sub-compartments in a larger storage container. The inventive technology, in particular embodiments may feature one or more of the following: dual blades, “staggered” blades (where one blade is more forward than another), a blade(s) angled upwards and forwards, blades separated in a left-right direction, prong recesses to accept trailing tips of blades, a rearwardly angled handle and/or a removed material ejection ramp, in conjunction perhaps with other features such as, e.g., a guide prong. One or more of such features may appear in the various manifestations of a defluting cutter or through cutting apparatus, whether guided or unguided, and/or manual or powered.

The invention relates to a device (100) for machining a surface of a workpiece (200a). According to one embodiment, the device (100) comprises a frame (160) and a roller carrier (401), on which a first roller (101) is rotatably supported and which is supported on the frame (160) in such a way that the roller carrier can be moved in a first direction (x). The device (100) comprises at least a second roller (103), which is supported on the frame (160), and a belt (102), which is guided at least around the two rollers (101, 103) and because of the tension of which a resulting belt force (102) acts on the roller carrier (401). The device (100) also comprises an actuator (302), which is mechanically coupled to the frame (160) and the roller carrier (401) in such a way that an adjustable actuator force (FA) acts between the frame (160) and the first roller (101) in the first direction (x). The belt (102) is guided by means of the second roller (103), or by means of the second roller (103) and further rollers (101a, 101b, 121a, 121b, 105), in such a way that the resulting belt force (FB, FB′) acting on the roller carrier (401) acts approximately in a second direction (y) orthogonal to the first direction (x) in the case of a target deflection of the actuator (302).

A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.

A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.