A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.

A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

A grinding machine includes a main part and an end case. A driving unit is connected to the end case and includes a first motor which has an output shaft with a groove. A grinding unit is connected to the end case, and cantilevered above the main part. The grinding unit includes a grinding wheel set which has a central axle with a slide. The slide is located in the groove of the output shaft of the first motor. A driving wheel is connected to the central axle. An adjustment device includes a second motor which drives an eccentric unit that has an eccentric axle, and the eccentric axle extends through a bearing which is located in a recess formed to the driving wheel. The driving wheel is driven by the eccentric unit to move the grinding wheel set of the grinding unit left and right.

The present disclosure provides a carbide blade grinding forming processing production line, relates to the field of blade processing in forming, and provides a production line for grinding forming processing of a carbide blade with inscribed circular holes, which has functions of blade grinding forming processing, blade cleaning and drying and detection of external dimension of a formed blade, and has an automatic loading and uninstalling function. In most processing course of the blade, the cutter head is taken as a carrier, and an overturning device is configured to overturn a whole cutter die box, such that integral end surface overturning of the cutter head in the cutter die box after single end surface grinding is realized, and blade filling processes in different processing links are reduced.

A surface preparation support apparatus includes a creeper and a linear actuator. The linear actuator includes a base-end and a tool-end that is opposite the base-end. The base-end is coupled to the creeper. The tool-end is linearly movable relative to the base-end. A surface preparation tool is coupleable to the tool-end of the linear actuator. The surface preparation support apparatus also includes an actuator-controller. The actuator-controller is coupled to the linear actuator. The actuator-controller is operable to selectively actuate the linear actuator. The surface preparation support apparatus further includes a tool-controller. The tool-controller is configured to be coupled to the surface preparation tool. The tool-controller is operable to selectively energize the surface preparation tool.

A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.

A power tool includes a housing, a motor that is disposed within the housing and defining a first axis, and a tool holder driven to oscillate about a second axis by the motor. The second axis is perpendicular to the first axis. The power tool also includes a vibration dampening assembly with a counterweight that is configured to reciprocate along a third axis that is perpendicular to both the first axis and the second axis in response to oscillation of the tool holder about the second axis.

Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.

The present invention relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the present invention relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head (10) includes an annular elastic member (40) configured to press a polishing tool (3) against the substrate (W), and a pressing-tool body (43) having a pressing surface (44) configured to press the polishing tool (3) against the substrate (W) via the elastic member (40), wherein the pressing surface (44) has a first fitting groove (45) in which a first portion (41) of the elastic member (40) fits, the first portion (41) protrudes from the pressing surface (44), the elastic member (40) is put on the pressing-tool body (43) with the elastic member (40) elastically deformed, and the polishing head (10) is configured to press the polishing tool (3) against the substrate (W) by the first portion (41).

A machined wheel post-processing equipment includes a wheel inlet roller way, a lower machine frame, lower guide posts, lower air cylinders, a supporting plate, guide sleeves, a lifting table, guide rails, a clamping cylinder, a left sliding plate, a right sliding plate, a rack and pinion, servomotors, a lifting roller way, clamping wheels, a first servomotor, and a overturning platform.