A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.

A processing system for processing spectacle lenses and a method for processing spectacle lenses are proposed. The processing system has several processing stations, in particular a milling station, a turning station, a polishing station, a cleaning station and/or a signing station. Furthermore, the processing system has a transport system for transporting the spectacle lenses and/or transport containers for the spectacle lenses. Preferably, the processing system also has a common base frame and/or a common casing for the processing stations. In the processing system and/or with the method, several spectacle lenses can be processed simultaneously in different processing stations.

A precision squeegee grinder including a grinder assembly configured to grind an edge of a squeegee blade, a squeegee mounting assembly configured to hold the squeegee blade, a grinder assembly vertically alignable with respect to the squeegee mounting assembly, a latitudinal movement assembly connected to the grinder assembly, the latitudinal movement assembly configured to position the grinder assembly with respect to the squeegee blade in defined increments, a longitudinal movement assembly connected to the latitudinal movement, the longitudinal movement assembly configured to move the grinder assembly along a width of the squeegee blade, and a base assembly. The grinder assembly, the squeegee mounting assembly, the latitudinal movement assembly, and the longitudinal movement assembly are connected to the base assembly. The squeegee mounting assembly, the latitudinal movement assembly, and the longitudinal movement assembly enable triaxial alignment between the grinder assembly and the squeegee blade.

A precision squeegee grinder including a grinder assembly configured to grind an edge of a squeegee blade, a squeegee mounting assembly configured to hold the squeegee blade, a grinder assembly vertically alignable with respect to the squeegee mounting assembly, a latitudinal movement assembly connected to the grinder assembly, the latitudinal movement assembly configured to position the grinder assembly with respect to the squeegee blade in defined increments, a longitudinal movement assembly connected to the latitudinal movement, the longitudinal movement assembly configured to move the grinder assembly along a width of the squeegee blade, and a base assembly. The grinder assembly, the squeegee mounting assembly, the latitudinal movement assembly, and the longitudinal movement assembly are connected to the base assembly. The squeegee mounting assembly, the latitudinal movement assembly, and the longitudinal movement assembly enable triaxial alignment between the grinder assembly and the squeegee blade.

The invention relates to a machine tool, hi particular a lathe grinding machine, comprising a tool spindle, a spindle motor and a tool clamped in a covet, with which tool a workpiece may be machined which may be moved in several axes relative to the tool, and comprising a control device for the tool spindle which controls the spindle motor. A spindle load detection device (24) which is connected with the control device (20) is provided and the control device (20) compares the output signal (26) of the spindle load detection device (24) with a predetermined threshold value (50), said threshold value (50) being below, in particular at least 20% below, the breaking load (54) of the tool (18). The control device (20) turns off the spindle motor (14) when the output signal (26) of the spindle load detection device (24) exceeds the threshold value (50).

A method for forming semiconductor devices includes: grinding a backside of a semiconductor wafer with a grinding wheel during a first time interval, wherein the grinding wheel is forward moved during the first time interval, wherein a plurality of semiconductor devices are formed on the semiconductor wafer; and polishing the backside of the semiconductor wafer with the grinding wheel in a second time interval, wherein the grinding wheel is backward moved during the second time interval.

An oscillation drive with a drive and with an eccentric coupling drive for converting a rotary motion of the drive into an oscillating rotary motion of a tool spindle about its longitudinal axis is disclosed, wherein the eccentric coupling drive has an eccentric with a first eccentricity that is driven by the drive and that works together with a coupling element that is coupled to the tool spindle in order to convert the motion of the eccentric into an oscillating rotary motion of the tool spindle, wherein the eccentric is coupled to an additional eccentric with a second eccentricity so that the eccentricities are superimposed, wherein the relative position between the eccentric and the additional eccentric is adjustable to at least two different positions in order to change the amplitude of the oscillating motions of the tool spindle.

A mobile machine tool for processing a surface of a workpiece or of a room having a working device which is mobile with respect to a surface of the workpiece or room, which working device includes a tool receptacle for a work tool driven or drivable by a drive motor and/or a coating device having a coating tool for coating the surface, wherein the working device includes a suction device for suctioning the working device onto the surface by means of at least one force component oriented in a normal direction of the surface, wherein the suction device has at least one valve for controlling an intake air flow and/or a negative pressure in a suction region of the working device for suction onto the surface, and wherein the at least one valve has a valve member which is adjustable between at least two valve positions in which a flow cross-section of the valve is different. The suction device includes a suction controller for adjusting the valve member during operation of the work tool or the coating device between its valve positions depending on at least one physical variable.

Provided are a silver article formed using pure silver, which has high Vickers hardness and prohibits the occurrence of metal corrosion and the occurrence of discoloration; and its method. Disclosed are a silver article and its method, wherein the Vickers hardness is adjusted to 60 HV or higher, and when the height of the peak of 2θ=38°±0.2° by an XRD is designated as h1, and that of 2θ=44°±0.4° is designated as h2, h2/h1 is adjusted to 0.2 or greater.

A method of grinding or turning a workpiece, such as a bearing workpiece, involves several steps. One step includes locating the bearing workpiece on a chuck with an axis of rotation of the chuck positioned off-center relative to an axis of the bearing workpiece. Another step includes determining an offset between the chuck's axis of rotation and the bearing workpiece's axis based on the off-center position between the chuck's axis of rotation and the bearing workpiece's axis. Yet another step includes determining a path of engagement of a grinding wheel relative to the bearing workpiece based on the offset previously determined between the chuck's axis of rotation and the bearing workpiece's axis.