Systems and methods are provided for wirelessly transferring power to a multi-junction photovoltaic cell of a space apparatus via a light emission system. The light emission system uses multiple lasers emitting different wavelengths and/or photon energies to produce electron-hole pairs in each layer of the multi-junction photovoltaic cell to prompt power generation by the multi-junction photovoltaic cell. The light emission system may be located on Earth or on another space apparatus. The multi-junction photovoltaic cell can convert sunlight and the light emitted by the light emission system into electrical energy.

A light-emitting device includes a waveguide-type light-emitting element formed on a cladding layer, a core formed on the cladding layer and constituting a port opposite to an output port of the light-emitting element, and a light absorption layer formed on the core in contact therewith. The core may be composed of a III-V compound semiconductor such as InP. The core is composed of a III-V compound semiconductor capable of guiding (transmitting) light (laser light) output from the light-emitting element. The light absorption layer is composed of a III-V compound semiconductor having a refractive index higher than that of the core, such as InGaAs. The III-V compound semiconductor having a higher refractive index has an absorption coefficient for light (light output from the light-emitting element) transmitted through the core.

A sensor device includes a semiconductor platform with a sensor element, a top casing element and a bottom casing element. The top casing element contacts the bottom casing element to form a rigid casing defining a cavity, and the top casing element furthermore contacts the semiconductor platform so that the semiconductor platform is positioned in the cavity and so that a selected region of the semiconductor platform, including the sensor element is contactable by the environment. Furthermore, the top casing element, the bottom casing element, and the selected region of the semiconductor platform are arranged so that the cavity is hermetically sealed.

The present invention provides an optical semiconductor device for improving minimization and increase of detection precision. An optical semiconductor device A1 of the present invention includes: a substrate 1, including a semiconductor material, and including a main surface 111 and a back surface 112; a semiconductor light-emitting element 7A at the substrate; a semiconductor light-receiving element 7B at the substrate; a conductive layer 3, conducting the semiconductor light-emitting element 7A and the semiconductor light-receiving element 7B; and an insulating layer 2 between at least a portion of the conductive layer 3 and the substrate; wherein the substrate 1 includes a recess 14 recessed from the main surface 111 and including a bottom surface 142A of a light-emitting side recess where the semiconductor light-emitting element 7A is disposed, and a bottom surface 142B of a light-receiving side recess where the semiconductor light-receiving element 7B is disposed; a light-emitting side transparent portion 18A for light from the semiconductor light-emitting element 7A to pass through the bottom surface 142A of the light-emitting side recess to the back surface 112; and a light-receiving side transparent portion 18B for light from the back surface 112 to pass through the bottom surface 142B of the light-receiving side recess to the semiconductor light-receiving element 7B.

A filter member includes a first lead terminal, an optical filter, and a first mold member, and a light incidence surface and a light emission surface of the optical filter is exposed from the first mold member. A sensor member includes an IR sensor element, a second lead terminal and a second mold member. A light-receiving surface of the IR sensor element is exposed from the second mole member. The filter member is disposed on the sensor member so that the light emission surface of the optical filter faces the light-receiving surface of the IR sensor element in the sensor member.

In a ranging device, a controlling unit alternatively switches orders in time series of a first pulse-transfer-signal and a second pulse-transfer-signal per frame term and outputs the first and second pulse-transfer-signals. Furthermore, an arithmetic unit arithmetizes a distance to an object based on total quantities of charges of signal charges, in two frame term consecutive in the time series, accumulated in a first charge-accumulating region and a second charge-accumulating region in accordance with the first and second pulse-transfer-signals having an identical phase.

There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region

A sensor-in-package device, a process for fabricating a hermetically-sealed sensor-in-package device, and a process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat that employ example techniques in accordance with the present disclosure are described herein. In an implementation, the sensor-in-package device includes a substrate; at least one thermopile, at least one photodetector, at least one light-emitting diode, an ultraviolet light sensor, and a pre-assembled hat disposed on the first side of the substrate, where the pre-assembled hat includes a body; a first lid; and a second lid; where the body, the substrate, and the first lid define a thermopile cavity that houses the at least one thermopile, and where the body, the substrate, and the second lid define an optical cavity that houses at least one of the at least one photodetector, the at least one light-emitting diode, or the ultraviolet light sensor.

Compact systems, compact devices and methods are provided to sense changes in luminescence due to environmental influences on a luminescent material. Such systems, devices and methods may be implemented in a compact device, e.g., an integrated circuit package, which may be incorporated into or attached to a device, such as a smartphone, watch, flashlight, vehicle, etc. The systems, devices, and methods described herein are useful in sensing luminescence, as well as changes in luminescence that are indicative of environmental influences, such as the presence and concentration of a gas or chemical, ambient temperature, pressure, light, etc., in an area surrounding a luminescent material included in a compact device.

An optoelectronic device with a semiconductor body that includes: a bottom cathode structure, formed by a bottom semiconductor material, and having a first type of conductivity; and a buffer region, arranged on the bottom cathode structure and formed by a buffer semiconductor material different from the bottom semiconductor material. The optoelectronic device further includes: a receiver comprising a receiver anode region, which is formed by the bottom semiconductor material, has a second type of conductivity, and extends in the bottom cathode structure; and an emitter, which is arranged on the buffer region and includes a semiconductor junction formed at least in part by a top semiconductor material, different from the bottom semiconductor material.