A reservoir computing system comprising an input layer configured to receive input data from a signal propagation channel and to convert the input data into fixed input values, a reservoir configured to receive the fixed input values and generate a set of trained output values, and an output layer configured to receive the set of trained output values and generate a probability distribution based on the set of trained output values. The reservoir is comprised of a plurality of integrated oscillator components coupled in a fixed, random network, wherein each of the oscillator components is comprised of a device characterized by a current-voltage curve that comprises a region of non-linear behavior, such as a negative differential resistance (NDR) behavior.

A computing reservoir comprised of a plurality of oscillator components configured to receive input data and produce one or more output signals, and a feedback loop coupled to an output of the network, wherein the feedback loop is comprised of circuitry configured to establish and maintain an optimal operating point of the network based upon the output of the network.

An integrated neuron circuit structure comprising at least one thin-film resistor, one Metal Insulator Metal capacitor and one Negative Differential Resistance device.

Structures for a non-volatile memory and methods of forming and using such structures. A resistive memory element includes a first electrode, a second electrode, and a switching layer arranged between the first electrode and the second electrode. A transistor includes a drain coupled with the second electrode. The switching layer has a top surface, and the first electrode is arranged on a first portion of the top surface of the switching layer. A hardmask, which is composed of a dielectric material, is arranged on a second portion of the top surface of the switching layer.

A phase change memory (PCM) cell in an integrated circuit and a method of fabricating it involve depositing a layer of PCM material on a surface of a dielectric, and patterning the layer of PCM material into a plurality of PCM blocks. Heater material is formed on both sidewalls of each of the plurality of the PCM blocks to form a plurality of PCM cells. Each of the plurality of the PCM blocks and the heater material on both the sidewalls represents a PCM cell. An additional layer of the dielectric is deposited above and between the plurality of the PCM cells, and trenches are formed in the dielectric. Trenches are formed in contact with each side of each of the plurality of the PCM cells. Metal is deposited in each of the trenches. Current flow in the metal heats the heater material of one of the PCM cells.

In fabricating a radio frequency (RF) switch, a phase-change material (PCM) and a heating element, underlying an active segment of the PCM and extending outward and transverse to the PCM, are provided. Lower portions of PCM contacts for connection to passive segments of the PCM are formed, wherein the passive segments extend outward and are transverse to the heating element. Upper portions of the PCM contacts are formed from a lower interconnect metal. Heating element contacts are formed cross-wise to the PCM contacts. The heating element contacts can comprise a top interconnect metal directly connecting with terminal segments of the heating element. The heating element contacts can comprise a top interconnect metal and intermediate metal segments for connecting with the terminal segments of the heating element.

A semiconductor memory device may include: a plurality of row lines extended in parallel to each other in a first horizontal direction; a plurality of column line stacks extended in parallel to each other in a second horizontal direction perpendicular to the first horizontal direction, wherein each of the plurality of column line stacks includes a plurality of column lines extended in parallel to each other in a vertical direction; and a plurality of cell pillars that pass vertically through the column lines of the column line stacks, each of the plurality of cell pillars has a first end and a second end, wherein the first ends of the plurality of cell pillars are electrically coupled to the plurality of row lines, and the second ends of the plurality of cell pillars are floated. Each cell pillar includes a core and variable resistance memory layers.

A resonant tunneling device includes a first two-dimensional semiconductor layer including a first two-dimensional semiconductor material, a first insulating layer on the first two-dimensional semiconductor layer; and a second two-dimensional semiconductor layer on the first insulating layer and including a second two-dimensional semiconductor material of a same kind as the first two-dimensional semiconductor material.

A control apparatus comprises a microcontroller, an auxiliary circuit, a delay module and a logical circuit; the microcontroller is connected to a first input end of the logical circuit via the auxiliary circuit and connected to a second input end of the logical circuit via the delay module, and an output end of the logical circuit is connected to a device to be controlled; if the microcontroller is reset in a process of outputting the closing control signal, a delay disabling signal becomes invalid, the delay module is enabled to output the closing control signal within a preset delay time, wherein the delay time is greater than or equal to a reset time. A power supply system is also provided to avoid a risk that an automobile suddenly loses power due to unexpected reset of the microcontroller.

In fabricating a radio frequency (RF) switch, a phase-change material (PCM) and a heating element, underlying an active segment of the PCM and extending outward and transverse to the PCM, are provided. Lower portions of PCM contacts for connection to passive segments of the PCM are formed, wherein the passive segments extend outward and are transverse to the heating element. Upper portions of the PCM contacts are formed from a lower interconnect metal. Heating element contacts are formed cross-wise to the PCM contacts. The heating element contacts can comprise a top interconnect metal directly connecting with terminal segments of the heating element. The heating element contacts can comprise a top interconnect metal and intermediate metal segments for connecting with the terminal segments of the heating element.