Rotating applicators are disclosed. A disclosed example apparatus includes an inlet to receive a surface coating to be applied to a surface of a workpiece, a shaft having a fluid channel extending therethrough, where the fluid channel is in fluid communication with the inlet, and an applicator coupled to an end of the shaft, where the applicator has an opening in fluid communication with the fluid channel. The apparatus also includes a pump to cause the surface coating to flow from the inlet to the opening, and a motor to rotate the shaft while the applicator dispenses the surface coating from the opening.

The invention discloses a caliper repairing clamp, which relates to the technical field of calipers and comprises a machine body, wherein a polishing disc is arranged inside the machine body, a protective cover is arranged on the outer surface of the polishing disc, a moving table is arranged below the machine body, a polishing table is arranged above the moving table, a fixed table is fixedly connected to the upper surface of the polishing table, a first bearing is fixedly embedded inside the machine body, a rotating handle is arranged below the moving table, and a first threaded rod is fixedly connected to the upper surface of the rotating handle.

A tank polishing system for polishing a tank, the system includes a polishing cell housing a body polishing station and an end polishing station; an input window leading into the polishing cell; an output window leading out of the polishing cell; a robot having an arm with one or more vacuum cups to releasably secure to the tank via vacuum pressure, the robot housed within the polishing cell and to transfer the tank from the input window, to the body polishing station, to the end polishing station, and to the output window; a body polishing machine to polish the tank at the body polishing station; and a control system to receive user commands to operate the robot and the one or more polishing machine.

Disclosed in the application are a multifunctional wheel burr removing device, which includes a lower brush system, a turnover system, a synchronous clamping and rotating system, an upper brush system and the like. The multifunctional wheel burr removing device may be used for removing burrs from a riser, a cap seam allowance, a valve hole, bolt holes and bolt counter bores of a wheel, and has the characteristics of high automation degree, high removal efficiency, advanced process, strong universality, and safe and stable performance at the same time.

A planarization processing device for polishing a substrate, e.g., a semiconductor wafer, includes two planarization processing sections (SP1, SP2) that each include a holder (62) for holding a workpiece (W), a drive motor (71) that rotates the holder (62), a support plate (4) holds a pad (5), a linear guide (3) that guides reciprocal movement of the support plate (4) in a direction parallel to the surface of the pad (5), and a drive cylinder (72) that advances the holder (62) or the support plate (4) in a direction that intersects the surface of the workpiece W or the pad (5) to cause the opposing surfaces of the workpiece and the pad (5) to be at least proximal to each other. A primary driver (PD) causes the support plates (4) of the planarization processing sections (SP1, SP2) to reciprocate along the same straight line in opposite phases.

A finishing apparatus includes a workpiece-receiving device, a rotary drive configured to drive a workpiece in rotation about a workpiece axis and an oscillatory drive configured to produce a relative movement between the workpiece and a finishing tool in a direction that is parallel to the workpiece axis. A workpiece-conveying device has a workpiece holder that is moveable by a drive device between a working position in which the workpiece is in position to be machined and a loading/unloading position in which the workpiece is loadable/unloadable. The workpiece holder has a support device configured to support the workpiece. The drive device is formed as a swivel drive such that the workpiece holder is swivelable between the working position and the loading/unloading position along an arcuate swivel path.

A grinding apparatus includes a loading unit for loading a wafer to a chuck table having a holding surface for holding the wafer, an unloading unit for unloading the wafer from the chuck table, and a cleaning unit for cleaning the holding surface of the chuck table or the upper surface of the wafer held on the holding surface of the chuck table. The cleaning unit includes a cleaning portion and a horizontal moving portion for horizontally moving the cleaning portion in a lateral direction of the grinding apparatus. The loading unit has a first holding portion for holding the wafer, and the unloading unit has a second holding portion for holding the wafer.

The present application discloses a multifunctional wheel burr removing device, comprising a synchronous clamping drive system, a first burr brushing system, an upper burr brushing system and a second burr brushing system. The multifunctional wheel burr removing device in use may remove burrs of four parts. And the four parts are as follows: end faces of upper rims, wheel wells, cutting positions of sides of upper rims and fronts of wheels having different diameters and different heights. So the production efficiency is very high; and simultaneously, the device has the characteristics of high automation degree, advanced process, strong generality, safety and stability.

There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

A machine tool (1, 100) comprises a support structure (4, 104) and a machining head (8) bearing a mandrel (12). The machine further comprises at least one action device (20) contained on the support structure (4,104) and applied to it, which generates pushing or pulling actions on said support structure (4, 104) acting against the action of the weight of the head (8) thereon.