A method for dispensing solid compound pastes for surface treatment to a machining tool comprises the steps of providing a solid compound paste for surface treatment that contains abrasives, softening at least a partial amount of the solid compound paste by supplying thermal energy, feeding the softened solid compound paste to a dosing device by means of a conveyor device that is adapted for abrasive media, and applying the softened solid compound paste to a machining tool by means of the dosing device. A device for dispensing solid compound pastes for surface treatment to a machining tool comprises a heating device that is arranged to heat a solid compound paste for surface treatment that contains abrasives, wherein at least a partial amount of the solid compound paste is arranged to be softened by supplying thermal energy, a conveyor device having a pump unit comprising at least one pump and at least one conveyor path for the softened solid compound paste, wherein the pump is arranged for conveying abrasive media, and a dosing device arranged for applying the softened solid compound paste to a machining tool.

A method for dispensing solid compound pastes for surface treatment to a machining tool comprises the steps of providing a solid compound paste for surface treatment that contains abrasives, softening at least a partial amount of the solid compound paste by supplying thermal energy, feeding the softened solid compound paste to a dosing device by means of a conveyor device that is adapted for abrasive media, and applying the softened solid compound paste to a machining tool by means of the dosing device. A device for dispensing solid compound pastes for surface treatment to a machining tool comprises a heating device that is arranged to heat a solid compound paste for surface treatment that contains abrasives, wherein at least a partial amount of the solid compound paste is arranged to be softened by supplying thermal energy, a conveyor device having a pump unit comprising at least one pump and at least one conveyor path for the softened solid compound paste, wherein the pump is arranged for conveying abrasive media, and a dosing device arranged for applying the softened solid compound paste to a machining tool.

A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.

A glassware polishing system includes a base and a wall extending upward from the base. The wall circumscribes and defines a chamber within an inner side of the wall. A first polishing head having a first spindle extends upward from the base within the chamber and has a polishing material disposed about the first spindle. A second polishing head having a second spindle extends upward from the base within the chamber and has a polishing material disposed about the second spindle. At least one motor is disposed in the base and is configured to rotate the polishing heads about vertical axes of rotation defined by the spindles. The polishing heads may simultaneously polish internal and external surfaces of the glassware when the first polishing heads are rotated by the at least one motor.

A carrier head for holding a substrate in a polishing system includes a housing, a first flexible membrane secured to the housing to form one or more pressurizable chambers to apply pressure through a central membrane portion of the first flexible membrane to a central portion of a substrate, and a plurality of independently operable piezoelectric actuators supported by the housing, the plurality of piezoelectric actuators positioned radially outward of the central membrane portion and at different angular positions so as to independently adjust pressure on a plurality of angular zones in an annular outer region of the substrate surrounding the central portion of the substrate.

A system for robotic paint repair that can include a consumable abrasive product configured to abrade a substrate, a tool configured to drive the consumable abrasive product to abrade, a backup pad configured to couple with the consumable abrasive product, a robotic device configured to manipulate the tool, a pressure regulating apparatus mountable to the robotic device and configured to apply a desired pressure to the consumable abrasive product, a sensor configured to measure at least one of a rotational velocity of the backup pad or a debris pattern from the substrate that results from abrading, and a pressure controller configured to control the pressure regulating apparatus to apply the desired pressure based upon the at least one of the measured rotational velocity of the backup pad or the measured debris pattern.

A system for monitoring contamination level of effluent of an offline brush conditioning system includes a first set of reservoirs configured to collect first effluents from corresponding portions of a first brush and a second set of reservoirs configured to collect second effluents from corresponding portions of a second brush, and the first and second effluents are from a fluid used to condition the first and second brushes that are configured to clean a surface of a semiconductor wafer. An effluent contamination monitor is configured to monitor contamination levels of the first and second effluents, wherein the monitored contamination levels may provide feedback for use in the brush conditioning.

A polishing machine with an automatic feed and discharge function includes a machine frame, a clamping mechanism, a polishing shaft, a feed mechanism and a discharge mechanism. The clamping mechanism, the discharge mechanism, the polishing shaft and the feed mechanism are mounted on the machine frame. Multiple polishing heads are mounted on the polishing shaft. The feed mechanism includes a feed frame, a sliding platform, a sliding drive member, multiple columns of storage mechanisms for storing polishing pads, and multiple columns of push mechanisms, and the number of the columns of the storage mechanisms matches the number of the columns of the push mechanisms. The feed frame is mounted on the machine frame. The sliding platform is slidably arranged on the feed frame. The storage mechanisms are mounted on the sliding platform. The push mechanisms are mounted on the feed frame and are located above the storage mechanisms.

A polishing machine with an automatic feed and discharge function includes a machine frame, a clamping mechanism, a polishing shaft, a feed mechanism and a discharge mechanism. The clamping mechanism, the discharge mechanism, the polishing shaft and the feed mechanism are mounted on the machine frame. Multiple polishing heads are mounted on the polishing shaft. The feed mechanism includes a feed frame, a sliding platform, a sliding drive member, multiple columns of storage mechanisms for storing polishing pads, and multiple columns of push mechanisms, and the number of the columns of the storage mechanisms matches the number of the columns of the push mechanisms. The feed frame is mounted on the machine frame. The sliding platform is slidably arranged on the feed frame. The storage mechanisms are mounted on the sliding platform. The push mechanisms are mounted on the feed frame and are located above the storage mechanisms.

A substrate processing method includes polishing a target surface of a substrate to be polished by moving a polishing brush in a horizontal direction while pressing the polishing brush against the polishing target surface of the substrate which rotates in a horizontal posture around a vertical axis. The polishing is performed while varying a rotation speed of the substrate and a moving speed of the polishing brush such that the rotation speed of the substrate decreases stepwise or continuously and the moving speed of the polishing brush in a radial direction of the substrate decreases stepwise or continuously as a distance from a center of rotation of the substrate measured in the radial direction of the substrate to a center of the polishing brush increases.