A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage, monitoring inventory, promoting use of personal protective equipment, and other purposes.

A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage, monitoring inventory, promoting use of personal protective equipment, and other purposes.

A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage, monitoring inventory, promoting use of personal protective equipment, and other purposes.

The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.

A parting/grooving insert and a method of grinding a parting/grooving insert including rotating a plane grinding surface having a normal vector parallel to the axis of rotation and a tangential direction of rotation; providing a parting/grooving insert including a rake surface, a main clearance surface, and a main cutting edge formed between the rake and main clearance surfaces; orienting/positioning the insert relative to the grinding surface, such that the main clearance surface is parallel to the grinding surface, the normal vector of the main cutting edge being in the plane of the main clearance surface and with a vector component in the direction of rotation forming an angle to the tangential direction of rotation at the insert of at least 20 degrees from parallel orientation; and grinding the main clearance surface to provide grinding marks having an angle to the normal vector of the main cutting edge corresponding to the angle to the tangential direction of rotation.

A pad conditioner includes a carrier, at least one abrasive element, and a spacer. The carrier includes a surface with an exposed region and a plurality of mounting regions. The abrasive element is disposed on the mounting region of the carrier, and at least one abrasive element has a working surface including a plurality of features each having a distal end. The spacer is disposed on the surface of the carrier and covers at least a portion of the exposed region. The spacer has a first surface and a second surface, wherein the second surface is opposed to the first surface and adjacent to the surface of the carrier. The distance D1 between the distal end of the highest feature of the at least one abrasive element and the surface of the carrier is greater than the distance D2 between the first surface of the spacer and the surface of the carrier.

Provided are a roll polishing rotary grinding stone and a roll polishing device and method which are configured to stably perform roll polishing without making the surface roughness of a surface to be processed non-uniform by preventing polishing debris to be generated during polishing from being accumulated in a recess at a center of a polishing surface of the roll polishing rotary grinding stone body. The roll polishing rotary grinding stone includes: a rotary grinding stone body having a rotary shaft mounted on a back end face and a polishing surface formed on a front end face; and a recess formed at a center of the front end face of the rotary grinding stone body, the roll polishing rotary grinding stone being configured to perform vertical polishing with respect to a surface of a roll by bringing the polishing surface into contact with the surface of the roll, in which the recess is formed into a tapered recess in which an inner peripheral surface of the recess is increased in diameter from the back end face of the rotary grinding stone body toward the front end face of the rotary grinding stone body.

Through the following steps (a) and (b), the side surface of a grinding object is ground to manufacture a ground product having a smaller diameter than that of the grinding object. In the step (a), a cup type grinding stone is disposed such that the central axis is parallel offset from a state where the central axis is orthogonal to the central axis of the grinding object. In the step (b), the cup type grinding stone is axially rotated so that the cup type grinding stone grinds the side surface of the grinding object while the grinding object is axially rotated and moved in the axial direction. Thereby, the outer peripheral surface of the grinding object is finish-ground by the bottom grinding stone portion of the cup type grinding stone while the grinding object is rough-ground by the side grinding stone portion to obtain a ground product.

The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.

An epoxy-functional coupling agent comprises a reaction product of a polyepoxide and an aminosilane represented N by the formula HNR.sup.1R.sup.2. R.sup.1 represents ZSiL.sub.3 and R.sup.2 represents ZSiL.sub.3 or an alkyl group having from 1 to 4 carbon atoms. Each Z independently represents a divalent linking group having from 1 to 18 carbon atoms, and each L independently represents a hydrolyzable group. The coupling agent may be used to treat a substrate such as an abrasive particle, which may be included in a resin bond abrasive article.