A display panel according to the present invention includes a first substrate and a second substrate which are arranged opposite to each other, and an outer surface of the second substrate includes a display region and a border region surrounding the display region. Wherein, the display panel further includes a plurality of light guides provided on the outer surface of the second substrate, and the light guides include first light guides, which are provided at edges of the display region so as to guide light emitted from the edges of the display region towards an upside of at least a part of the border region. Since the first light guides guide light emitted from the edges of the display region towards an upside of at least a part of the border region, display with a narrow border or even display without a border can be achieved.

Provided is a 3DIC structure including first and second IC chips and connectors. The first IC chip includes a first metallization structure, a first optical active component, and a first photonic interconnection layer. The second IC chip includes a second metallization structure, a second optical active component, and a second photonic interconnection layer. The first and second IC chips are bonded via the first and second photonic interconnection layers. The first optical active component is between the first photonic interconnection layer and the first metallization structure. The first optical active component and the first metallization structure are bonded to each other. The second optical active component is between the second photonic interconnection layer and the second metallization structure. The second optical active component and the second metallization structure are bonded to each other.

An optical sensor module is disclosed. The optical sensor module can include a housing comprising an air cavity. An optical emitter die can be disposed in the air cavity of the housing. A top surface of the optical emitter die can face a first side of the housing, the optical emitter die configured to emit light towards the first side of the housing. An optical sensor die can be disposed in the air cavity of the housing adjacent the optical emitter die. The optical sensor die can be spaced from the optical emitter die by a lateral distance. A top surface of the optical sensor die can face the first side of the housing. There may be no septum between the optical sensor die and the optical emitter die that optically separates the optical sensor die and the optical emitter die.

A solar panel system is disclosed which provides highly efficient solar conversion which is operable during the day, night, and low level sunlight. The system uses back illuminated electron multiplying charged coupled devices (bi-emccds) to efficiently convert sunlight signals into usable solar power. In an exemplary embodiment, the bi-emccds may be arranged according to a Fibonacci sequence to maximize the available sunlight incident on the panel.

Image display devices with suppressed generation of diffracted light are disclosed. In one example, an image display device includes pixels arranged two-dimensionally, and a pixel region including some of the pixels that has transmissive windows that transmit visible light and have different sizes. The pixels include a self-light-emitting element, a light emitting region in which light is emitted by the self-light-emitting element, and a non-light emitting region including the transmissive window.

An optical sensing apparatus, a method for manufacturing an optical sensing apparatus, and an electronic device can improve the optical detection accuracy and user experience. The optical sensing apparatus includes: a sensor chip configured to receive an incident light signal for optical detection; and a transparent conductive layer provided above the sensor chip and connected to a grounding terminal of the sensor chip, where the transparent conductive layer is configured to be coupled with an electromagnetic wave in an environment, and transmit the electromagnetic wave to the grounding terminal of the sensor chip.

According to an aspect, a detection device includes: a plurality of photodiodes arranged on a substrate; a front light including a light guide plate disposed so as to overlap the photodiodes and a light source configured to emit light to a side surface of the light guide plate; and an optical filter layer provided between the photodiodes and the light guide plate of the front light. The optical filter layer includes a plurality of light guide paths that at least partially overlap the photodiodes, and a light-blocking portion having higher absorptance of the light than the light guide paths. The detection device includes a reflective layer that is provided between the light guide plate and the optical filter layer and overlaps the light-blocking portion of the optical filter layer.

An apparatus and method for the localized capture, storage and specialized use of power generated from natural sources, such as solar power or hydropower. The apparatus can be used, for example, on a deck or a side of a marine vessel, or on a land-based structure, where there is a requirement for power generation and storage

In accordance with an embodiment, a semiconductor device includes: a radiator comprising a radiation layer configured to radiate an electromagnetic wave; a detector comprising a detection layer configured to detect the electromagnetic wave; a substrate; and an interface layer arranged between the radiator or the detector and the substrate, where a thermal conductivity of the radiator or the detector is different from a thermal conductivity of the interface layer.

Provided is a silicone gel composition which contains, as a base polymer, a silicon-bonded alkenyl group-containing straight-chain or branched-chain organopolysiloxane containing a specific amount of a diphenylsiloxane unit in the molecule, and contains a specific blending amount of a cross-linking agent having a specific molecular structure, a platinum-based curing catalyst, a hydrophobized fine silica powder, and an isocyanuric acid derivative having a specific molecular structure having at least two trialkoxysilyl-substituted alkyl groups in the molecule, wherein the curing of the silicone gel composition gives a silicone gel cured product having a penetration of 10-100 as specified in JIS K6249. Since the silicone gel composition exhibits little spread when applied to substrates of various electronic boards such as control circuit boards, little change in shape before and after thermal curing, and little change in the penetration of the cured product under high temperature conditions, a specific semiconductor element such as a photocoupler mounted on a control board can be exclusively coated (so-called spot potting) and the element and the like can be sealed in a desired shape. Thus, the silicone gel composition is useful as a silicone gel composition for sealing a photocoupler and the like.