A multiple-atom silicon quantum dot is provided that includes multiple dangling bonds on an otherwise H-terminated silicon surface, each dangling bonds having one of three ionization states of +1, 0 or 1 and corresponding respectively to 0, 1, or 2 electrons in a dangling bond state. The dangling bonds together in close proximity and having the dangling bond states energetically in the silicon band gap with selective control of the ionization state of one of the dangling bonds. A new class of electronics elements is provided through the inclusion of at least one input and at least one output to the multiple dangling bonds. Selective modification or creation of a dangling bond is also detailed.

A non-Boolean analog system includes a first Mott memristor having a first value of a characteristic, and a second Mott memristor having a second value of the characteristic different than the first value. The system includes a resistance in series with the first and second Mott memristors to form a network having a capacitance and that is operable as a relaxation oscillator. Responsive to electrical excitation, a temperature of the network operating an environment including ambient thermal noise settles at an equilibrium corresponding to a global minimum that is a maximally optimal global solution to a global optimization problem to which the network corresponds.

Subject matter disclosed herein may relate to programmable fabrics including correlated electron switch devices.

A first aspect provides a topological quantum computing device comprising a network of semiconductor-superconductor nanowires, each nanowire comprising a length of semiconductor formed over a substrate and a coating of superconductor formed over at least part of the semiconductor; wherein at least some of the nanowires further comprise a coating of ferromagnetic insulator disposed over at least part of the semiconductor. A second aspect provides a method of fabricating a quantum or spintronic device comprising a heterostructure of semiconductor and ferromagnetic insulator, by: forming a portion of the semiconductor over a substrate in a first vacuum chamber, and growing a coating of the ferromagnetic insulator on the semiconductor by epitaxy in a second vacuum chamber connected to the first vacuum chamber by a vacuum tunnel, wherein the semiconductor comprises InAs and the ferromagnetic insulator comprises EuS.

Fabricating a steep-switch transistor includes receiving a semiconductor structure including a substrate, a fin disposed on the substrate, a plurality of source/drains disposed on the substrate adjacent to the fin, a gate disposed upon the fin, a cap disposed on the gate, and a plurality of trenches, each trench extending to a corresponding one of the plurality of source/drains. A trench contact is formed in each of the trenches in contact with the corresponding source/drain. A recess is formed in a portion of each trench contact below a top surface of the cap. A bi-stable resistive system (BRS) material is deposited in each recess in contact with the portion of the trench contact. A source/drain contact is formed upon the BRS material, a portion of the trench contact, the BRS material, and a portion of the source/drain contact forming a reversible switch for each of the corresponding source/drains.

A method of operating a device includes: (1) providing a film of a semimetal in a first topological phase; and (2) inducing interlayer shear oscillation of the semimetal within the film, wherein the interlayer shear oscillation induces the semimetal to transition to a different, second topological phase.

Subject matter disclosed herein may relate to fabrication of correlated electron materials used, for example, to perform a switching function. In embodiments, a correlated electron material may be doped using dopant species derived from one or more precursors utilized to fabricate nearby structures such as, for example, a conductive substrate or a conductive overlay.

The present application discloses a topological insulator structure including an insulating substrate, a topological insulator quantum well film, and an insulating protective layer. The topological insulator quantum well film and the insulating protective layer are orderly stacked on a surface of the insulating substrate, forming a heterojunction structure. The insulating protective layer is selected from the group consisting of the wurtzite-structured CdSe, the sphalerite-structured ZnTe, the sphalerite-structured CdSe, the sphalerite-structured CdTe, the sphalerite-structured HgSe, the sphalerite-structured HgTe, and combinations thereof. The present application also discloses a method for making the topological insulator structure.

The present application discloses a multi-channel topological insulator structure, including an insulating substrate, multiple topological insulator quantum well films, and multiple insulating interlayers. The topological insulator quantum well films and the insulating interlayers are alternately stacked on a surface of the insulating substrate. Two adjacent topological insulator quantum well films are separated by one insulating interlayer. The present application also discloses a method for making the multi-channel topological insulator structure and an electrical device.

A system for applying orbital angular momentum (OAM) to electrons of a semiconductor material comprises a light source generator for generating a plane wave light beam. Orbital angular momentum (OAM) processing circuitry applies at least one orbital angular momentum to the plan wave light beam to generate an OAM light beam. The OAM processing circuitry controls transitions of electrons between quantized states within the semiconductor material to perform quantum entanglement within the semiconductor material responsive to the at least one orbital angular momentum applied to the plane wave light beam. A transmitter transmits the OAM light beam at the semiconductor material to induce the transitions of the electrons between the quantize states and perform the quantum entanglement within the semiconductor material.