A foaming thermoplastic polyurethane resin is a reaction product of a polyisocyanate component containing a bis(isocyanatomethyl)cyclohexane and a polyol component. In a peak of chromatogram obtained by measurement of the foaming thermoplastic polyurethane resin with gel permeation chromatography, the area of a high molecular weight component having a weight average molecular weight of 400,000 or more with respect to the total area of the peak is 25% or more and 60% or less.

Provided is a composition for polishing silicon wafers, having an excellent effect of reducing haze and having low agglomerating property. A composition for polishing silicon wafers provided here includes: an amido group-containing polymer A; and an organic compound B not containing an amido group. The amido group-containing polymer A has, on a main chain, a building block S derived from a monomer represented by General Formula (1). Molecular weight M.sub.A of the amido group-containing polymer A and molecular weight M.sub.B of the organic compound B have a relation satisfying 200M.sub.B<M.sub.A. ##STR00001##

Provided is a composition for polishing silicon wafers, having an excellent effect of reducing haze and having low agglomerating property. A composition for polishing silicon wafers provided here includes: an amido group-containing polymer A; and an organic compound B not containing an amido group. The amido group-containing polymer A has, on a main chain, a building block S derived from a monomer represented by General Formula (1). Molecular weight M.sub.A of the amido group-containing polymer A and molecular weight M.sub.B of the organic compound B have a relation satisfying 200M.sub.B<M.sub.A. ##STR00001##

The present invention provides a liquid supplying device that can determine whether a CLC can be used appropriately. A liquid supplying device for supplying a liquid from a liquid source to a cleaning device is provided. The liquid supplying device includes a flow rate control device that measures a flow rate of a liquid from the liquid source and controls the flow rate based on the measured value, an IN-side pressure gauge provided between the liquid source and the flow rate control device and an OUT-side pressure gauge provided between the flow rate control device and the cleaning device.

The present invention provides a liquid supplying device that can determine whether a CLC can be used appropriately. A liquid supplying device for supplying a liquid from a liquid source to a cleaning device is provided. The liquid supplying device includes a flow rate control device that measures a flow rate of a liquid from the liquid source and controls the flow rate based on the measured value, an IN-side pressure gauge provided between the liquid source and the flow rate control device and an OUT-side pressure gauge provided between the flow rate control device and the cleaning device.

A workpiece processing method includes a resin coating step of coating a resin on a front surface of a workpiece, a resin curing step of applying an ultraviolet ray to the coated resin to be cured, a resin grinding step of grinding the cured resin with grinding stones to be flattened, and a workpiece grinding step of holding the flattened resin side of the workpiece on a chuck table and grinding the back surface of the workpiece with grinding stones. In the resin grinding step, grinding is performed while cleaning the resin stuck to the grinding stones. Accordingly, it is possible to grind the resin coated on the front surface of the workpiece and the back surface of the workpiece in the same apparatus.

A workpiece processing method includes a resin coating step of coating a resin on a front surface of a workpiece, a resin curing step of applying an ultraviolet ray to the coated resin to be cured, a resin grinding step of grinding the cured resin with grinding stones to be flattened, and a workpiece grinding step of holding the flattened resin side of the workpiece on a chuck table and grinding the back surface of the workpiece with grinding stones. In the resin grinding step, grinding is performed while cleaning the resin stuck to the grinding stones. Accordingly, it is possible to grind the resin coated on the front surface of the workpiece and the back surface of the workpiece in the same apparatus.

A specimen mover (100) for a grinding and/or polishing machine (120) is disclosed. The specimen mover (100) is configured for rotating one or more specimens (50) in abutment with a preparation surface (75) carried by the grinding and/or polishing machine (120) and the specimen mover (100) includes: a drive housing (20), a driveshaft (30) protruding from said drive housing (20), a thrust housing (10) disposed coaxially on said driveshaft (30) and including at least one thrust pad (12), and a specimen mover plate (15) disposed essentially coaxial with said thrust housing (10) and/or said driveshaft (30) The specimen mover is configured such that the thrust housing (10) is displaceable connected to the driveshaft (30) protruding from said drive housing (20) in a manner allowing the thrust housing (10) to move along, and relative to, the driveshaft (30) protruding from said drive housing (20).

A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice manner. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.

Provided are a composition for semiconductor treatment capable of suppressing damage due to corrosion to wiring or the like including tungsten on an object to be treated, and efficiently removing contamination from a surface of the object to be treated, and a treatment method using the composition for semiconductor treatment. The treatment method includes a step of, after subjecting a wiring board including tungsten as a wiring material to chemical mechanical polishing using a composition containing an iron ion and a peroxide, subjecting the wiring board to treatment with a composition for semiconductor treatment which includes: a compound (A) having two or more of at least one selected from a group consisting of tertiary amino groups and salts thereof; and a water-soluble compound (B) having a solubility parameter of 10 or more, and which has a pH of from 2 to 7.