A method of manufacturing a window may include cutting a window having a uniform thickness of about 20 μm to about 100 μm and polishing a cut surface of the window with a polishing pad having an elastic modulus less than an elastic modulus of the window while applying slurry to the cut surface of the window.

An underwater polishing system according to the present disclosure includes a tank, a robot, and a polishing machine. In a state where a workpiece held by an arm portion of the robot, at least a part of a second rotating roller and at least a part of a polishing tool of the polishing machine are immersed in a liquid stored in the tank, the held workpiece is polished by operating the arm portion of the robot and pressing the held workpiece against the polishing tool.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

A double disc surface grinding machine includes a clamp band which has a non-circular outer circumferential portion. The clamp band is attached to an outer circumferential surface of a work and is housed, under the attached state, in a storage portion which has a non-circular inner circumferential portion engageable with the outer circumferential portion of the clamp band, movably in a first direction. A rotation drive unit rotates the storage portion around a first rotation shaft extending in the first direction, to make the inner circumferential portion of the storage portion engage with the outer circumferential portion of the clamp band, thereby rotates the clamp band and the work together with the storage portion. At least one of the grinding wheels is fed onto the work so as to sandwich the work with a pair of rotating grinding wheels for grinding two main surfaces of the work.

A semiconductor wafer is adhered and fixed to a polishing head by means of a conductive adhesive, and the wafer is connected to a positive electrode of an external power supply through wires of the inner and outer rings of a conductive slip ring below the wafer. A polishing pad is adhered to the bottom of a counter electrode disc, the counter electrode disc is fixed at the bottom of a polishing disc and is processed with through holes at the position corresponding to the polishing disc, and the counter electrode disc is connected to a negative electrode of the external power supply through the wires of inner and outer rings of a conductive slip ring above the counter electrode disc. Ultraviolet light emitted by an ultraviolet light source can reach the surface of the wafer through the through holes, and a polishing solution can be sprayed through the through holes into a contact area between the wafer and the polishing pad.

The invention discloses a caliper repairing clamp, which relates to the technical field of calipers and comprises a machine body, wherein a polishing disc is arranged inside the machine body, a protective cover is arranged on the outer surface of the polishing disc, a moving table is arranged below the machine body, a polishing table is arranged above the moving table, a fixed table is fixedly connected to the upper surface of the polishing table, a first bearing is fixedly embedded inside the machine body, a rotating handle is arranged below the moving table, and a first threaded rod is fixedly connected to the upper surface of the rotating handle.

A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first processing line and the second processing line, and a first retransfer robot configured to transfer a substrate from the front-end module to the first stage.

A vibration-reducing component and an apparatus for its use. The vibration-reducing component combines an elastic member with a compression element to both resist applied forces and absorb selected vibrations. The vibration reducing component finds particular utility in tools that inherently create vibrations.

A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.

Disclosed herein is a processing machine including a processing unit and a workpiece holding unit. The processing unit has a processor wheel with a processor fixed on a lower surface of an annular base, and a mount fixed on a spindle, and processes a workpiece by the processor with the processor wheel mounted on the mount. The processor wheel has a plurality of flange portions arranged at equal angular intervals on an inner peripheral surface of the annular base and extending from the inner peripheral surface toward a center of the processor wheel. The mount has a plurality of clasp portions configured to clasp the flange portions, a plurality of springs biasing the clasp portions in an upward direction in an axial direction of the spindle, and a plurality of support portions configured to support the clasp portions movably in the axial direction.