A portable booth assembly for receiving a work piece to facilitate working on a work area of the work piece including a housing and an inner core disposed within an interior area of the housing is provided. The portable booth assembly includes an aperture that is formed in the housing and the inner core. The aperture is configured to receive the work piece. The inner core defining the aperture is configured to be supported by the work piece if the work piece is large, or support the work piece if the work piece is small, and isolate the work area within the portable booth assembly. The portable booth assembly further includes a cut out formed in the housing. The cut out is configured to enable access to the work area for working on the work area.

A method for collecting an abrasive from an abrasive slurry which has been used for polishing an object including silicon as a main component includes: (i) adding a solvent to the abrasive slurry; (ii) dissolving particles of the polished object among components of the polished object contained in the abrasive slurry; and (iii) filtering the abrasive slurry to collect the abrasive, in which the steps (i) to (iii) are carried out without a pH adjuster to remove components of the polished object to collect the abrasive.

A method for collecting an abrasive from an abrasive slurry which has been used for polishing an object including silicon as a main component includes: (i) adding a solvent to the abrasive slurry; (ii) dissolving particles of the polished object among components of the polished object contained in the abrasive slurry; and (iii) filtering the abrasive slurry to collect the abrasive, in which the steps (i) to (iii) are carried out without a pH adjuster to remove components of the polished object to collect the abrasive.

A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. The rotary joint has a communication channel by which the first suction channel and the second suction channel are held in fluid communication with at least a suction source.

A conditioner for filtering and drying recyclable abrasive media, such as steel grit, garnet, or other abrasive media used for abrasive blasting operations for steel structures, such as bridges, tanks, and marine vessels that are being repainted. The conditioner may include a pre-classifier (e.g., a trommel) to separate or filter the abrasive media from larger debris that may be vacuumed with the abrasive media during resurfacing operations. A dryer may use radiation elements (e.g., infrared (IR) lamps) positioned above a conveyor (e.g., vibration tray) that moves the abrasive media beneath the radiation elements. Vacuum airflow may bypass the dryer except for a portion of the vacuum airflow used to remove moisture from the dryer while drying the abrasive media. The conditioner may have a drying portion or the entirety under negative pressures.

A conditioner for filtering and drying recyclable abrasive media, such as steel grit, garnet, or other abrasive media used for abrasive blasting operations for steel structures, such as bridges, tanks, and marine vessels that are being repainted. The conditioner may include a pre-classifier (e.g., a trommel) to separate or filter the abrasive media from larger debris that may be vacuumed with the abrasive media during resurfacing operations. A dryer may use radiation elements (e.g., infrared (IR) lamps) positioned above a conveyor (e.g., vibration tray) that moves the abrasive media beneath the radiation elements. Vacuum airflow may bypass the dryer except for a portion of the vacuum airflow used to remove moisture from the dryer while drying the abrasive media. The conditioner may have a drying portion or the entirety under negative pressures.

An apparatus for removing an abrasive element having a perimeter edge delimiting an abrasive surface in a machine for finishing surfaces comprising a support body for removably engaging the abrasive element. The support body and the abrasive element are, respectively, provided, at respective engagement surfaces of first and second engagement members configured to move, from an engagement configuration to a disengagement configuration, and vice versa. A displacement device is, furthermore, provided to move the support body in the space according to at least 1 degree of freedom. A removal group is, furthermore, provided comprising at least a removal member adapted to rotate about a rotation axis and provided with a removal surface. This is adapted to engage the second engagement members to cause the first and second engagement members to move from the engagement configuration to the disengagement configuration.

A method for recycling waste water containing slurry from a semiconductor treatment process; including: Filtration in which waste water containing the fresh slurry is continuously introduced into a circulation tank, during which time the mixed waste water is continuously extracted from the circulation tank, the extracted waste water is guided through an ultrafilter device and is concentrated by removing the fluid to form concentrated waste water and the concentrated waste water is introduced into the circulation tank and mixed with the contents of the circulation tank; and concentration in which the addition of fresh waste water to the circulation tank is essentially stopped when the mixed waste water is continuously extracted from the circulation tank, said extracted mixed water waster being introduced through the ultrafilter device and is concentrated by removing the fluid to form concentrated waste water and the concentrated waste water is introduced into the circulation tank.

A method for recycling waste water containing slurry from a semiconductor treatment process; including: Filtration in which waste water containing the fresh slurry is continuously introduced into a circulation tank, during which time the mixed waste water is continuously extracted from the circulation tank, the extracted waste water is guided through an ultrafilter device and is concentrated by removing the fluid to form concentrated waste water and the concentrated waste water is introduced into the circulation tank and mixed with the contents of the circulation tank; and concentration in which the addition of fresh waste water to the circulation tank is essentially stopped when the mixed waste water is continuously extracted from the circulation tank, said extracted mixed water waster being introduced through the ultrafilter device and is concentrated by removing the fluid to form concentrated waste water and the concentrated waste water is introduced into the circulation tank.

Disclosed is an apparatus and method for processing polishing slurry. The apparatus has a filtration unit, a permeation unit, and a control unit. A transfer pipeline connects the filtration and permeation units. The control unit, which consists primarily of electronic circuits, manages both units. The filtration unit is used to remove multiple first particles larger than a first dimension from the slurry and to transfers the filtered slurry to the permeation unit. The permeation unit is used to remove at least a portion of the second particles that are smaller than a second dimension. This process results in a polishing slurry with a more uniform particle size distribution.