Patent classifications
B24B21/00
A METHOD AND AN APPARATUS FOR ABRADING, AND PRODUCTS AND USES FOR SUCH
A continuous abrasive product includes predetermined length and number of predetermined kind of abrasive areas on an abrasive surface, A method for abrading a workpiece, includes arranging an abrasive area of an abrasive product at an abrading zone for abrading the workpiece, and after abrading, replacing the abrasive area at the abrading zone with an another abrasive area of the abrasive product for abrading the workpiece according to a subsequent abrading phase. The used abrasive area is replaced by an unused abrasive area of a different kind. The abrasive product comprises a continuous longitudinal abrasive material including at least two longitudinally sequential different abrasive areas having different kind of abrasive properties.
Wheel grinding device
A wheel grinding device consists of a lower lifting rotary system, spoke grinding units, a center hole grinding system and an upper lifting and clamping rotary system. The wheel grinding device not only can be used for grinding the center hole of a wheel of any size via brush units of the center hole grinding system, but also can be used for grinding the back of wheel spokes of different sizes and shapes via the actions of brush belts of the spoke grinding units.
Method and apparatus for polishing a substrate, and method for processing a substrate
A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.
AUTOMATIC BLADE HOLDER
The method is for profiling blades with a belt grinding profiling machine. The blades are mounted into a vise. A vertical position of the template is adjusted by rotating the rotatable knob. The motor is turned on to rotate the grinding belt over the grinding wheel. The guide wheel engages the underside profile of the template. The guide wheel of the template guides movement of the grinding wheel mounted on the common axle by moving the guide wheel along the underside profile of the template. The grinding belt grinds material off the underside of the blade until a portion of the underside profile of the template is copied to the underside of the blade.
METHOD FOR CONTROLLING REPAIRING APPARATUS AND REPAIRING APPARATUS
The present application relates to a method for controlling a repairing apparatus and a repairing apparatus. The method for controlling the repairing apparatus includes: measuring, by a sensor, a height of a target object when a grinding part of the repairing apparatus completes positioning the target object; calculating an idle distance of a grinding belt on the grinding part in a predetermined process according to the height of the target object, in which, the predetermined process is the grinding part descending from the initial position to the highest position of the target object; and driving a motor to rotate back the grinding belt on the grinding part for the idle distance, and repairing the target object through the grinding belt on the grinding part.
Polishing apparatus
A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.
Substrate processing method and apparatus
A substrate processing method which can clean a peripheral portion of a substrate after polishing and can check the cleaning effect of the peripheral portion of the substrate is disclosed. The substrate processing method includes polishing a peripheral portion of the substrate by pressing a polishing tape having abrasive grains against the peripheral portion of the substrate with a first head, cleaning the peripheral portion of the substrate by supplying a cleaning liquid to the peripheral portion of the substrate after polishing, bringing a tape having no abrasive grains into contact with the peripheral portion of the substrate after cleaning by a second head, applying light to the tape and receiving reflected light from the tape by a sensor, and judging that the peripheral portion of the substrate is contaminated when an intensity of the received reflected light is lower than a predetermined value.
Metal plate, patterning apparatus and patterning method using the same
Disclosed herein are a metal plate including a plurality of pattern portions, a patterning apparatus configured to form a plurality of patterns on the metal plate, and a patterning method using the same. The metal plate to be used in a household appliance includes a plurality of pattern portions in which a hairline pattern is formed on a surface of the metal plate, wherein the plurality of pattern portions includes a first pattern portion having a first hairline pattern and a second pattern portion having a second hairline pattern different from the first hairline pattern.
AUTOMATED WIRE DRAWING SYSTEM FOR SIDE WALL OF RAILWAY VEHICLE, AND WIRE DRAWING PROCESS
An automated wire drawing system for a side wall of a railway vehicle and a process method using the system for wire drawing operation are provided. The automated wire drawing system comprises a central control system, a robot, a wire drawing device, a railway, a laser measurement system, an offline programming software and an electronic system, so that the wire drawing operation of the side wall of a vehicle body can be automatically finished. The process method can realize the automated flexible and intelligent wire drawing operation, the change of the surface shape of a work piece within a certain range can be automatically adopted, and a constant normal wire drawing force is always maintained, to achieve the optimal wire drawing effect.
Polishing apparatus and polishing method
To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.