A double-disc straight groove cylindrical-component surface grinding disc, includes a first grinding disc and a second grinding disc, rotating relative to each other; the the first grinding disc's working face is planar; the second grinding disc's surface, opposite the first grinding disc, includes a set of radial straight grooves, with groove faces of the straight grooves are the working face of the second grinding disc; the cross-sectional outline of the working face of the second grinding disc is arcuate or V-shaped or is a V-shape having an arc; during grinding, a workpiece spins inside the straight grooves, while under the effect of an advancing apparatus, the workpiece slides in translational motion along the straight grooves. The described grinding disc device has high-volume production capabilities, and the shape accuracy and size consistency of the cylindrical roller's cylindrical surface and the efficiency in machining are improved, and machining cost is reduced.

A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another.

The present disclosure illustrates an eraser wheel assembly structure in which an eraser wheel body is fastened with a shell cover by a fastener, so the eraser wheel body can be driven by the grinding tool to rotate for removing glue. The eraser wheel body is disposed in the shell cover and has a plurality of glue removing blocks. The shell cover has a plurality of positioning studs and configured to respectively insert positioning holes of the eraser wheel body. The shell cover has a blocking wall facing a peripheral edge of the disc-based base and a gap to tolerate a radial extension of the disc-shaped base during operation, so as to prevent the peripheral edge of the disc-shaped base from being escaped from the blocking wall and unable back to its former position because of no gap tolerable for the radial extension of deformed disc-shaped base.

An abrasive article having a plurality of apertures arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, and in particular those patterns described by the Vogel equation. Also, provided is a back-up pad having a spiral or phyllotactic patterns of air flow paths, such as in the form of open channels. The back-up pad can be specifically adapted to correspond with an abrasive article having a non-uniform distribution pattern. Alternatively, the back-up pad can be used in conjunction with conventional perforated coated abrasives. The abrasive articles having a non-uniform distribution pattern of apertures and the back-up pads can be used together as an abrasive system.

The present disclosure illustrates an eraser wheel assembly structure in which an eraser wheel body is fastened with a shell cover by a fastener, so the eraser wheel body can be driven by the grinding tool to rotate for removing glue. The eraser wheel body is disposed in the shell cover and has a plurality of glue removing blocks. The shell cover has a plurality of positioning studs and configured to respectively insert positioning holes of the eraser wheel body. The shell cover has a blocking wall facing a peripheral edge of the disc-based base and a gap to tolerate a radial extension of the disc-shaped base during operation, so as to prevent the peripheral edge of the disc-shaped base from being escaped from the blocking wall and unable back to its former position because of no gap tolerable for the radial extension of deformed disc-shaped base.

A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another. In some embodiments, methods of fabricating a grinding tool are also described.

An abrasive article having a plurality of apertures arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, and in particular those patterns described by the Vogel equation. Also, provided is a back-up pad having a spiral or phyllotactic patterns of air flow paths, such as in the form of open channels. The back-up pad can be specifically adapted to correspond with an abrasive article having a non-uniform distribution pattern. Alternatively, the back-up pad can be used in conjunction with conventional perforated coated abrasives. The abrasive articles having a non-uniform distribution pattern of apertures and the back-up pads can be used together as an abrasive system.

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

A CMP pad conditioner for conditioning a polishing pad. Various embodiments of the disclosure include a plurality of elongated protrusions work a conditioned surface of a polishing pad at a variety of attack angles as the CMP pad conditioner engages the polishing pad. Because of the elongated geometry of the protrusions, the variety of attack angles will tend to flex the conditioned face of the polishing pad in a multifaceted manner. We have found that such multifaceted manipulation of the conditioned face enhances the cut rate of the conditioner assembly and the removal of debris in the pores of the polishing pad that are residual from the CMP process, to better open the pores of the polishing pad and to better maintain the removal rate in the CMP process.